MT48LC4M16A2F4-75:G TR

The MT48LC4M16A2F4-75:G TR is a 64 Mbit volatile SDRAM device organized as 4M × 16 with a parallel memory interface in a 54‑ball VFBGA (8×8 mm) package. It provides fully synchronous SDR SDRAM operation with timing suited to PC100/PC133 clocking and a 133 MHz clock frequency rating.

This device targets systems that require compact, high-speed parallel DRAM with a single 3.3 V supply and commercial temperature operation (0°C to +70°C). Its internal pipelined operation and programmable burst lengths support systems requiring predictable, cycle-aligned memory transfers.

Key Features

• Memory Architecture — 4M × 16 organization delivering 64 Mbit of volatile SDRAM capacity in a parallel x16 configuration.
• SDR SDRAM Core — Fully synchronous operation with all signals registered on the positive edge of the system clock; internal pipelined operation allows column address changes every clock cycle.
• Performance — Clock frequency rated at 133 MHz with an access time of 5.4 ns and typical timing options compliant with PC100/PC133 speed grades.
• Burst and Refresh — Programmable burst lengths (1, 2, 4, 8, or full page) plus auto precharge, auto refresh and self-refresh modes as described in the device family datasheet.
• Power — Single‑rail 3.0 V to 3.6 V supply range supporting standard 3.3 V system rails.
• Package and Mounting — 54‑ball VFBGA (8 mm × 8 mm) package optimized for compact board-level integration; commercial operating temperature range of 0°C to +70°C.
• Timing and Cycle — Write cycle time (word page) specified at 15 ns; timing options include CL and RAS/RP parameters aligned with PC133 performance targets per the datasheet.

Typical Applications

• Parallel SDRAM systems — Drop-in memory for designs using parallel x16 SDRAM interfaces and PC100/PC133 timing.
• Compact board-level memory — Use where a 54‑VFBGA (8×8) footprint and 3.3 V supply are required for space-constrained modules or assemblies.
• Commercial electronic devices — Systems operating in the 0°C to +70°C range that need synchronous DRAM with programmable burst and refresh capabilities.

Unique Advantages

• Direct PC100/PC133 compatibility — Device family support for PC100 and PC133 timing simplifies integration into systems designed around those SDRAM timing standards.
• Synchronous, pipelined operation — Positive-edge clock registration and internal pipelining enable predictable, clock-aligned transfers and rapid column changes.
• Flexible burst control and refresh — Programmable burst lengths and built-in auto/self-refresh modes reduce host refresh management complexity.
• Compact VFBGA package — 54‑ball 8×8 mm VFBGA allows high density placement and a small board footprint for space-limited designs.
• Standard 3.3 V supply — Operates across a 3.0 V to 3.6 V range aligned with common system rails to ease power-supply design.

Why Choose IC DRAM 64MBIT PARALLEL 54VFBGA?

The MT48LC4M16A2F4-75:G TR combines a compact VFBGA package with PC100/PC133‑aligned SDRAM timing and a 4M × 16 architecture to deliver 64 Mbit of synchronous parallel memory suitable for systems requiring predictable timing, programmable bursts and integrated refresh features. Its 3.0 V–3.6 V supply range and commercial temperature rating make it appropriate for general-purpose electronic designs that rely on a 3.3 V memory rail.

This device is well suited for designers needing a verified SDRAM component from the MT48LCxMxA2 device family for board-level memory expansion, legacy parallel-memory interfaces, or compact modules where a 54‑VFBGA footprint and PC133-class timing are required.

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