A80960JF33
| Part Description |
i960 Microprocessor IC i960® 1 Core, 32-Bit 33MHz 132-CPGA (36.8x36.8) |
|---|---|
| Quantity | 41 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i960 |
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | i960 | Device Package | 132-CPGA (36.8x36.8) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Grade | Commercial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Through Hole | Mounting Type | Through Hole | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 100°C (TC) | Package / Case | 132-BCPGA | ||
| REACH Compliance | REACH not applicable | RoHS Compliance | Not applicable | Speed | 33MHz | ||
| Supplier Device Package | 132-CPGA (36.8×36.8) | Voltage – I/O | 3.3V |
Overview of A80960JF33 – IC MPU I960 33MHz 132-CPGA
The A80960JF33 is a microprocessor based on the i960 core, delivering single-core 32-bit processing at 33 MHz. It is targeted at embedded and commercial systems that require a compact, through-hole 132-CPGA package with DRAM controller support and 3.3 V I/O signaling.
With a supplier device package of 132-CPGA (36.8×36.8 mm), commercial-grade qualification, and an operating range of 0 °C to 100 °C, this device is suitable for a range of embedded applications where a standardized i960 32-bit core is required.
Key Features
- Core The device uses an i960 core with a single 32-bit processing unit running at 33 MHz, providing deterministic single-core performance.
- Memory & Controllers Integrated DRAM controller support simplifies external memory interfacing for system designs requiring external DRAM.
- Voltage I/O 3.3 V I/O voltage compatibility for common embedded signaling levels.
- Package & Mounting 132-CPGA supplier device package (36.8×36.8 mm) with through-hole mounting for robust mechanical attachment and legacy board layouts.
- Grade & Temperature Commercial grade device specified for an operating temperature range of 0 °C to 100 °C.
- Standards Compliance RoHS compliant to support lead-free manufacturing processes.
- Graphics No graphics acceleration—focused on general-purpose embedded processing and control tasks.
Typical Applications
- Embedded control systems Use the A80960JF33 where a single 32-bit i960 core at 33 MHz is required for control and processing tasks.
- Memory-centric designs Designs that require external DRAM support can take advantage of the device's DRAM controller.
- Commercial electronics Suitable for commercial-grade products operating within a 0 °C to 100 °C temperature window and 3.3 V I/O environments.
Unique Advantages
- Established i960 architecture: Provides a predictable single-core 32-bit processing foundation for embedded designs.
- Through-hole 132-CPGA packaging: Offers a robust mechanical mounting option (36.8×36.8 mm) for boards and systems that favor through-hole components.
- DRAM controller integration: Simplifies memory subsystem design by providing controller support for external DRAM.
- 3.3 V I/O compatibility: Aligns with common embedded logic voltages to ease system integration.
- Commercial temperature support: Rated for 0 °C to 100 °C to meet typical commercial application environments.
- RoHS compliant: Supports lead-free assembly and regulatory requirements for many markets.
Why Choose A80960JF33?
The A80960JF33 combines the i960 single 32-bit core running at 33 MHz with a through-hole 132-CPGA package and DRAM controller support, delivering a straightforward, verifiable platform for embedded commercial designs. Its 3.3 V I/O compatibility and RoHS compliance make it suitable for standard embedded system implementations that rely on established component footprints and signaling.
This part is appropriate for engineers and procurement teams seeking a commercially graded i960-based microprocessor with a clear operating temperature range and a supplier device package specification of 132-CPGA (36.8×36.8 mm). It provides a durable mounting option and memory interfacing capability to support continued use in existing and new embedded product lines.
If you would like pricing or availability, request a quote or submit a procurement inquiry and our team will provide a tailored response.

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