LX2080SE71826B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 954 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2080S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 8 Core, 64-Bit | Operating Temperature | 0°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 1.8GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2080SE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA
The LX2080SE71826B is an NXP Layerscape LX2080S series microprocessor optimized for embedded and networking applications. It integrates an ARM® Cortex®‑A72 64‑bit processing cluster with eight cores running at 1.8 GHz to deliver multi‑threaded compute for edge, control‑plane and embedded workloads.
Designed for integration into space‑ and power‑constrained systems, the device combines high‑performance CPU cores, DDR4 memory controllers and a broad set of high‑speed I/O to accelerate networking, storage and industrial edge designs while maintaining a compact FCPBGA package footprint.
Key Features
- CPU Core 8 × ARM® Cortex®‑A72 64‑bit cores at 1.8 GHz for multi‑core application processing and control‑plane tasks.
- Memory DDR4 memory controller support for system memory interfaces.
- High‑speed Ethernet Two 100 Gbps Ethernet interfaces to support high‑bandwidth networking and data aggregation.
- Storage Interfaces Four SATA 3.0 ports for local storage and high‑throughput data movement.
- USB and PHY Two USB 3.0 controllers plus two PHY interfaces for peripheral connectivity and high‑speed host I/O.
- Vehicle/Control Bus CANbus support for industrial and real‑time control networks.
- Security Secure Boot and Arm TrustZone® technologies for platform integrity and trusted execution.
- Graphics Acceleration Integrated graphics acceleration to offload display and graphics tasks.
- Package & Mounting 1517‑FCPBGA (40×40) / 1517‑BBGA FCBGA package; surface‑mount device.
- Operating Range Rated for operation from 0 °C to 105 °C.
- Compliance RoHS compliant.
- Qualification Consumer qualification for embedded product use cases.
Typical Applications
- Networking Infrastructure Dual 100 Gbps Ethernet and high‑performance CPU cores enable control‑plane and edge networking functions such as routers, switches and aggregation appliances.
- Edge and Industrial Compute DDR4 memory support, CANbus and robust temperature range make the device suitable for industrial edge gateways and real‑time control systems.
- Storage and NAS Multiple SATA3.0 ports and USB3.0 connectivity support compact storage servers, networked attached storage and local data caching appliances.
- Telecom and 5G Edge Multi‑core processing with high‑speed interfaces supports protocol processing and packet handling at the network edge.
Unique Advantages
- Balanced Multi‑core Performance: 8 ARM® Cortex®‑A72 cores at 1.8 GHz provide a strong mix of single‑thread and multi‑thread performance for embedded networking workloads.
- High‑Bandwidth I/O Integration: Built‑in 100 Gbps Ethernet, SATA3 and USB3 reduce external controller requirements and simplify board design.
- Platform Security: Secure Boot and TrustZone® protect boot integrity and enable trusted execution environments for sensitive applications.
- Compact, Surface‑Mount Package: 1517‑FCPBGA (40×40) package enables high‑density board layouts for space‑constrained systems.
- Industrial Temperature Support: Operation up to 105 °C supports deployment in demanding ambient environments.
- Layerscape Software Ecosystem: Supported by the Layerscape processor software ecosystem, including Linux SDK and embedded development tools for Armv8 platforms.
Why Choose LX2080SE71826B?
The LX2080SE71826B positions itself as a highly integrated, performance‑oriented solution for embedded networking, edge compute and storage applications. Its combination of eight ARM® Cortex®‑A72 cores, DDR4 memory support and multi‑gigabit I/O consolidates key system functions into a single package, reducing BOM complexity and board space.
Engineers building routers, industrial gateways, telecom edge nodes or compact storage systems will find this device suitable for designs that require secure boot, trusted execution, high‑speed networking and a robust thermal envelope. The Layerscape software ecosystem and embedded tool support help accelerate development and deployment.
Request a quote or submit a sales inquiry today to evaluate LX2080SE71826B for your next embedded networking or edge compute design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016