N2M400JDB341A3CF
| Part Description |
IC FLASH 256GBIT MMC 100LBGA |
|---|---|
| Quantity | 1,698 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of N2M400JDB341A3CF – IC FLASH 256GBIT MMC 100LBGA
The N2M400JDB341A3CF is a 256 Gbit non-volatile FLASH memory device implemented with NAND technology and presented in a 100-LBGA package. It provides a multi-media card (MMC) memory interface and is organized as 32G x 8, delivering high-density storage in a compact BGA footprint.
With a specified operating voltage range of 2.7 V to 3.6 V and an operating temperature range of -40°C to 85°C (TA), this device targets systems that require reliable, high-capacity non-volatile storage with a defined MMC interface and modest clocking requirements.
Key Features
- Memory Type & Technology Non-volatile FLASH memory using NAND technology for persistent data storage.
- Capacity & Organization 256 Gbit total capacity organized as 32G x 8 to support large data and firmware storage.
- Interface MMC memory interface for system integration where MMC connectivity is required.
- Clock Specified clock frequency of 52 MHz for device timing and interface operation.
- Power Operating supply voltage range of 2.7 V to 3.6 V to match common system power rails.
- Package 100-LBGA package (14×18) for board-level mounting and space-efficient system design.
- Temperature Range Operating temperature specified from -40°C to 85°C (TA) for a range of environmental conditions.
Typical Applications
- Embedded storage Provides 256 Gbit non-volatile NAND flash via an MMC interface for system-level data storage and firmware retention.
- High-capacity data storage Large NAND capacity and 32G x 8 organization support applications requiring substantial onboard memory.
- Firmware and system image storage Compact 100-LBGA packaging and wide voltage range enable integration into space-constrained designs that require reliable non-volatile storage.
Unique Advantages
- High-density storage: 256 Gbit capacity accommodates large data sets and firmware images without external memory expansion.
- Standard MMC interface: MMC connectivity simplifies integration into systems designed to accept MMC memory devices.
- Wide voltage compatibility: 2.7 V to 3.6 V supply range supports common system power rails and simplifies power design.
- Compact BGA package: 100-LBGA (14×18) package minimizes board area while providing a robust mounting solution.
- Extended operating temperature: -40°C to 85°C (TA) specification supports deployment across a range of thermal environments.
Why Choose N2M400JDB341A3CF?
The N2M400JDB341A3CF combines high-capacity 256 Gbit NAND flash with an MMC interface and a compact 100-LBGA package, offering a balanced solution for designs that require substantial non-volatile storage in a small footprint. Its electrical and environmental specifications—including a 2.7 V to 3.6 V supply range and -40°C to 85°C operating temperature—make it suitable for systems that demand predictable performance within those bounds.
This device is well suited for engineers and procurement teams specifying on-board high-density storage where MMC connectivity, defined clocking at 52 MHz, and BGA packaging are primary selection criteria. Its straightforward feature set facilitates integration into designs that prioritize capacity, package efficiency, and standard MMC interface compatibility.
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