LS2088AXN711B

IC MPU QORIQ 2.1GHZ 1292FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 2.1GHz 1292-FCPBGA (37.5x37.5)

Quantity 1,952 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS2088A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1292-FCPBGA (37.5x37.5)ECCNN/A
Ethernet10GbE (8), 2.5GbE (16)HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width8 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case1292-BBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (2)
Speed2.1GHzSupplier Device Package1292-FCPBGA (37.5×37.5)USBUSB 3.0 + PHY (2)

Overview of LS2088AXN711B – ARM Cortex-A72 8-Core 2.1 GHz MPU

The LS2088AXN711B is an NXP QorIQ Layerscape microprocessor integrating eight ARM® Cortex®‑A72 cores running up to 2.1 GHz in a 64‑bit architecture. Designed for industrial embedded applications, it delivers high-throughput packet processing, memory bandwidth and I/O integration for networking, storage and compute‑heavy edge systems.

With multi‑core performance, DDR4 memory controllers, rich Ethernet and high‑speed peripheral interfaces, this device targets systems that require scalable processing, secure boot and robust platform-level acceleration in a 1292‑ball FCPBGA package.

Key Features

  • Core & Architecture — Eight ARM® Cortex®‑A72 cores, 64‑bit, operating up to 2.1 GHz to support multi‑threaded and packet‑centric workloads.
  • Memory Subsystem — Dual 64‑bit DDR4 SDRAM controllers with ECC and interleaving support for high memory throughput and data integrity.
  • Datapath Acceleration — DPAA2 datapath acceleration architecture including packet parsing, queue and buffer management, cryptography acceleration and pattern matching to offload and accelerate network and security tasks.
  • High‑Speed I/O — Up to eight 10 GbE MACs and up to sixteen 1/2.5 GbE MACs, plus 16 SerDes lanes at up to 10.3125 GHz for flexible high‑speed connectivity.
  • Peripheral Interfaces — Four PCIe controllers (including one capable of x8/x4/x2/x1 and SR‑IOV), two SATA 6 Gbps controllers and two USB 3.0 controllers with integrated PHYs for storage and expansion.
  • Security & Boot — Secure Boot and TrustZone® support with a service processor providing pre‑boot initialization and secure boot capabilities.
  • System Integration — Integrated platform cache with ECC protection, qDMA engine and a range of peripheral controllers (SPI, QSPI, I2C, DUART, IFC) for versatile system designs.
  • Package & Thermal — 1292‑ball FCPBGA package (37.5 × 37.5 mm), surface mount, industrial qualification with operating range from −40 °C to 105 °C.

Typical Applications

  • Network Infrastructure — High‑density routing and switching platforms leveraging multiple 10 GbE and 2.5 GbE interfaces and packet acceleration to increase throughput and lower CPU load.
  • Security Appliances — Firewalls and VPN gateways using integrated cryptography acceleration and TrustZone® for secure, high‑speed encrypted traffic handling.
  • Storage & NAS Systems — Rack and edge storage controllers combining SATA 6 Gbps, integrated PCIe and DDR4 memory controllers for reliable, high‑performance data access.
  • Edge Compute — Industrial edge servers and appliances that require multi‑core compute, fast I/O and secure boot capabilities in a compact surface‑mount package.

Unique Advantages

  • Multi‑Core Performance: Eight Cortex‑A72 cores at up to 2.1 GHz deliver scalable parallel processing for compute‑intensive embedded workloads.
  • Integrated Packet Acceleration: DPAA2 offloads packet parsing, queuing and cryptography to increase throughput and reduce host CPU overhead.
  • Comprehensive I/O Suite: Multiple 10 GbE and 2.5 GbE MACs, PCIe, SATA and USB 3.0 interfaces minimize external bridging and simplify board design.
  • Memory Robustness: Dual DDR4 controllers with ECC and interleaving support provide high bandwidth with error detection for reliable operation.
  • Industrial‑Grade Operation: Surface‑mount 1292‑FCPBGA package qualified for industrial use with a −40 °C to 105 °C operating range for demanding environments.
  • Secure Platform Foundation: Secure Boot, TrustZone® and a service processor enable trusted boot flows and hardware‑assisted partitioning.

Why Choose LS2088AXN711B?

The LS2088AXN711B combines high‑frequency ARM® Cortex®‑A72 multi‑core processing with a rich set of networking and peripheral interfaces to address demanding industrial embedded designs. Its integrated datapath accelerators, memory ECC and secure‑boot capabilities make it suitable for systems that must balance throughput, reliability and security.

This device is ideal for designers building network appliances, storage controllers and edge compute platforms that require scalable performance, extensive I/O and industrial temperature operation. Its package and platform features support robust, long‑lifecycle deployments where integration and system‑level acceleration reduce BOM complexity and development time.

Request a quote or submit a pricing and availability inquiry to evaluate LS2088AXN711B for your next embedded or networking design.

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