A80960HT75

The A80960HT75 is an Intel i960 microprocessor IC featuring a 3-core, 32-bit architecture running at 75 MHz. It integrates an FPU and DRAM controller and is supplied in a 168-CPGA package, making it suitable for embedded system designs that require multi-core 32-bit processing.

Designed for commercial-grade applications, the device provides 3.3 V I/O compatibility and a specified operating temperature range of 0 °C to 85 °C, with a through-hole 168-CPGA (44.45×44.45 mm) package for board-level mounting and thermal/mechanical stability.

Key Features

• Core and Architecture 3-core, 32-bit i960 processor architecture operating at 75 MHz for parallel task execution within embedded platforms.
• Integrated Numeric and Memory Support Integrated floating-point unit (FPU) and DRAM controller to handle compute and memory interfacing needs without external coprocessors.
• Power and I/O 3.3 V I/O voltage compatibility to match common embedded system logic levels and power rails.
• Package and Mounting Supplied in a 168-CPGA (44.45×44.45 mm) / 168-BCPGA package with through-hole mounting for robust board attachment and legacy platform integration.
• Grade and Temperature Commercial grade device rated for operation from 0 °C to 85 °C for standard industrial and commercial environments.

Typical Applications

• Embedded Systems — Multi-core 32-bit processing and integrated FPU/DRAM controller support general embedded computing tasks.
• Legacy and Board-Level Designs — Through-hole 168-CPGA package suits designs that require robust mounting or compatibility with existing board layouts.
• Commercial Electronics — Commercial temperature range and 3.3 V I/O make the part appropriate for a wide range of commercial electronic products.

Unique Advantages

• Multi-Core Processing: Three 32-bit cores provide parallelism for partitioned workloads or concurrent control tasks.
• Integrated FPU: Built-in floating-point unit reduces the need for external numeric coprocessors and simplifies BOM.
• On-Die DRAM Controller: Native DRAM control helps streamline memory subsystem design and reduces external logic.
• 3.3 V I/O Compatibility: Matches common system voltage rails for straightforward integration with standard peripherals and logic.
• Through-Hole 168-CPGA Package: Robust package and mounting style facilitate secure assembly and ease of prototyping or replacement.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployment in typical commercial and light-industrial environments.

Why Choose A80960HT75?

The A80960HT75 positions itself as a compact, integrated solution for embedded designs that require multi-core 32-bit processing with onboard floating-point capability and DRAM support. Its 3.3 V I/O, through-hole 168-CPGA packaging, and commercial temperature rating make it a practical choice for system designers working with existing board layouts or commercial electronic products.

Manufactured by Intel, the A80960HT75 offers a combination of processing capability and system integration that supports straightforward BOM reduction and predictable thermal and mechanical mounting characteristics for medium-complexity embedded platforms.

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