MT53E1G64D4SP-046 WT:C TR
| Part Description |
IC DRAM 64GBIT BGA |
|---|---|
| Quantity | 103 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | N/A | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | N/A | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | N/A | Memory Organization | 1G x 64 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of MT53E1G64D4SP-046 WT:C TR – IC DRAM 64GBIT BGA
The MT53E1G64D4SP-046 WT:C TR is a 64 Gbit DRAM device from Micron Technology Inc., implemented in a BGA package. It uses SDRAM - Mobile LPDDR4 technology and is organized as 1G × 64.
This device is intended for applications requiring high-density mobile DRAM in a board-level BGA form factor, offering a standardized memory organization suitable for mobile memory subsystems.
Key Features
- Memory Technology SDRAM - Mobile LPDDR4 technology as specified for the device.
- Memory Size 64 Gbit total memory capacity.
- Memory Organization Organized as 1G × 64.
- Memory Format DRAM device format.
- Package BGA package (as indicated in the product name) for board-level integration.
- Manufacturer Supplied by Micron Technology Inc.
Typical Applications
- Mobile Devices Memory subsystem use in smartphones and tablets that utilize LPDDR4 technology.
- Portable Consumer Electronics High-density DRAM for compact, board-level memory implementations in portable products.
- Memory Subsystems Integration into memory modules and system designs requiring a 1G × 64 DRAM organization.
Unique Advantages
- High-density capacity: 64 Gbit provides significant memory density for space-constrained designs.
- Defined memory organization: 1G × 64 organization aligns with common 64-bit DRAM architectures.
- Mobile LPDDR4 technology: Implemented with SDRAM - Mobile LPDDR4 as the specified technology.
- BGA assembly: BGA package supports compact, board-level integration.
- Established manufacturer: Product is supplied by Micron Technology Inc., a recognized memory component vendor.
Why Choose IC DRAM 64GBIT BGA?
The MT53E1G64D4SP-046 WT:C TR positions itself as a high-density DRAM option using Mobile LPDDR4 SDRAM technology with a 1G × 64 organization, suited for designs that require a 64 Gbit DRAM component in a BGA form factor. Its specification set makes it appropriate for engineers and procurement teams specifying memory for mobile and portable device platforms.
As a Micron Technology Inc. device, it offers a clear, verifiable specification profile for projects that require a defined DRAM capacity, organization, and technology. Use this part when your design calls for a 64 Gbit DRAM in a BGA package implemented with Mobile LPDDR4 technology.
Request a quote or contact sales to obtain pricing and availability for MT53E1G64D4SP-046 WT:C TR.
