DRA756PPIGABZRQ1

IC MPU DRA75XP CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA75xP 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 853 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA75x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66x, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesBoot Security, Secure Debug
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA756PPIGABZRQ1 – IC MPU DRA75XP CORTEX-A15 760BGA

The DRA756PPIGABZRQ1 is a Texas Instruments Jacinto DRA75x series microprocessor featuring a dual-core ARM® Cortex®-A15 architecture running at 1.5 GHz. It integrates multiple co-processors and a broad set of high-speed interfaces, delivering a compact, high-performance MPU for embedded designs.

Designed to meet automotive-grade requirements with AEC-Q100 qualification and an extended operating range, this device targets applications that require compute performance, multimedia I/O, and robust system-level integration.

Key Features

  • Processing Cores  Dual ARM® Cortex®-A15 32-bit cores at 1.5 GHz provide the primary compute capability for application and control tasks.
  • Co-processors  Integrated co-processor support including ARM® Cortex®-M4, C66x and IVA to offload DSP and multimedia workloads.
  • Memory Support  Built-in controllers for DDR2, DDR3 and DDR3L memories to support flexible system memory configurations.
  • Display and Graphics  HDMI and LCD display interface controllers plus graphics acceleration for multimedia and user-interface applications.
  • High-speed Storage and USB  On-chip SATA and multiple USB ports: three USB 2.0 and one USB 3.0 for storage and peripheral connectivity.
  • Ethernet Connectivity  Dual Ethernet support with one 10/100 Mbps port and one 10/100/1000 Mbps port for mixed network requirements.
  • Additional Interfaces  Common peripheral interfaces such as I2C are available for sensor and control connectivity.
  • Security Features  Hardware-level Boot Security and Secure Debug to support secure system bring-up and maintenance.
  • Automotive Grade and Qualification  Grade: Automotive with AEC-Q100 qualification and RoHS compliance for regulated environments.
  • Package and Mounting  760-ball FCBGA package (760‑FCBGA, 23 × 23 mm) in a surface-mount format for compact system integration.
  • Operating Range  Extended industrial/automotive operating temperature range from −40°C to 125°C.

Typical Applications

  • Automotive Infotainment  HDMI/LCD display interfaces, graphics acceleration, USB and SATA support enable multimedia playback, user interfaces, and local storage in infotainment systems.
  • Networked Embedded Systems  Dual Ethernet ports (including gigabit) and multiple USB interfaces make the device suitable for connected gateways and telematics units.
  • Multimedia and Storage Hubs  Integrated SATA, USB 3.0, and co-processor resources provide a platform for media servers, recording systems, and streaming devices.

Unique Advantages

  • High compute density: Dual ARM® Cortex®-A15 cores at 1.5 GHz deliver strong application performance in a single-chip solution.
  • Heterogeneous processing: On-chip Cortex‑M4, C66x and IVA co-processors enable offloading of DSP and multimedia tasks to improve overall system efficiency.
  • Rich I/O integration: HDMI, LCD, SATA, multiple USB ports, Ethernet and I2C reduce external component count and simplify board design.
  • Automotive-ready: AEC-Q100 qualification and an operating range to 125°C support deployment in automotive environments.
  • Secure system bring-up: Built-in Boot Security and Secure Debug features help protect firmware and control access during development and field service.
  • Compact packaging: The 760‑FCBGA (23×23 mm) surface-mount package enables dense, space-constrained PCB layouts.

Why Choose DRA756PPIGABZRQ1?

The DRA756PPIGABZRQ1 combines dual-core ARM® Cortex®-A15 compute, a set of specialized co-processors, and a wide array of connectivity and multimedia interfaces into a single, automotive-qualified device from Texas Instruments' Jacinto DRA75x series. This integration supports designs that demand performance, multimedia capability, and robust system-level features while minimizing external component count.

Its AEC-Q100 qualification, extended temperature range and RoHS compliance make it well suited for automotive and other demanding embedded applications where long-term reliability and proven silicon are required.

Request a quote or submit an RFQ to start a procurement inquiry and receive pricing and availability information for the DRA756PPIGABZRQ1.

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