LS1023AXN8QQB

IC MPU QORIQ 1.6GHZ 780FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.6GHz 780-FCPBGA (23x23)

Quantity 941 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1023A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FCPBGA (23x23)ECCN5A002A1
Ethernet1GbE (7) or 10GbE (1) & 1GbE (5)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR3L, DDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.6GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (2) + PHY

Overview of LS1023AXN8QQB – IC MPU QORIQ 1.6GHZ 780FCPBGA

The LS1023AXN8QQB is a dual‑core, 64‑bit QorIQ Layerscape microprocessor based on the ARM® Cortex®‑A53 running at 1.6 GHz in a 780‑FCPBGA (23×23) package. It is targeted for embedded networking and industrial infrastructure applications where integrated I/O, security and industrial temperature operation are required.

Designed for small‑form‑factor networking and industrial use, the device combines dual Cortex‑A53 cores with flexible high‑speed interfaces, on‑chip accelerators and industrial qualification to support use cases such as branch routers, edge appliances, multi‑protocol gateways and control systems.

Key Features

  • Core  Dual ARM® Cortex®‑A53 64‑bit processors running at 1.6 GHz, providing a modern, energy‑efficient CPU complex for embedded applications.
  • Memory  Integrated memory controller support for DDR3L and DDR4 memory technologies.
  • Networking & I/O  Flexible Ethernet configurations (options include multiple 1 GbE ports or a 10 GbE plus accompanying 1 GbE ports), SATA 6 Gbps (1) and USB 3.0 (2) with PHY support for high‑speed peripheral connectivity.
  • High‑speed SerDes & PCIe  Multi‑protocol SerDes and PCIe interfaces (series datasheet describes support for multi‑lane SerDes and multiple PCIe Gen2 ports) to enable a range of high‑speed board‑level topologies.
  • Security & Offload  Hardware security features including Secure Boot and ARM® TrustZone®; on‑chip security engine and frame manager architecture (as described in the series datasheet) enable inline cryptographic offload and packet processing to reduce CPU overhead.
  • System Integration  Purpose‑built for small form factors with BOM optimizations referenced in the series datasheet (economic low‑layer PCB, simplified power and clocking) to help reduce overall system cost and complexity.
  • Package & Mounting  780‑FCPBGA (23×23) surface‑mount package suited for compact embedded designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in harsh environments.
  • Compliance  RoHS compliant.
  • Graphics  No graphics acceleration—focused compute and networking resources for communications and control tasks.

Typical Applications

  • Branch Office Routers & vCPE  Dual‑core processing with flexible Ethernet and acceleration is suited for compact routing and virtual CPE platforms.
  • Edge and Small‑Form‑Factor Network Appliances  High‑speed SerDes, PCIe and USB support enable fanless, low‑power edge devices and network appliances.
  • Multi‑protocol IoT Gateways  Integrated networking, security and protocol offload capabilities support multi‑protocol gateway aggregation and device connectivity.
  • Industrial PLC and Control  Industrial qualification and wide temperature operation make the device appropriate for control and automation applications requiring reliable operation.
  • Security Appliances  Integrated security features and packet processing offload support inline IPsec and related security workloads.

Unique Advantages

  • Balanced Dual‑Core 64‑bit Architecture: Dual ARM Cortex‑A53 cores at 1.6 GHz provide 64‑bit processing and efficient compute for embedded networking tasks.
  • Flexible, High‑Speed I/O: Multiple Ethernet options, SATA 6 Gbps and USB 3.0 plus SerDes and PCIe support enable a wide range of connectivity and board designs.
  • Security and Packet Offload: Hardware Secure Boot, TrustZone and an integrated security/packet processing architecture (as described in the series datasheet) reduce CPU load for cryptographic and networking workloads.
  • Designed for Compact, Cost‑Effective Designs: Series‑level BOM optimizations and a compact 780‑FCPBGA package support small‑form‑factor, lower‑cost system implementations.
  • Industrial Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in demanding environments.
  • Standards‑Oriented Connectivity: Support for DDR3L/DDR4 memory and standard high‑speed interfaces simplifies integration with common embedded subsystems.

Why Choose LS1023AXN8QQB?

The LS1023AXN8QQB positions itself as a compact, industrial‑grade communications processor combining dual ARM® Cortex®‑A53 cores with a broad set of networking and peripheral interfaces. Its feature set—flexible Ethernet configurations, SATA and USB 3.0, memory controller support and on‑chip security—targets small‑form‑factor networking, edge compute and industrial control designs that require integrated I/O and security in a temperature‑hardened package.

For designers building branch routers, edge appliances, IoT gateways or industrial controllers, the LS1023AXN8QQB offers a blend of integration, interface flexibility and industrial qualification that supports scalable, long‑life deployments with reduced BOM complexity.

Request a quote or submit a pricing and availability inquiry to obtain lead‑time and volume pricing for the LS1023AXN8QQB.

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