DRA756APGABCQ1

IC MPU DRA75X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA75x 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 635 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA75x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA756APGABCQ1 – ARM® Cortex®-A15 2-Core 1.5GHz MPU, 760‑FCBGA

The DRA756APGABCQ1 is an IC microprocessor from the Jacinto DRA75x series by Texas Instruments featuring dual ARM® Cortex®‑A15 cores running at 1.5 GHz. Designed for embedded applications, it combines high-performance application cores with multiple co‑processor options and rich I/O to address compute‑intensive and connectivity‑focused designs.

With automotive grade qualification (AEC‑Q100) and an extended operating range, the device targets embedded and automotive markets that require performance, integration, and hardware security features in a surface‑mount 760‑FCBGA (23×23) package.

Key Features

  • Processor Core  Dual ARM® Cortex®‑A15 32‑bit cores at 1.5 GHz provide application processing headroom for compute tasks and real‑time workloads.
  • Co‑processors and Accelerators  Includes support for ARM® Cortex®‑M4, BB2D, C66x DSP, GPU and IVA co‑processors to offload specialized signal, graphics and media processing.
  • Memory and Controllers  Integrated memory controllers supporting DDR2, DDR3 and DDR3L offer flexible DRAM interface options for system memory.
  • Display and Graphics  Display interface controllers for HDMI and LCD plus graphics acceleration support visual and HMI applications.
  • Connectivity and I/O  Robust peripheral set including 1×10/100 Mbps and 1×10/100/1000 Mbps Ethernet, SATA, USB 3.0 (1) and USB 2.0 (3), and CANbus for diverse system interfaces.
  • Security  Hardware security features including cryptography, secure boot, secure storage, device identity, debug security, isolation firewalls and software IP protection help protect system integrity and data.
  • Package and Mounting  760‑FCBGA (23×23) supplier device package in a surface‑mount form factor suitable for high‑density system boards.
  • Automotive Grade and Temperature  AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C support use in demanding environments.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Automotive Infotainment and Connectivity  High‑performance cores, graphics acceleration, HDMI/LCD support and multiple USB/Ethernet interfaces enable multimedia and networked infotainment systems.
  • Advanced Telematics and Gateway  Integrated Ethernet, CANbus and SATA interfaces make the device suitable for vehicle gateways and telematics platforms requiring mixed connectivity.
  • Industrial and Embedded Control  Dual Cortex‑A15 cores with co‑processor support and extended temperature range support compute and control tasks in embedded industrial systems.

Unique Advantages

  • Balanced Performance and Offload Options: Dual Cortex‑A15 cores plus multiple co‑processors allow partitioning of application, signal processing and graphics workloads for efficient system design.
  • Comprehensive I/O Integration: On‑chip support for Ethernet (10/100 and 10/100/1000), SATA, multiple USB ports and CANbus reduces BOM and simplifies board layout.
  • Automotive Reliability: AEC‑Q100 qualification and −40°C to 125°C operating temperature align the device with automotive and harsh‑environment requirements.
  • Hardware Security Suite: Built‑in cryptography, secure boot and isolation firewalls help protect firmware, device identity and sensitive data at the platform level.
  • Flexible Memory Support: DDR2/DDR3/DDR3L controller support enables designers to choose memory options that match performance and power targets.
  • Surface‑Mount 760‑FCBGA Packaging: High‑density FCBGA package supports compact system designs while providing the pin count required for extensive peripheral integration.

Why Choose DRA756APGABCQ1?

The DRA756APGABCQ1 positions itself as a versatile embedded MPU for designs that require multi‑core application processing, dedicated co‑processors and a broad set of high‑speed and legacy interfaces. Its combination of compute performance, integrated connectivity, and hardware security features makes it suitable for automotive and industrial systems where integration and reliability matter.

Engineers designing infotainment, telematics, gateways or industrial controllers will find the device’s memory flexibility, extended temperature range and AEC‑Q100 qualification provide long‑term value through scalable performance and platform robustness backed by a known vendor family (Jacinto DRA75x).

Request a quote or submit an inquiry to receive pricing and availability for the DRA756APGABCQ1 and to discuss how it fits your next embedded design.

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