MT48LC4M16A2P-75:G TR

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 95 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M16A2P-75:G TR – IC DRAM 64MBIT PAR 54TSOP II

The MT48LC4M16A2P-75:G TR is a 64 Mbit synchronous DRAM (SDRAM) device organized as 4M × 16 with four internal banks and a parallel memory interface. It is supplied in a 54-pin TSOP II (0.400", 10.16 mm width) package and operates from a 3.0 V to 3.6 V supply.

Designed for systems requiring PC66/PC100/PC133-compliant SDRAM timing, the device supports fully synchronous, pipelined operation with programmable burst lengths and auto/precharge/refresh options. Datasheet notes indicate this device is not recommended for new designs.

Key Features

  • Memory Core  64 Mbit SDRAM organized as 4M × 16 with four internal banks and bank addressing via BA0/BA1.
  • Timing and Performance  PC66-, PC100-, and PC133-compliant; 133 MHz clock frequency and a listed access time of 5.4 ns. Internal pipelined operation allows column address changes each clock cycle.
  • Burst and Refresh  Programmable burst lengths of 1, 2, 4, 8 or full page, with Auto Precharge (including concurrent Auto Precharge), Auto Refresh, and standard and low-power Self Refresh modes. 4,096-cycle refresh (64 ms).
  • Interface and I/O  Fully synchronous with all signals registered on the positive edge of the system clock; LVTTL-compatible inputs and outputs.
  • Power  Single +3.3 V ±0.3 V power supply (specified operating range 3.0 V–3.6 V) and support for self-refresh low-power mode.
  • Package and Temperature  54-pin TSOP II (400 mil) package, 10.16 mm width, with commercial operating temperature range 0 °C to +70 °C.
  • Reliability and Compatibility  Options and timing variants documented in the datasheet; device marking and timing options are defined (e.g., -75 timing).

Typical Applications

  • System Memory  Use as parallel SDRAM system memory where a 64 Mbit x16 SDRAM with PC133-compatible timing is required.
  • Buffered Storage  Suitable for designs that need pipelined, burst-capable parallel memory for intermediate buffering and data throughput.
  • Legacy and Retrofit Designs  Appropriate for maintaining or repairing equipment designed around 54-pin TSOP II parallel SDRAM packages and PC133 timing.

Unique Advantages

  • Standards-compatible timing: PC66/PC100/PC133 compliance simplifies integration into systems that expect standard SDRAM timing.
  • Flexible burst operation: Programmable burst lengths (1, 2, 4, 8, full page) enable tailoring transfers for throughput or latency needs.
  • Banked, pipelined architecture: Four internal banks and internal pipelined operation help hide row access/precharge times and support column-address changes every clock cycle.
  • Power management modes: Auto Refresh and both standard and low-power Self Refresh modes provide options for reducing power during idle periods.
  • Footprint for existing designs: 54-pin TSOP II (400 mil) package matches designs using 10.16 mm width TSOP components for straightforward board-level replacement.
  • Commercial temperature range: Specified for 0 °C to +70 °C operation to match typical commercial-grade applications.

Why Choose MT48LC4M16A2P-75:G TR?

This MT48LC4M16A2P-75:G TR SDRAM delivers a compact, standards-aligned 64 Mbit parallel memory option with PC133-capable timing, programmable burst operation, and multiple refresh/power modes. Its 54-pin TSOP II package and 3.0 V–3.6 V supply make it suitable for designs that require a parallel x16 SDRAM footprint and conventional 3.3 V system rails.

Engineers maintaining or upgrading equipment that relies on parallel SDRAM can rely on the device’s documented timing options, banked architecture, and self-refresh capabilities for predictable integration. Refer to the device datasheet for detailed timing and pin-assignment information; note that the datasheet indicates this device is not recommended for new designs.

Request a quote or submit an inquiry to check current availability, pricing, and lead-time for the MT48LC4M16A2P-75:G TR.

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