DRA770PJGACDQ1
| Part Description |
ARM® Cortex®-A15 Microprocessor IC DRA77xP 2 Core, 32-Bit 1GHz 784-FCBGA (23x23) |
|---|---|
| Quantity | 1,131 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Jacinto DRA77x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4, C66x, IVA | Core Processor | ARM® Cortex®-A15 | Device Package | 784-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DVI, HDMI, LCD | ECCN | N/A | Ethernet | 1Gbps (2) | ||
| Grade | Automotive | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 784-LFBGA, FCBGA | ||
| Qualification | AEC-Q100 | RAM Controllers | DDR2, DDR3, DDR3L | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | Security Features | Boot Security, Cryptography, Device Identity, Isolation Firewalls, Secure Debug, Secure Storage, Software IP Protection | ||
| Speed | 1GHz | Supplier Device Package | 784-FCBGA (23×23) | USB | USB 2.0 (3), USB 3.0 (1) | ||
| Voltage – I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Overview of DRA770PJGACDQ1 – ARM Cortex-A15 2‑Core 1 GHz MPU, 784‑FCBGA
The DRA770PJGACDQ1 is an ARM® Cortex®-A15 based microprocessor IC in the Jacinto DRA77x series, featuring two 32-bit Cortex-A15 cores running at 1 GHz. It is architected for infotainment and advanced embedded applications and integrates multimedia, vision, and heterogeneous compute subsystems to address demanding in-vehicle and embedded HMI use cases.
With multi-layer on-chip memory, dedicated DSP and vision engines, extensive I/O and security features, the device delivers a high level of integration for designers targeting automotive-grade infotainment, navigation, multimedia playback and advanced driver assistance integration.
Key Features
- Processor Subsystem Dual ARM Cortex-A15 32-bit cores at 1 GHz provide primary compute for application and OS workloads; includes dual Cortex-M4 image processing units and support for up to two C66x floating-point VLIW DSPs for signal processing.
- On‑Chip Memory and Interconnect Up to 2.5 MB of on-chip L3 RAM with L3/L4 interconnects and two EMIF memory controllers supporting DDR2, DDR3 and DDR3L (up to DDR2-800 and DDR3-1333) with up to 2 GB per EMIF.
- Multimedia and Graphics Full‑HD video support (1920 × 1080p, 60 fps) with video processing engine, Vivante GC320 2D accelerator and dual-core PowerVR SGX544 3D GPU for 2D/3D graphics and video pipelines.
- Imaging and Vision Imaging subsystem with ISP, wide dynamic range and lens distortion correction, two Video Input Port (VIP) modules and up to two Embedded Vision Engines (EVEs) for vision tasks.
- Broad I/O and Storage Rich peripheral set including two 1 Gbps Ethernet ports, SATA 3 Gbps, one USB 3.0 dual-role port and three USB 2.0 dual-role ports, PCIe 3.0 (two 5-Gbps lanes), multiple SPI/I2C/UART/McASP/MMC/SDIO interfaces, and CAN/MCAN support.
- Security and Device Integrity Hardware crypto accelerators and DMA, boot security, secure storage, device identity, isolation firewalls, secure debug, and software IP protection for secure system deployment.
- Automotive Qualification and Reliability Grade: Automotive with AEC‑Q100 qualification; operating temperature range −40 °C to 125 °C suitable for automotive environments.
- Package and Mounting 23 mm × 23 mm, 0.8 mm pitch, 784‑pin FCBGA (784‑LFBGA / 784‑FCBGA), surface-mount package designed for compact system integration.
- Standards and Compliance RoHS compliant.
Typical Applications
- In‑Vehicle Infotainment (IVI) High-performance multimedia, navigation and HMI systems leveraging full‑HD video, GPU acceleration and multiple display/controller pipelines.
- Navigation Systems Map rendering, route calculation and user interface handling using the Cortex-A15 cores combined with graphics accelerators.
- Rear Seat Entertainment Multimedia playback and multi‑display support with integrated video engines, HDMI/DVI output, and audio interfaces.
- Digital Radio and Multimedia Digital and analog radio processing and media playback using on-chip DSPs, audio interfaces and storage options like SATA and SDIO.
- ADAS Integration Vision and sensor preprocessing with ISPs, EVEs and DSP resources for feature extraction and system integration.
Unique Advantages
- Highly integrated multimedia platform: Combines CPU, GPUs, video pipelines, ISPs, and DSPs on a single device to reduce external component count and simplify BOM.
- Automotive‑grade qualification: AEC‑Q100 qualified and specified for −40 °C to 125 °C operation to meet automotive environmental requirements.
- Flexible memory and I/O scaling: Dual EMIF controllers with support for DDR2/DDR3/DDR3L and extensive high-speed interfaces (USB 3.0, PCIe 3.0, SATA, Gigabit Ethernet) for diverse system architectures.
- Security built into silicon: Hardware crypto, secure boot, secure storage and firewalls provide a foundation for secure system design and IP protection.
- Dedicated vision and DSP resources: Dual C66x DSPs, EVEs and Cortex-M4 IPUs enable efficient offload of image, audio and signal-processing workloads from the main cores.
- Compact, production-ready package: 784‑pin FCBGA (23 × 23 mm) supports high pin-count integration in space-constrained automotive and embedded systems.
Why Choose DRA770PJGACDQ1?
The DRA770PJGACDQ1 positions itself as a performance‑oriented, highly integrated processor for infotainment and advanced embedded automotive systems. Its combination of dual Cortex-A15 cores, dedicated DSP and vision accelerators, extensive multimedia support and broad interface set delivers a balanced platform for complex HMI, navigation, multimedia playback and ADAS integration.
Designed to meet automotive reliability with AEC‑Q100 qualification and a −40 °C to 125 °C operating range, the device is suited to designers seeking long-term robustness, integration and scalable I/O for production-grade embedded systems. Comprehensive on-chip security and multimedia subsystems help reduce system complexity while enabling secure, feature-rich product designs.
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