LX2080CA72232B

The LX2080CA72232B is a high-performance embedded microprocessor from NXP’s Layerscape LX2080C series. It integrates an 8‑core, 64‑bit ARM® Cortex®‑A72 CPU cluster running up to 2.2 GHz and is delivered in a compact 1517‑FCPBGA (40×40) surface‑mount package.

Designed for compute‑intensive embedded and networking applications, the device combines multi‑core processing, DDR4 memory support and a broad set of high‑speed interfaces—including Ethernet up to 100 Gbit/s, SATA 3.0 and USB 3.0—making it suitable for edge processing, networking appliances and data‑plane designs that demand integration and throughput.

Key Features

• Core and Architecture 8× ARM® Cortex®‑A72 64‑bit processor cores operating up to 2.2 GHz, providing multithreaded compute for embedded and networking workloads.
• Memory DDR4 RAM controllers for high‑bandwidth system memory support.
• High‑Speed Networking Integrated support for Ethernet at 100G, 10G and 1G speeds to address modern networking and connectivity demands.
• Storage and USB Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs for high‑performance storage and peripheral connectivity.
• Peripheral Interfaces Additional interfaces include CANbus for in‑vehicle or industrial connectivity and other standard embedded interfaces.
• Graphics Acceleration On‑chip graphics acceleration to support display or offload graphics workloads.
• Package and Mounting 1517‑FCPBGA (40×40) supplier device package, 1517‑BBGA/FCBGA family, surface mount.
• Operating Range & Compliance Industrial temperature range from −40 °C to 105 °C and RoHS compliant for broad deployment environments.

Typical Applications

• Networking Equipment Multi‑core processing with 100G/10G Ethernet support enables control‑plane and data‑plane functions in routers, switches and network appliances.
• Edge Processing High single‑chip integration and DDR4 memory support deliver the compute and I/O density required for edge servers and gateways.
• Data Center Offload High throughput Ethernet and storage interfaces make the device suitable for offload functions and appliance‑level acceleration in datacenter environments.
• 5G Packet Processing Multi‑core performance and high‑speed I/O allow deployment in packet processing roles within mobile infrastructure and 5G network elements.

Unique Advantages

• Multi‑Core Processing Density: Eight 64‑bit Cortex‑A72 cores at up to 2.2 GHz provide a balance of throughput and parallelism for embedded networking tasks.
• Broad High‑Speed I/O: Native support for up to 100 Gbit/s Ethernet, SATA 3.0 and USB 3.0 simplifies system design by consolidating key interfaces on a single device.
• Memory Bandwidth: DDR4 controllers enable high memory throughput for packet processing, buffering and application workloads.
• Industrial Temperature Capability: −40 °C to 105 °C operating range supports deployment in demanding environmental conditions.
• Compact, SMD Packaging: 1517‑FCPBGA (40×40) package provides a space‑efficient footprint for dense board designs.
• Standards Compliance: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose LX2080CA72232B?

The LX2080CA72232B positions itself as a highly integrated compute element for embedded and networking systems that require multi‑core performance alongside extensive high‑speed I/O. Its ARM® Cortex®‑A72 cores, DDR4 memory support and broad Ethernet, storage and peripheral interfaces enable consolidated system designs with reduced external components.

Engineers targeting edge, networking or data‑plane applications will find the LX2080CA72232B delivers the processing, connectivity and thermal range needed for robust, long‑lifecycle designs while leveraging the Layerscape family architecture for scalable deployment.

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