DRA756BPGABCRQ1

IC MPU DRA75X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA75x 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,231 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA75x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA756BPGABCRQ1 – ARM® Cortex®-A15 1.5GHz 2‑Core MPU, 760‑FCBGA

The DRA756BPGABCRQ1 is an ARM® Cortex®-A15 microprocessor IC from the Jacinto DRA75x series, featuring a dual 32-bit core clocked at 1.5 GHz in a 760‑FCBGA (23×23) package. It combines high-performance application processing with a set of integrated co‑processors and peripherals to support complex embedded systems.

Designed for demanding environments, the device provides a broad set of connectivity, display and storage interfaces, on-chip security features, and an extended operating temperature range, enabling use in applications that require performance, integration and durability.

Key Features

  • Processing Core  Dual ARM® Cortex®‑A15 cores, 32‑bit at 1.5 GHz for application processing tasks.
  • Heterogeneous Coprocessors  Integrated ARM® Cortex®‑M4, BB2D, C66x DSP, GPU and IVA co‑processors to offload specialized workloads.
  • Memory Controllers  Support for DDR2, DDR3 and DDR3L memory interfaces to match multiple system memory architectures.
  • Display and Graphics  On‑chip display interface controllers including HDMI and LCD plus graphics acceleration for rich user interfaces.
  • Connectivity  Comprehensive I/O with 10/100 Mbps and 10/100/1000 Mbps Ethernet ports, SATA, three USB 2.0 ports and one USB 3.0 port, plus CANbus for vehicle networks.
  • Security Features  Built‑in cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection for system hardening.
  • Package and Mounting  760‑FCBGA (23×23) supplier device package, surface mount for compact board integration.
  • Automotive Qualification & Temperature Range  AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for high‑reliability applications.

Typical Applications

  • Automotive Infotainment and Displays  Supports HDMI and LCD display controllers, graphics acceleration and multimedia coprocessors for in‑vehicle user interfaces and multimedia systems.
  • Telematics and Gateway Systems  Multiple Ethernet ports, CANbus and robust security features enable connected vehicle gateways and telematics controllers.
  • Networked Storage and Communication Appliances  Integrated SATA, USB 3.0 and Gigabit Ethernet interfaces suit storage, NAS and network appliance designs.
  • Industrial Control and HMI  Extended temperature range, real‑time coprocessors and diverse I/O make the device suitable for industrial automation controllers and human‑machine interfaces.

Unique Advantages

  • Integrated Heterogeneous Processing: Dual Cortex‑A15 cores plus Cortex‑M4, DSP and GPU coprocessors enable workload partitioning and optimized performance for mixed tasks.
  • Comprehensive Connectivity: Gigabit and 10/100 Ethernet, SATA, USB 3.0/2.0 and CANbus reduce external interface components and simplify system design.
  • Built‑in Security Stack: On‑chip cryptography, secure boot and secure storage help protect device identity and software IP without relying solely on external security solutions.
  • Automotive‑Grade Reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in harsh and temperature‑sensitive environments.
  • Memory Flexibility: Support for DDR2, DDR3 and DDR3L controllers allows designers to match system performance and power targets.
  • Compact High‑Density Package: 760‑FCBGA (23×23) package enables high pin count and functionality in a compact footprint for space‑constrained boards.

Why Choose DRA756BPGABCRQ1?

The DRA756BPGABCRQ1 positions itself as a highly integrated processor solution for designs that require application performance, multimedia capability and broad peripheral support in a single device. With dual ARM® Cortex®‑A15 cores and a layered set of coprocessors, the device is suitable for systems that need parallel processing of application, DSP and display workloads.

Its combination of high‑speed interfaces, on‑chip security mechanisms, automotive qualification and extended temperature operation makes it a practical choice for customers developing automotive, industrial and networked embedded systems that demand integration, reliability and adaptable performance.

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