MT48LC4M16A2P-75 IT:G TR

The MT48LC4M16A2P-75 IT:G TR is a 64 Mbit synchronous DRAM device organized as 4M × 16 with a parallel memory interface in a 54‑pin TSOP II package. It is designed for board‑level memory applications that require PC133‑class SDRAM performance with a single +3.3 V supply and industrial operating range.

This SDRAM supports pipelined, fully synchronous operation with internal bank architecture and programmable burst lengths, making it suitable for systems that need predictable, clocked memory access in a compact TSOP footprint.

Key Features

• Core / Technology Fully synchronous SDRAM with internal pipelined operation and internal banks for hiding row access and precharge.
• Memory Organization 64 Mbit total capacity organized as 4M × 16 across 4 internal banks.
• Performance / Timing PC133‑compliant operation with a 133 MHz clock frequency and –75 timing option (7.5 ns cycle time). Access time is specified as 5.4 ns.
• Programmable Burst and Refresh Supports programmable burst lengths (1, 2, 4, 8, or full page), Auto Precharge (including concurrent auto precharge), Auto Refresh and Self Refresh modes with a 4,096‑cycle refresh count.
• Power and I/O Single +3.3 V (±0.3 V) supply with LVTTL‑compatible inputs and outputs and support for standard and low‑power self‑refresh modes.
• Package 54‑pin TSOP II (0.400", 10.16 mm width) plastic package for board‑level mounting and compact PCB implementations.
• Operating Temperature Industrial temperature range: −40 °C to +85 °C (TA).

Typical Applications

• Industrial Equipment Use as board‑level SDRAM in industrial control and automation systems requiring operation from −40 °C to +85 °C.
• Embedded Systems Provides parallel SDRAM capacity and PC133‑class timing for embedded controllers and processing modules that require deterministic synchronous memory access.
• Legacy and PC‑Class Designs Applicable where PC66/PC100/PC133‑compliant SDRAM is required in a 54‑pin TSOP II form factor.

Unique Advantages

• Clocked, predictable memory behavior: Fully synchronous operation and internal pipelining enable consistent, clock‑edge registered access timing for system designs.
• Flexible burst and refresh options: Programmable burst lengths plus Auto and Self Refresh modes simplify memory management and support varied access patterns.
• Industrial‑grade temperature range: Rated for −40 °C to +85 °C, supporting deployment in temperature‑challenging environments.
• Standard 3.3 V supply: Single +3.3 V (±0.3 V) operation aligns with common system power rails for simplified power design.
• Compact package: 54‑pin TSOP II enables higher density board layouts while maintaining parallel SDRAM connectivity.

Why Choose IC DRAM 64MBIT PAR 54TSOP II?

The MT48LC4M16A2P-75 IT:G TR positions itself as a practical 64 Mbit SDRAM option for designs needing PC133‑class synchronous performance, a parallel interface, and an industrial temperature rating. Its combination of programmable burst modes, internal bank architecture and standard 3.3 V supply makes it suitable for embedded and industrial applications where predictable, clock‑driven memory access is required.

Engineers specifying this device benefit from a compact 54‑pin TSOP II package and the memory organization of 4M × 16 that integrates into existing board‑level SDRAM footprints while supporting standard refresh and low‑power modes for system flexibility.

If you need pricing or availability, request a quote or contact sales to submit a quote for the MT48LC4M16A2P-75 IT:G TR.