DRA752PPGABZQ1

IC MPU DRA75XP CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA75xP 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 473 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA75x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66x, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesBoot Security, Secure Debug
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA752PPGABZQ1 – IC MPU DRA75XP CORTEX-A15 2‑Core 1.5 GHz

The DRA752PPGABZQ1 is an ARM® Cortex®-A15 based microprocessor from the Jacinto DRA75x series, delivering dual-core 32-bit compute at 1.5 GHz. Designed for embedded and automotive applications, it combines multicore application processing with integrated co-processors and a broad set of I/O for multimedia, networking, and control subsystems.

With automotive-grade qualification (AEC‑Q100) and an extended operating temperature range, the device targets designs that require integration of display, storage, networking and security capabilities in a single surface-mount FCBGA package.

Key Features

  • Core and Performance — Dual ARM® Cortex®-A15 cores running at 1.5 GHz provide application-level processing for control and multimedia tasks.
  • Co-Processors — Integrated ARM® Cortex®-M4, C66x, and IVA co-processors enable dedicated DSP, real-time control and multimedia acceleration without off-chip additions.
  • Memory Interfaces — Built-in controllers for DDR2, DDR3 and DDR3L support flexible system memory configurations for diverse performance and power targets.
  • Display and Graphics — HDMI and LCD display interface controllers plus graphics acceleration support connected user interfaces and video output.
  • High-Speed I/O — Multiple USB ports (three USB 2.0 and one USB 3.0), SATA and abundant peripheral interfaces provide direct connectivity for storage and peripherals.
  • Networking — Dual Ethernet capability with one 10/100 Mbps port and one 10/100/1000 Mbps port for flexible network topologies and bandwidth options.
  • Security — Boot Security and Secure Debug features for protection of boot integrity and controlled debug access.
  • Automotive Qualification and Temperature Range — AEC‑Q100 qualified with an operating range from −40 °C to 125 °C for automotive and harsh-environment deployments.
  • Package and Mounting — Supplied in a 760‑FCBGA (23×23) surface-mount package suitable for compact system designs.
  • Regulatory — RoHS compliant.

Typical Applications

  • Automotive Infotainment — Drives HDMI/LCD displays and multimedia streams while leveraging graphics acceleration and integrated DDR memory controllers.
  • In‑Vehicle Compute — Dual-core application processing with co-processors and secure boot support for vehicle-domain compute modules.
  • Industrial and Embedded Control — Real-time control and DSP workloads using the Cortex‑M4 and C66x co-processors alongside robust I/O and extended temperature operation.
  • Networked Storage and Gateway — Integrated SATA, USB 3.0 and gigabit Ethernet enable data aggregation, storage and gateway functions in compact systems.

Unique Advantages

  • Integrated Multicore Architecture: Dual Cortex‑A15 plus dedicated co-processors reduce the need for external processors and simplify system partitioning of tasks.
  • Broad I/O Integration: Native support for HDMI, LCD, multiple USB ports, SATA and dual Ethernet cuts BOM and shortens board design time.
  • Automotive-Ready: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in automotive and other harsh environments.
  • Security Built In: Boot Security and Secure Debug features support secure system start-up and controlled development access.
  • Flexible Memory Support: DDR2/DDR3/DDR3L controllers accommodate a range of memory choices for power/performance trade-offs.
  • Compact Package: 760‑FCBGA (23×23) package provides a high-density solution for space-constrained designs.

Why Choose DRA752PPGABZQ1?

The DRA752PPGABZQ1 positions itself as a highly integrated embedded processor for designers needing a balance of application compute, dedicated co-processing and extensive I/O in an automotive‑grade component. Its combination of ARM® Cortex®-A15 cores, multimedia and networking interfaces, and on-chip security features make it suitable for systems that require consolidated functionality in a single device.

As part of the Jacinto DRA75x series from Texas Instruments, this device is aimed at engineers building automotive, industrial and advanced embedded platforms that demand robustness, integration and a defined operating-temperature window.

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