DRA767PSIGACDQ1

IC MPU DRA76XP CORTEX-A15 784BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA76xP 2 Core, 32-Bit 1.8GHz 784-FCBGA (23x23)

Quantity 1,960 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA76x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, C66x, IVACore ProcessorARM® Cortex®-A15Device Package784-FCBGA (23x23)
Display & Interface ControllersDVI, HDMI, LCDECCNN/AEthernet1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case784-LFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)Security FeaturesBoot Security, Cryptography, Device Identity, Isolation Firewalls, Secure Debug, Secure Storage, Software IP Protection
Speed1.8GHzSupplier Device Package784-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA767PSIGACDQ1 – IC MPU DRA76XP CORTEX-A15 784BGA

The DRA767PSIGACDQ1 is an ARM® Cortex®-A15 based microprocessor in the Jacinto DRA76x series. It integrates a dual-core 32-bit Cortex-A15 subsystem operating at 1.8 GHz and a broad set of multimedia, memory and I/O engines targeted at infotainment and embedded systems.

Designed with automotive-grade qualification (AEC‑Q100) and an extended operating range (‑40°C to 125°C), this device delivers high-performance compute, comprehensive connectivity, and hardware security features for demanding in-vehicle and industrial applications.

Key Features

  • Dual ARM® Cortex®-A15 cores — Two 32-bit cores running at 1.8 GHz provide the primary application processing capability for complex HMI and multimedia tasks.
  • Heterogeneous coprocessors — Integrated ARM® Cortex®‑M4, C66x DSP, and IVA subsystems add dedicated acceleration for image, audio and signal-processing workloads.
  • On-chip and external memory — Up to 2.5 MB of on-chip L3 RAM plus two EMIF controllers supporting DDR2, DDR3 and DDR3L (up to DDR3‑1333) with up to 2 GB per EMIF.
  • Advanced multimedia and graphics — Full‑HD video (1920×1080p, 60 fps) support, multiple video input/output, 2D accelerator (Vivante® GC320) and dual-core PowerVR® SGX544 3D GPU for rich graphics and video pipelines.
  • Comprehensive display and imaging — Display controller with DMA and up to three pipelines, HDMI 1.4a / DVI 1.0 compliant encoder, image signal processor (ISP) and video processing engine.
  • Extensive connectivity — Dual 1 Gbps Ethernet ports, SATA 3 Gbps, SuperSpeed USB 3.0 (dual-role), three USB 2.0 ports, PCIe 3.0 (two 5‑Gbps lanes), multiple UART/I²C/SPI/QSPI/McASP/MMC/SDIO interfaces.
  • Automotive networking — CAN 2.0B DCAN modules and MCAN with available FD support, plus MIPI CSI‑2 camera interface for automotive and ADAS integration.
  • Security and device protection — Hardware crypto accelerators, secure boot and secure ROM, isolation firewalls, secure keys, secure storage and secure debug support.
  • High pin-count BGA package and temperature range — 784‑FCBGA (23×23 mm, 0.8 mm pitch) package rated for operation from ‑40°C to 125°C; AEC‑Q100 qualified for automotive applications.
  • Rich system peripherals — Up to 247 GPIOs, enhanced DMA (EDMA), GPMC, timers, watchdog and multiple audio/serial peripherals for system control and real‑time processing.

Typical Applications

  • Automotive Infotainment: High‑performance multimedia playback, navigation and HMI systems leveraging full‑HD video, 3D graphics and extensive I/O.
  • Human‑Machine Interfaces (HMI): Multi‑pipeline display controller and GPUs enable responsive, graphically rich interfaces for instrument clusters and center stacks.
  • Rear Seat Entertainment and Media Systems: Multiple video input/output and audio interfaces support multi‑zone media playback and streaming applications.
  • ADAS Integration: Imaging subsystem (ISP), MIPI CSI‑2 and DSP/IVA acceleration facilitate camera processing and vision pre‑processing tasks.

Unique Advantages

  • Highly integrated multimedia platform: Combines video encode/decode, 2D/3D graphics and ISP/VPE subsystems to simplify multimedia system design.
  • Automotive‑grade reliability: AEC‑Q100 qualification and an operating range of ‑40°C to 125°C support deployment in automotive and harsh environments.
  • Flexible connectivity and storage: Broad I/O including Gigabit Ethernet, SATA, USB3.0, PCIe and multiple SD/MMC interfaces reduces external bridge requirements.
  • Security‑centric architecture: On‑chip crypto engines, secure boot, firewalls and secure storage provide hardware foundations for device integrity and IP protection.
  • Scalable compute and acceleration: Dual Cortex‑A15 application cores plus Cortex‑M4, C66x DSPs and IVA allow partitioning of control, signal processing and vision workloads.
  • Design‑friendly packaging: 784‑pin FCBGA (23×23 mm) package enables high I/O density and system integration in compact modules.

Why Choose DRA767PSIGACDQ1?

The DRA767PSIGACDQ1 delivers a balanced combination of CPU performance, multimedia acceleration and automotive‑grade robustness. Its dual Cortex‑A15 cores, dedicated DSP/IVA engines and comprehensive display and imaging subsystems make it well suited for infotainment, HMI and automotive multimedia platforms that require sustained compute and rich I/O.

With extensive connectivity options, hardware security features and AEC‑Q100 qualification, this device addresses long‑life embedded designs where temperature tolerance, functional integration and system security are priorities. The package and peripheral set provide a versatile foundation for scalable automotive and industrial solutions.

Request a quote or contact sales to discuss pricing, availability and how the DRA767PSIGACDQ1 can fit into your next embedded or automotive design.

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