DRA756PPIGABZRQ1
| Part Description |
ARM® Cortex®-A15 Microprocessor IC DRA75xP 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23) |
|---|---|
| Quantity | 853 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Jacinto DRA75x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, C66x, IVA | Core Processor | ARM® Cortex®-A15 | Device Package | 760-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, LCD | ECCN | N/A | Ethernet | 10/100Mbps (1), 10/100/1000Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 760-LFBGA, FCBGA | ||
| Qualification | AEC-Q100 | RAM Controllers | DDR2, DDR3, DDR3L | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | ROHS3 Compliant | SATA | SATA | Security Features | Boot Security, Secure Debug | ||
| Speed | 1.5GHz | Supplier Device Package | 760-FCBGA (23×23) | USB | USB 2.0 (3), USB 3.0 (1) | ||
| Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of DRA756PPIGABZRQ1 – IC MPU DRA75XP CORTEX-A15 760BGA
The DRA756PPIGABZRQ1 is a Texas Instruments Jacinto DRA75x series microprocessor featuring a dual-core ARM® Cortex®-A15 architecture running at 1.5 GHz. It integrates multiple co-processors and a broad set of high-speed interfaces, delivering a compact, high-performance MPU for embedded designs.
Designed to meet automotive-grade requirements with AEC-Q100 qualification and an extended operating range, this device targets applications that require compute performance, multimedia I/O, and robust system-level integration.
Key Features
- Processing Cores Dual ARM® Cortex®-A15 32-bit cores at 1.5 GHz provide the primary compute capability for application and control tasks.
- Co-processors Integrated co-processor support including ARM® Cortex®-M4, C66x and IVA to offload DSP and multimedia workloads.
- Memory Support Built-in controllers for DDR2, DDR3 and DDR3L memories to support flexible system memory configurations.
- Display and Graphics HDMI and LCD display interface controllers plus graphics acceleration for multimedia and user-interface applications.
- High-speed Storage and USB On-chip SATA and multiple USB ports: three USB 2.0 and one USB 3.0 for storage and peripheral connectivity.
- Ethernet Connectivity Dual Ethernet support with one 10/100 Mbps port and one 10/100/1000 Mbps port for mixed network requirements.
- Additional Interfaces Common peripheral interfaces such as I2C are available for sensor and control connectivity.
- Security Features Hardware-level Boot Security and Secure Debug to support secure system bring-up and maintenance.
- Automotive Grade and Qualification Grade: Automotive with AEC-Q100 qualification and RoHS compliance for regulated environments.
- Package and Mounting 760-ball FCBGA package (760‑FCBGA, 23 × 23 mm) in a surface-mount format for compact system integration.
- Operating Range Extended industrial/automotive operating temperature range from −40°C to 125°C.
Typical Applications
- Automotive Infotainment HDMI/LCD display interfaces, graphics acceleration, USB and SATA support enable multimedia playback, user interfaces, and local storage in infotainment systems.
- Networked Embedded Systems Dual Ethernet ports (including gigabit) and multiple USB interfaces make the device suitable for connected gateways and telematics units.
- Multimedia and Storage Hubs Integrated SATA, USB 3.0, and co-processor resources provide a platform for media servers, recording systems, and streaming devices.
Unique Advantages
- High compute density: Dual ARM® Cortex®-A15 cores at 1.5 GHz deliver strong application performance in a single-chip solution.
- Heterogeneous processing: On-chip Cortex‑M4, C66x and IVA co-processors enable offloading of DSP and multimedia tasks to improve overall system efficiency.
- Rich I/O integration: HDMI, LCD, SATA, multiple USB ports, Ethernet and I2C reduce external component count and simplify board design.
- Automotive-ready: AEC-Q100 qualification and an operating range to 125°C support deployment in automotive environments.
- Secure system bring-up: Built-in Boot Security and Secure Debug features help protect firmware and control access during development and field service.
- Compact packaging: The 760‑FCBGA (23×23 mm) surface-mount package enables dense, space-constrained PCB layouts.
Why Choose DRA756PPIGABZRQ1?
The DRA756PPIGABZRQ1 combines dual-core ARM® Cortex®-A15 compute, a set of specialized co-processors, and a wide array of connectivity and multimedia interfaces into a single, automotive-qualified device from Texas Instruments' Jacinto DRA75x series. This integration supports designs that demand performance, multimedia capability, and robust system-level features while minimizing external component count.
Its AEC-Q100 qualification, extended temperature range and RoHS compliance make it well suited for automotive and other demanding embedded applications where long-term reliability and proven silicon are required.
Request a quote or submit an RFQ to start a procurement inquiry and receive pricing and availability information for the DRA756PPIGABZRQ1.

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