DRA756BPGABCQ1

IC MPU DRA75X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA75x 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,057 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA75x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA756BPGABCQ1 – ARM® Cortex®-A15 MPU, 2-Core 1.5 GHz, 760-FCBGA

The DRA756BPGABCQ1 from Texas Instruments is an ARM® Cortex®-A15 based microprocessor IC featuring two 32-bit cores running at 1.5 GHz. It combines application-class processing with a range of integrated peripherals and security features suitable for embedded and automotive-class designs.

With heterogeneous co-processors, multimedia acceleration and broad I/O support, this device targets systems requiring high compute density, robust connectivity and extended temperature capability for demanding environments.

Key Features

  • Core and Performance Two ARM® Cortex®-A15 32-bit cores at 1.5 GHz provide application-class processing performance for compute-intensive embedded workloads.
  • Heterogeneous Co‑Processing Integrated co-processors include ARM® Cortex®-M4, BB2D, C66x, GPU and IVA to offload specialized tasks and enable balanced system partitioning.
  • Memory Support On-chip controllers for DDR2, DDR3 and DDR3L memory types to support a range of system memory configurations.
  • Multimedia and Graphics Graphics acceleration plus display interface controllers for HDMI and LCD enable multimedia and display-driven applications.
  • Connectivity and Storage Rich I/O set including 10/100/1000 Mbps Ethernet, additional 1 Gbps Ethernet, SATA, USB 3.0 (1) and USB 2.0 (3) for high-bandwidth networking and storage options.
  • Automotive Interfaces DCANbus support and automotive-grade qualification make the device suitable for vehicle-focused embedded systems.
  • Security Features Built-in cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection for system integrity and data protection.
  • Package and Thermal Available in a 760-FCBGA (23×23) package and specified for an operating temperature range of -40 °C to 125 °C.
  • Qualification AEC-Q100 qualification and Automotive grade designation per product data.

Typical Applications

  • Automotive Infotainment Leverages HDMI/LCD display controllers, GPU and multimedia accelerators to drive in-vehicle entertainment and display systems.
  • Vehicle Gateway and Connectivity Multi-port Ethernet, USB and CAN support enable vehicle network gateways and communication modules.
  • Embedded Multimedia Systems GPU, IVA and display interfaces make the device suitable for set-top, industrial HMI and media-rich embedded appliances.
  • Storage and Networking Appliances Integrated SATA, USB 3.0 and gigabit Ethernet support storage gateways and networked embedded appliances.

Unique Advantages

  • High computational throughput: Dual ARM® Cortex®-A15 cores at 1.5 GHz provide sustained application processing headroom for demanding tasks.
  • Heterogeneous processing fabric: On-chip Cortex‑M4, C66x DSP, GPU and IVA co-processors enable task-specific acceleration and system partitioning.
  • Comprehensive connectivity: Ethernet, USB 2.0/3.0, SATA and DCANbus deliver flexible high-bandwidth I/O for diverse system architectures.
  • Automotive-grade reliability: AEC‑Q100 qualification and an operating range of -40 °C to 125 °C support deployment in temperature-critical environments.
  • Integrated security suite: Cryptography, secure boot, secure storage and isolation firewalls help protect device identity and software IP.
  • Flexible memory options: DDR2/DDR3/DDR3L controller support simplifies memory selection across performance and power trade-offs.

Why Choose DRA756BPGABCQ1?

The DRA756BPGABCQ1 positions itself as a highly integrated application processor for embedded and automotive-class systems that require a combination of CPU performance, heterogeneous acceleration and extensive I/O. Its automotive-grade qualification, broad temperature range and built-in security features make it suitable for designs where reliability and system integrity are required.

This device is well suited to engineers building infotainment, vehicle gateway, connectivity or multimedia-focused embedded systems who need a compact, feature-rich processor package with support for multiple memory types and high-speed interfaces.

Request a quote or submit an inquiry to get pricing and availability for the DRA756BPGABCQ1. Provide your project requirements to expedite lead time and procurement details.

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