LS2088AXE7V1B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 2.0GHz 1292-FCPBGA (37.5x37.5) |
|---|---|
| Quantity | 878 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LS2088A |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1292-FCPBGA (37.5x37.5) | ECCN | PENDING ECCN | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | HTS Code | 0000.00.0000 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 8 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 105°C | Package / Case | 1292-BFBGA, FCBGA | RAM Controllers | DDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 6Gbps (2) | ||
| Speed | 2.0GHz | Supplier Device Package | 1292-FCPBGA (37.5×37.5) | USB | USB 3.0 (2) + PHY |
Overview of LS2088AXE7V1B – ARM Cortex‑A72, 8‑Core 2.0 GHz Microprocessor
The LS2088AXE7V1B is an NXP QorIQ Layerscape microprocessor featuring 8 ARM® Cortex®‑A72 cores running at 2.0 GHz in a 64‑bit architecture. It combines multi‑core compute with integrated memory and I/O to address embedded and networking applications that require sustained packet processing and control‑plane performance.
Designed for industrial environments, the device offers robust thermal range and integrated Ethernet, storage and USB interfaces to reduce board complexity and accelerate time to market for edge, networking and industrial designs.
Key Features
- Core ARM® Cortex®‑A72 64‑bit CPU cores, 8‑core configuration at 2.0 GHz for multithreaded and packet‑centric workloads.
- Memory DDR4 memory controller support to enable high‑bandwidth system memory configurations.
- Networking Multiple integrated Ethernet options: 10GbE (8) or 1GbE (16) plus 2.5GbE (1), providing flexible port and bandwidth choices for networking and edge applications.
- Storage & USB SATA 6 Gbps (2) ports and USB 3.0 (2) with PHY support for high‑speed storage and peripheral connectivity.
- Security Hardware support for Secure Boot and Arm TrustZone® to enable device integrity and trusted execution environments.
- Packaging & Mounting 1292‑FCPBGA (37.5×37.5 mm) BGA package, surface‑mountable for compact board designs.
- Operating Conditions & Compliance Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for regulatory alignment.
Typical Applications
- Network Infrastructure Control‑plane processors, edge routers and switches that require multiple high‑speed Ethernet ports and multicore packet processing.
- Edge and Data‑Center Offload Edge compute nodes and offload engines that benefit from multi‑core compute and integrated I/O for storage and networking.
- 5G and Telecom Packet processing and control tasks in 5G infrastructure where deterministic performance and networking flexibility are required.
- Industrial Systems Industrial controllers and communication hubs that require extended temperature operation and secure boot capabilities.
Unique Advantages
- Multi‑core processing for parallel workloads: Eight 64‑bit Cortex‑A72 cores at 2.0 GHz provide headroom for concurrent networking and control tasks.
- Flexible, high‑density networking: Multiple Ethernet configurations (10GbE/1GbE/2.5GbE) let designers match port count and bandwidth to system requirements without external PHY proliferation.
- Integrated storage and peripheral I/O: Built‑in SATA 6 Gbps and USB 3.0 with PHY reduce BOM and simplify board routing for storage and peripheral subsystems.
- Industrial temperature and qualification: −40 °C to 105 °C operating range and industrial qualification support deployment in harsh or temperature‑sensitive environments.
- Security foundation: Secure Boot and Arm TrustZone® support help establish a root of trust and separate secure workloads from general‑purpose software.
- Compact BGA package: 1292‑FCPBGA (37.5×37.5 mm) provides a high‑pin‑count footprint for dense system designs while enabling surface‑mount assembly.
Why Choose LS2088AXE7V1B?
The LS2088AXE7V1B positions itself as a high‑performance, industrial‑grade Layerscape processor that balances multi‑core compute, integrated I/O and security features for embedded networking and edge applications. Its combination of DDR4 memory support, multiple Ethernet options, SATA and USB connectivity makes it suitable for systems that need consolidated processing and communications in a compact package.
Backed by NXP's Layerscape platform and associated software ecosystem, the LS2088AXE7V1B is suited to designers seeking a scalable processing building block for long‑lifecycle deployments in networking, telecom and industrial markets.
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