MT48LC4M16A2P-75 IT:G

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 434 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M16A2P-75 IT:G – IC DRAM 64MBIT PAR 54TSOP II

The MT48LC4M16A2P-75 IT:G is a 64 Mbit synchronous DRAM (SDRAM) organized as 4M × 16 with a parallel memory interface. It is a fully synchronous, pipelined SDRAM device manufactured by Micron Technology Inc., offered in a 54-pin TSOP II package and specified for industrial temperature operation.

Designed for systems that require PC133-class parallel SDRAM storage in a compact 54‑TSOP (0.400", 10.16 mm) footprint, the device targets applications needing 3.3 V class supply operation and industrial ambient temperature range.

Key Features

  • Memory Architecture 64 Mbit SDRAM organized as 4M × 16 with four internal banks and parallel DQ lines for byte/word access.
  • Performance and Timing PC133-compliant operation with a 133 MHz clock frequency. Timing options include the -75 timing grade (7.5 ns cycle time at CL = 3); access time is listed as 5.4 ns and write cycle time (word/page) is 15 ns.
  • Power Supply Single-supply operation at 3.3 V (specified 3.0 V to 3.6 V and documented as +3.3 V ±0.3 V in the datasheet).
  • Package and Mounting 54-pin TSOP II (0.400", 10.16 mm width) plastic package for surface-mount board assembly.
  • Temperature Range Industrial operating ambient range of −40°C to +85°C (TA), indicated by the IT marking.
  • Synchronous and Pipelined Operation Fully synchronous design with all signals registered on the positive clock edge and internal pipelining allowing column address changes every clock cycle.
  • Memory Management Features Internal bank architecture for hidden row access/precharge, programmable burst lengths (1, 2, 4, 8, or full page), auto precharge modes including concurrent auto precharge, and auto refresh.
  • Refresh and Low-Power Modes Supports standard and low-power self-refresh modes and a 64 ms, 4,096-cycle refresh requirement.
  • I/O Compatibility LVTTL-compatible inputs and outputs for interface interoperability with 3.3 V logic systems.

Typical Applications

  • Industrial Embedded Systems — Memory expansion for controllers and embedded platforms that require operation across −40°C to +85°C.
  • PC133-Class Memory Subsystems — Use in designs targeting PC66/PC100/PC133 timing compatibility where a PC133-capable SDRAM device is required.
  • Board-Level DRAM Replacement — Direct replacement or upgrade in products using a 54-pin TSOP II SDRAM footprint and parallel memory interface.

Unique Advantages

  • Industrial Temperature Rating: Specified for −40°C to +85°C operation, enabling deployment in temperature-challenging environments.
  • PC133 Timing Support: 133 MHz clock capability and -75 timing grade (7.5 ns cycle time at CL = 3) provide compatibility with PC133-class memory systems.
  • Compact TSOP II Package: 54-pin TSOP II (0.400") footprint allows high-density board-level integration in space-constrained designs.
  • Flexible Burst and Refresh Control: Programmable burst lengths, auto-precharge options and self-refresh modes simplify memory controller design and support power management strategies.
  • Single 3.3 V Supply: Operation from a single 3.0 V–3.6 V supply streamlines power rail requirements for 3.3 V logic systems.
  • Manufacturer Documentation: Full technical datasheet and device documentation are available from the manufacturer for design validation and integration.

Why Choose IC DRAM 64MBIT PAR 54TSOP II?

The MT48LC4M16A2P-75 IT:G combines a 4M × 16 SDRAM organization with PC133-class timing and industrial temperature specification, offering a compact 54‑pin TSOP II package for board-level memory implementations. Its synchronous, pipelined architecture and internal bank management simplify controller interaction while supporting programmable burst lengths and self-refresh capabilities.

This device is well suited to engineers and procurement teams integrating parallel SDRAM into industrial embedded systems, legacy TSOP-form-factor designs, or any application requiring 64 Mbit of SDRAM in a 3.3 V supply environment with documented timing and thermal specifications from Micron Technology Inc.

Request a quote or contact sales to obtain pricing, lead times, and availability for the MT48LC4M16A2P-75 IT:G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up