DRA767PSGACDQ1

The DRA767PSGACDQ1 is an ARM® Cortex®‑A15 based microprocessor IC in the Jacinto DRA76x series, featuring a dual‑core 32‑bit CPU running at 1.8 GHz. It integrates high‑performance compute, multimedia and vision subsystems with extensive I/O, making it suitable for advanced embedded infotainment, HMI and ADAS‑adjacent applications.

Designed for systems requiring a mix of CPU, DSP and graphics processing, this automotive‑grade device combines dual Cortex‑A15 cores, multiple co‑processors, on‑chip memory, and broad peripheral support to deliver a highly integrated platform for multimedia and control applications.

Key Features

• Core and Processing Dual ARM® Cortex®‑A15 microprocessor subsystem, 2 cores at 1.8 GHz (32‑bit) for application processing and control.
• Co‑Processors and DSP Integrated co‑processors including ARM® Cortex®‑M4, C66x DSP cores, IVA and optional Embedded Vision Engines (EVE) for image, audio and signal processing.
• Memory and On‑Chip RAM Up to 2.5 MB of on‑chip L3 RAM and two EMIF memory controllers supporting DDR2, DDR3, DDR3L (up to DDR3‑1333) with up to 2 GB per EMIF.
• Multimedia and Graphics Full‑HD video support (1920×1080p @ 60 fps), video input/output pipelines, 2D graphics accelerator and dual‑core PowerVR® SGX544 3D GPU for rich UI and video playback.
• Display and Camera Interfaces Display controller with DMA and up to three pipelines, HDMI™ 1.4a / DVI 1.0 encoder, and MIPI CSI‑2 camera interface for multi‑camera designs.
• High‑Speed I/O Two 1 Gbps Ethernet MACs, SATA 3 Gbps, SuperSpeed USB 3.0 (dual‑role), three USB 2.0 high‑speed ports, PCIe® 3.0 lanes (up to two 5‑Gbps lanes) and multiple serial peripherals (SPI, UART, I2C).
• Automotive and Reliability Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C.
• Security Hardware crypto accelerators, secure boot and storage, device identity, isolation firewalls, secure debug, and software IP protection features.
• Package and Mounting 784‑pin FCBGA package (23 mm × 23 mm, 0.8 mm pitch), surface mount format suitable for high‑density system boards.
• Standards and Compliance RoHS compliant.

Typical Applications

• Human‑Machine Interfaces (HMI) Rich graphical and multimedia interfaces using the dual Cortex‑A15 cores and PowerVR SGX544 GPU for responsive displays and user interaction.
• In‑vehicle Infotainment Multimedia playback, navigation and connectivity features enabled by HDMI/DVI, multiple USB ports, SATA and dual Gigabit Ethernet.
• Rear Seat Entertainment Full‑HD video decode, multiple video inputs and display pipelines for multi‑screen entertainment systems.
• ADAS Integration Image processing subsystems, ISP, EVEs and DSP engines support camera and vision preprocessing for advanced driver assistance functions.

Unique Advantages

• Highly integrated multimedia platform: Combines CPU, DSP, GPU and dedicated video/image subsystems to reduce the need for external accelerators.
• Scalable memory and bandwidth: Dual EMIF controllers supporting DDR2/DDR3/DDR3L and up to 2 GB per EMIF enable complex applications and large framebuffers.
• Comprehensive connectivity: Multiple high‑speed interfaces (USB 3.0, USB 2.0, SATA, PCIe, Gigabit Ethernet, MIPI CSI‑2) simplify system design and integration.
• Automotive‑grade qualification: AEC‑Q100 rating and −40 °C to 125 °C operating range support deployment in temperature‑challenging automotive environments.
• Built‑in device security: Secure boot, cryptography and isolation firewalls help protect system integrity and IP.
• Compact, manufacturable package: 784‑pin FCBGA (23×23 mm) provides a high‑pin‑count solution for dense board layouts.

Why Choose DRA767PSGACDQ1?

The DRA767PSGACDQ1 positions itself as a high‑performance, highly integrated processor for embedded infotainment, HMI and automotive electronics where multimedia, vision and secure connectivity are required. Its combination of dual Cortex‑A15 CPU cores, multiple DSP/vision accelerators, a dedicated graphics subsystem and broad I/O support delivers a balanced platform for complex system designs.

Engineers and system designers benefit from the device’s automotive qualification, extensive on‑chip resources and flexible memory and interface options, enabling scalable designs that address demanding thermal and reliability requirements while reducing external component count.

Request a quote or submit a sales inquiry to start a procurement discussion for the DRA767PSGACDQ1 and evaluate how it fits your next embedded system design.