MT48LC4M16A2P-75 IT:G
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 434 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M16A2P-75 IT:G – IC DRAM 64MBIT PAR 54TSOP II
The MT48LC4M16A2P-75 IT:G is a 64 Mbit synchronous DRAM (SDRAM) organized as 4M × 16 with a parallel memory interface. It is a fully synchronous, pipelined SDRAM device manufactured by Micron Technology Inc., offered in a 54-pin TSOP II package and specified for industrial temperature operation.
Designed for systems that require PC133-class parallel SDRAM storage in a compact 54‑TSOP (0.400", 10.16 mm) footprint, the device targets applications needing 3.3 V class supply operation and industrial ambient temperature range.
Key Features
- Memory Architecture 64 Mbit SDRAM organized as 4M × 16 with four internal banks and parallel DQ lines for byte/word access.
- Performance and Timing PC133-compliant operation with a 133 MHz clock frequency. Timing options include the -75 timing grade (7.5 ns cycle time at CL = 3); access time is listed as 5.4 ns and write cycle time (word/page) is 15 ns.
- Power Supply Single-supply operation at 3.3 V (specified 3.0 V to 3.6 V and documented as +3.3 V ±0.3 V in the datasheet).
- Package and Mounting 54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount board assembly.
- Temperature Range Industrial operating ambient range of −40°C to +85°C (TA), indicated by the IT marking.
- Synchronous and Pipelined Operation Fully synchronous design with all signals registered on the positive clock edge and internal pipelining allowing column address changes every clock cycle.
- Memory Management Features Internal bank architecture for hidden row access/precharge, programmable burst lengths (1, 2, 4, 8, or full page), auto precharge modes including concurrent auto precharge, and auto refresh.
- Refresh and Low-Power Modes Supports standard and low-power self-refresh modes and a 64 ms, 4,096-cycle refresh requirement.
- I/O Compatibility LVTTL-compatible inputs and outputs for interface interoperability with 3.3 V logic systems.
Typical Applications
- Industrial Embedded Systems — Memory expansion for controllers and embedded platforms that require operation across −40°C to +85°C.
- PC133-Class Memory Subsystems — Use in designs targeting PC66/PC100/PC133 timing compatibility where a PC133-capable SDRAM device is required.
- Board-Level DRAM Replacement — Direct replacement or upgrade in products using a 54-pin TSOP II SDRAM footprint and parallel memory interface.
Unique Advantages
- Industrial Temperature Rating: Specified for −40°C to +85°C operation, enabling deployment in temperature-challenging environments.
- PC133 Timing Support: 133 MHz clock capability and -75 timing grade (7.5 ns cycle time at CL = 3) provide compatibility with PC133-class memory systems.
- Compact TSOP II Package: 54-pin TSOP II (0.400") footprint allows high-density board-level integration in space-constrained designs.
- Flexible Burst and Refresh Control: Programmable burst lengths, auto-precharge options and self-refresh modes simplify memory controller design and support power management strategies.
- Single 3.3 V Supply: Operation from a single 3.0 V–3.6 V supply streamlines power rail requirements for 3.3 V logic systems.
- Manufacturer Documentation: Full technical datasheet and device documentation are available from the manufacturer for design validation and integration.
Why Choose IC DRAM 64MBIT PAR 54TSOP II?
The MT48LC4M16A2P-75 IT:G combines a 4M × 16 SDRAM organization with PC133-class timing and industrial temperature specification, offering a compact 54‑pin TSOP II package for board-level memory implementations. Its synchronous, pipelined architecture and internal bank management simplify controller interaction while supporting programmable burst lengths and self-refresh capabilities.
This device is well suited to engineers and procurement teams integrating parallel SDRAM into industrial embedded systems, legacy TSOP-form-factor designs, or any application requiring 64 Mbit of SDRAM in a 3.3 V supply environment with documented timing and thermal specifications from Micron Technology Inc.
Request a quote or contact sales to obtain pricing, lead times, and availability for the MT48LC4M16A2P-75 IT:G.