MC68302AG33C

IC MPU M683XX 33MHZ 144LQFP
Part Description

M68000 Microprocessor IC M683xx 1 Core, 8/16-Bit 33MHz 144-LQFP (20x20)

Quantity 521 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68302
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorM68000Device Package144-LQFP (20x20)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 8/16-BitOperating Temperature0°C ~ 70°C (TA)Package / Case144-LQFP
RAM ControllersDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed33MHzSupplier Device Package144-LQFP (20×20)Voltage – I/O5.0V

Overview of MC68302AG33C – IC MPU M683XX 33MHZ 144LQFP

The MC68302AG33C is an M68000-core microprocessor IC designed for embedded systems. It features a single M68000 core with an 8/16-bit bus implementation and a rated operating frequency of 33 MHz.

Built with integrated communications co-processing and DRAM controller support, the device targets embedded applications that require a compact, surface-mount MPU in a 144-LQFP (20x20) package while operating from a 5 V IO supply within a 0 °C to 70 °C range.

Key Features

  • Core & Performance Single M68000 core with an 8/16-bit bus and a clock rate of 33 MHz; timing is characterized at 33 MHz with a cycle period (tcyc) of 30 ns and clock pulse widths (tcl, tch) of 15 ns.
  • Co-Processing & Communications Includes communications-focused co-processors and a RISC CPM to assist system-level communications tasks and offload specific processing functions.
  • Memory Interface Integrated DRAM controller(s) to support external dynamic memory configurations for system-level data buffering and code storage.
  • Interfaces Additional interface support includes GCI for system connectivity and control.
  • Power & IO Operates with a 5 V IO voltage, suitable for designs standardized on 5 V signaling.
  • Package & Mounting Supplied in a 144-LQFP package (20x20), optimized for surface-mount assembly and compact board-level integration.
  • Deterministic Timing Comprehensive timing parameters are provided for 33 MHz operation (examples: 30 ns cycle period, 15 ns clock pulse width, and documented address/data and control timing windows), enabling predictable interface and bus design.
  • Environmental Compliance RoHS compliant, supporting regulatory-driven material requirements for electronics manufacturing.
  • Operating Range Rated for operation from 0 °C to 70 °C, suitable for commercial-temperature embedded deployments.

Typical Applications

  • Embedded Communications Controllers — Use the integrated communications co-processor and CPM to implement protocol handling and interface tasks in embedded communication products.
  • Board-Level MPU Solutions — Serve as the main microprocessor in M68000-based board designs where a 33 MHz single-core MPU with DRAM support is required.
  • DRAM-Based Embedded Systems — Leverage on-chip DRAM controller support for applications that require external dynamic memory for code and data storage.

Unique Advantages

  • Integrated Communications Co-Processing: Reduces external component count by providing communications and RISC CPM support on-chip, simplifying board design for protocol-heavy applications.
  • Deterministic Timing at 33 MHz: Timing characterized at 33 MHz (30 ns cycle period and defined clock/data windows) helps designers validate bus and peripheral timing accurately.
  • Compact, Surface-Mount Packaging: 144-LQFP (20x20) package supports high-density PCB layouts and standard surface-mount assembly processes.
  • DRAM Controller Integration: On-chip DRAM controller capability streamlines memory subsystem design and reduces external glue logic.
  • Commercial Temperature Range: Rated 0 °C to 70 °C to match a wide range of embedded product environments.
  • Regulatory Compliance: RoHS compliant to meet common material and environmental requirements for modern electronics manufacturing.

Why Choose MC68302AG33C?

The MC68302AG33C combines an M68000 single-core architecture with integrated communications co-processing and DRAM controller support, providing a focused solution for embedded designs that need a 33 MHz MPU in a compact 144-LQFP surface-mount package. Its documented timing at 33 MHz and standardized 5 V IO make it straightforward to integrate into existing M68000-based system designs.

This part is suited to designers and procurement teams building commercial-temperature embedded products that require predictable timing, on-chip communications capabilities, and compliance with RoHS material standards.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for MC68302AG33C. Include your required quantities and any delivery or documentation needs to expedite the response.

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