MT48LC8M16A2P-6A IT:G

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,493 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC8M16A2P-6A IT:G – IC DRAM 128MBIT PAR 54TSOP II

The MT48LC8M16A2P-6A IT:G is a 128 Mbit SDR SDRAM organized as 8M x 16 with a parallel interface in a 54-pin TSOP II package. It delivers synchronous, pipelined DRAM operation with internal bank management and programmable burst lengths for systems that require compact board-level memory in industrial temperature environments.

Designed for use with a single 3.3 V ±0.3 V power supply, this device supports up to a 167 MHz clock frequency and operates over an ambient temperature range of −40°C to +85°C (TA).

Key Features

  • Memory Architecture  128 Mbit SDRAM organized as 8M × 16 with 4 internal banks for hidden row access and precharge.
  • Synchronous SDRAM Core  Fully synchronous, all signals registered on the positive edge of the system clock; internal pipelined operation allows column address changes every clock cycle.
  • Performance & Timing  Clock frequency up to 167 MHz with an access time listed as 5.4 ns; speed grade -6A corresponds to CL = 3 timing (target 3-3-3).
  • Flexible Burst and Refresh  Programmable burst lengths (1, 2, 4, 8, or full page) plus auto refresh and auto precharge modes; supports 4096-cycle refresh intervals (64 ms commercial/industrial per datasheet).
  • Power  Single supply range 3.0 V to 3.6 V (3.3 V nominal) with support for standard and low-power self-refresh modes noted in the datasheet (low-power not available on AT devices).
  • Package & Mounting  54-pin TSOP II (0.400", 10.16 mm width) surface-mount package for compact PCB implementations.
  • Operating Range  Industrial ambient temperature operation from −40°C to +85°C (TA), indicated by the IT option.
  • Standards & Options  PC100- and PC133-compliant listings and multiple package/timing/revision options documented in the product datasheet.

Typical Applications

  • Embedded systems  Provides board-level 128 Mbit parallel SDRAM for space-constrained embedded designs requiring industrial temperature operation.
  • Industrial control  Suitable where a compact TSOP II memory device with 3.3 V single-supply operation and robust temperature range is required.
  • Legacy parallel-memory systems  Fits designs that utilize parallel SDRAM interfaces and programmable burst lengths for sustained data transfer patterns.

Unique Advantages

  • Industrial temperature capability: Rated for −40°C to +85°C (TA), supporting deployment in temperature-challenging environments.
  • Compact TSOP II package: 54-pin, 0.400" (10.16 mm) width TSOP II package enables higher density board layouts without larger BGA implementations.
  • Synchronous pipelined operation: Fully synchronous design with internal banks and pipelining helps maintain efficient column access and continuous data flow.
  • Flexible timing and burst options: Programmable burst lengths and multiple speed/timing grades (including the -6A 167 MHz grade) allow tuning for system timing requirements.
  • Standard 3.3 V supply: Operates from 3.0 V to 3.6 V, matching common system power rails for straightforward integration.

Why Choose MT48LC8M16A2P-6A IT:G?

The MT48LC8M16A2P-6A IT:G is positioned as a compact, industrial-temperature SDRAM solution for designs that need a synchronous, pipelined parallel DRAM organized as 8M × 16. Its combination of 128 Mbit density, programmable burst lengths, internal bank architecture, and TSOP II packaging makes it a practical choice where board space, single-supply operation, and robust temperature performance are priorities.

This device is suitable for engineers specifying standardized 3.3 V SDRAM with documented speed grades and timing options; the datasheet details multiple package and timing choices to match different system requirements and revisions.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the MT48LC8M16A2P-6A IT:G.

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