LX2080CC72232B
| Part Description |
Microprocessor IC - 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 91 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2080C |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100G, 10G, 1G | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Number of Cores/Bus Width | 8 Core, 64-Bit | ||
| Operating Temperature | -40 °C – 105 °C | Package / Case | 1517-BBGA, FCBGA | Qualification | Automotive | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Speed | 2.2 GHz | USB | USB 3.0 (2) + PHY (2) | ||
| Voltage – I/O | 1.2 V – 3.3 V |
Overview of LX2080CC72232B – LAYERSCAPE 64-BIT ARM CORTEX-A72
The LX2080CC72232B is a high-performance microprocessor IC based on 64-bit ARM® Cortex®-A72 cores, offered in a 1517-FCPBGA (40×40) surface-mount package. It delivers multi-core compute and extensive high-speed I/O integration targeted at embedded networking, edge compute, and high-bandwidth communications designs.
With an 8-core Cortex-A72 configuration running up to 2.2 GHz and integrated DDR4 memory controllers and multi‑gigabit interfaces, the device is designed to combine processing performance with broad connectivity for demanding embedded applications.
Key Features
- Core and Performance 8 cores of 64-bit ARM® Cortex®-A72 running up to 2.2 GHz, providing scalable multi-threaded compute for control and data-plane tasks.
- Memory Integrated DDR4 RAM controllers to support modern system memory subsystems and high-throughput data buffering.
- High-speed Networking Support for Ethernet at 100G, 10G and 1G link rates to enable high-bandwidth connectivity in networking and telecom applications.
- Storage and USB Four SATA 3.0 ports for storage and mass‑storage applications plus two native USB 3.0 ports with two additional PHY interfaces.
- Security Security features included to support device and data protection requirements in embedded systems.
- Additional Interfaces Integrated CANbus support for vehicle and industrial control networks and other common peripheral interfaces.
- Graphics Acceleration On-chip graphics acceleration to support display and graphical processing tasks in embedded HMI or visualization use cases.
- Package and Mounting 1517‑FCPBGA (40×40) FCBGA package, surface mount, suitable for compact board designs.
- Operating Temperature Specified operation from −40 °C to 105 °C for a wide range of embedded environments.
Typical Applications
- Networking & Telecom Control and data-plane processing where multi-core compute and 100G/10G connectivity are required.
- Edge Compute Local packet processing and protocol handling at the network edge leveraging multi-core performance and DDR4 memory support.
- Data Center Offload High-throughput I/O and security-capable processing for offload tasks in appliance and NIC designs.
- Industrial Embedded Systems Deterministic control and gateway functions with CANbus and robust operating-temperature capability.
Unique Advantages
- Multi-core 64-bit compute: Eight Cortex‑A72 cores at up to 2.2 GHz deliver parallel processing headroom for control, packet handling, and edge analytics.
- Broad high-speed I/O: Native support for 100G/10G/1G Ethernet, SATA 3.0 and USB 3.0 reduces the need for external bridging devices and simplifies board design.
- Integrated memory interface: DDR4 controllers provide high-bandwidth access for packet buffering and application workloads.
- Security-capable platform: On-chip security features enable implementation of secure boot and runtime protection strategies.
- Compact, manufacturable package: 1517‑FCPBGA (40×40) surface-mount footprint supports high-density PCB layouts and production-ready assembly.
- Wide temperature range: −40 °C to 105 °C operation supports deployment in demanding environmental conditions.
Why Choose LX2080CC72232B?
The LX2080CC72232B positions itself as a balanced, highly integrated processor for embedded networking and edge compute applications that require multi-core Cortex‑A72 performance alongside extensive high-speed connectivity. Its combination of DDR4 memory support, multi-gigabit Ethernet, storage interfaces and security features simplifies system architecture and reduces external component count.
This device is suited to teams building compact, high-throughput appliances and gateways who need a proven software ecosystem for Layerscape processors and a vendor-backed platform to support development and deployment.
Request a quote or submit an inquiry for LX2080CC72232B to receive pricing, lead-time details and technical support for your design evaluation and production planning.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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