MT48LC4M16A2P-6 IT:G

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 283 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M16A2P-6 IT:G – IC DRAM 64MBIT PAR 54TSOP II

The MT48LC4M16A2P-6 IT:G is a 64 Mbit synchronous DRAM (SDRAM) organized as 4M × 16 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous operation with internal pipelining and bank architecture to support high-throughput, burst-oriented memory access.

Designed for board-level memory expansion in systems requiring industrial temperature operation and 3.0–3.6 V supply compatibility, the device offers fast access times and standard SDRAM features for embedded and industrial designs.

Key Features

  • Core / Architecture  4M × 16 organization with four internal banks enabling hidden row access and concurrent operations to improve effective throughput.
  • Memory  64 Mbit SDRAM capacity supporting programmable burst lengths of 1, 2, 4, 8 or full page and a 4,096-cycle refresh scheme (64 ms refresh period).
  • Performance & Timing  Clock frequency specified at 167 MHz with an access time of 5.5 ns and a write cycle time (word page) of 12 ns for low-latency data transfers.
  • System Interface  Parallel SDRAM interface with LVTTL-compatible inputs/outputs and fully synchronous signaling registered on the positive clock edge.
  • Power  Single-supply operation across 3.0 V–3.6 V supporting typical +3.3 V systems.
  • Low-power & Refresh Modes  Standard and low-power self-refresh modes plus auto refresh, auto precharge and concurrent auto precharge options for simplified power and refresh management.
  • Package  54-pin TSOP II (0.400", 10.16 mm width) surface-mount package for compact board-level integration.
  • Temperature Range  Industrial-grade operating temperature from –40 °C to +85 °C (TA) for use in temperature-demanding environments.
  • Standards Compatibility  Documented PC66-, PC100- and PC133-compliant options and internal timing options noted in the datasheet.

Typical Applications

  • Industrial Systems  Industrial operating temperature range (–40 °C to +85 °C) and 3.0–3.6 V operation make the device suitable for industrial control and automation boards requiring robust DRAM.
  • Embedded Board-Level Memory  54-pin TSOP II package and parallel SDRAM interface fit embedded platforms and legacy boards that use parallel SDRAM memory expansion.
  • High‑throughput Buffering  Internal pipelined operation, multi-bank architecture and programmable burst lengths support applications needing burst-oriented buffering and data staging.

Unique Advantages

  • Industrial Temperature Rating: Specified operation from –40 °C to +85 °C enables deployment in temperature-demanding applications without additional thermal qualification steps.
  • Flexible Burst and Refresh Options: Programmable burst lengths with auto and concurrent auto precharge plus standard/low-power self-refresh modes simplify memory control and power management.
  • Fast Access and Cycle Times: 5.5 ns access time and 12 ns write cycle time (word page) provide low-latency data access for performance-sensitive tasks.
  • Standard Voltage Support: 3.0–3.6 V supply range aligns with common +3.3 V system rails for straightforward integration.
  • Compact Board Integration: 54-pin TSOP II package (0.400" / 10.16 mm width) supports dense PCB layouts while providing full parallel SDRAM connectivity.
  • Well-documented SDRAM Feature Set: Fully synchronous operation, LVTTL-compatible I/O and multi-bank organization are specified in the datasheet for predictable system design.

Why Choose IC DRAM 64MBIT PAR 54TSOP II?

The MT48LC4M16A2P-6 IT:G is positioned as a compact, industrial-temperature SDRAM solution for designers requiring a 64 Mbit parallel memory device with predictable timing and standard power rails. Its combination of internal pipelining, programmable burst lengths and self-refresh modes addresses common board-level memory needs where consistent performance and thermal tolerance are required.

This device is suitable for engineers implementing embedded and legacy parallel-SDRAM interfaces who need documented timing, compact TSOP II packaging and a 3.0–3.6 V operating range to simplify integration and maintainable designs over the product lifecycle.

Request a quote or contact sales to discuss pricing, availability and to submit a formal quote request for the MT48LC4M16A2P-6 IT:G.

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