MC68302AG20C
| Part Description |
M68000 Microprocessor IC M683xx 1 Core, 8/16-Bit 20MHz 144-LQFP (20x20) |
|---|---|
| Quantity | 124 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68302 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | M68000 | Device Package | 144-LQFP (20x20) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 8/16-Bit | Operating Temperature | 0°C ~ 70°C (TA) | Package / Case | 144-LQFP | ||
| RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 20MHz | Supplier Device Package | 144-LQFP (20×20) | Voltage – I/O | 5.0V |
Overview of MC68302AG20C – IC MPU M683XX 20MHZ 144LQFP
The MC68302AG20C is an NXP Semiconductors microprocessor IC based on the M68000 core, delivering single-core 8/16-bit processing at a 20 MHz clock rate. Designed for embedded systems, the device combines processing capability with on-chip communications and memory controller functionality to support system-level integration.
This device targets embedded and communications-oriented designs that require a 5 V I/O environment, a high-pin-count surface-mount package, and documented system timing for integration and verification.
Key Features
- Core M68000 single-core architecture with 8/16-bit bus width for legacy and embedded processing tasks.
- Performance 20 MHz nominal clock rate suitable for control and communications-oriented workloads.
- Power and I/O 5 V I/O voltage compatibility for interfaces in 5 V embedded systems.
- Co-processors and Communications On-chip communications and RISC CPM co-processor functionality to support integrated communication tasks.
- Memory Controller Integrated DRAM controller to simplify external memory interfacing and system design.
- Package and Mounting 144-LQFP (20 × 20 mm) surface-mount package for high pin-count connectivity and PCB layout flexibility.
- System Timing Documentation Series datasheet includes comprehensive bus timing parameters (cycle period, clock pulse widths, AS/DS, BG/BR and related timings) to assist system-level timing verification during design.
- Operating Range & Compliance Rated for 0 °C to 70 °C operation and RoHS compliant.
- Interfaces Includes GCI additional interface support as specified in the product data.
Typical Applications
- Embedded Controllers Use as the main processing element in control-oriented embedded systems where an M68000 core and 5 V I/O are required.
- Communications Equipment Leverage the on-chip communications/RISC CPM capability for protocol handling and interface tasks.
- Memory-Dependent Designs Systems requiring an integrated DRAM controller for streamlined external memory interfacing.
- High-Pin-Count Board Designs Applications needing extensive I/O connectivity provided by the 144-LQFP package.
Unique Advantages
- Integrated M68000 Processing: Provides a well-known single-core 8/16-bit architecture for straightforward control and legacy code support.
- On-Chip Communications and CPM: Built-in communications co-processor capability reduces external logic required for protocol handling.
- DRAM Controller Included: Simplifies memory subsystem design and reduces component count for memory-equipped systems.
- High Pin-Count LQFP Package: 144-LQFP (20 × 20 mm) enables dense I/O routing and expands peripheral connectivity on PCB layouts.
- Design-Ready Timing Documentation: Series timing specifications available to support accurate system timing analysis and integration.
- RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.
Why Choose MC68302AG20C?
The MC68302AG20C combines the M68000 single-core architecture with on-chip communications and DRAM controller functionality in a high-pin-count surface-mount package. Its 20 MHz operating frequency, 5 V I/O compatibility, and documented timing parameters make it suitable for embedded systems that require tight integration between processing, communications, and memory subsystems.
Backed by NXP Semiconductors and supplied in a 144-LQFP package with RoHS compliance and a 0 °C to 70 °C operating range, this device is positioned for designers seeking a compact, integrated solution for embedded and communications-oriented applications.
Request a quote or submit a pricing and availability request for the MC68302AG20C to proceed with procurement or design evaluation.

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