MC68302CAG16VC

The MC68302CAG16VC is an NXP Semiconductors embedded microprocessor based on the M68000 core. It provides a single M68000 core with an 8/16‑bit bus implementation and a 16 MHz operating speed for embedded control and communications tasks.

Designed for industrial environments, the device integrates communications co‑processor functionality and DRAM controller support while using 3.3 V I/O and a compact 144‑LQFP (20×20) surface‑mount package to streamline system design.

Key Features

• Core & Bus  M68000 core with a single core configuration and an 8/16‑bit bus width running at 16 MHz, suitable for legacy M68000 architecture applications.
• Integrated Communications Co‑processor  Includes Communications / RISC CPM co‑processor support to offload communications tasks and simplify protocol handling.
• Memory Interface  On‑chip DRAM controller support to facilitate external memory interfacing for moderate memory requirements.
• Power and I/O  3.3 V I/O voltage for compatibility with common low‑voltage system designs.
• Package & Assembly  144‑LQFP (20×20) surface‑mount package for compact board integration and automated assembly.
• Industrial Qualification & Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
• Additional Interface  Includes GCI interface support to address specific system interconnect needs.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in industrial controllers and automation modules that require an M68000‑based control core and operation across −40 °C to 85 °C.
• Communications Equipment  Integration in networked or communications devices where the Communications / RISC CPM co‑processor can handle protocol and data‑path tasks.
• Embedded Systems  General embedded controllers and system management functions that benefit from on‑chip DRAM controller support and 3.3 V I/O.
• Memory‑Assisted Designs  Systems requiring external DRAM interfacing for buffering or working memory in medium‑complexity applications.

Unique Advantages

• Integrated Communications Processing:  Built‑in Communications / RISC CPM support reduces external component count for protocol handling.
• M68000 Core Compatibility:  Single M68000 core with 8/16‑bit bus width preserves compatibility with M68000‑class software and toolchains.
• Industrial Temperature Range:  Rated for −40 °C to 85 °C operation, enabling reliable performance in harsh environments.
• Compact Surface‑Mount Package:  144‑LQFP (20×20) package supports dense PCB layouts and automated assembly processes.
• Low‑Voltage I/O:  3.3 V I/O levels ease integration with modern low‑voltage peripherals and logic families.
• RoHS Compliance:  Meets environmental compliance requirements for lead‑free assembly.

Why Choose MC68302CAG16VC?

The MC68302CAG16VC combines the well‑known M68000 core architecture with integrated communications processing and DRAM controller support in a 144‑LQFP surface‑mount package. Its industrial qualification and −40 °C to 85 °C operating range make it a practical choice for embedded and communications applications requiring reliable operation across temperature extremes.

Backed by NXP Semiconductors, the MC68302CAG16VC is positioned for designs that need a compact, low‑voltage M68000‑based processor with communications and memory interface integration to reduce system complexity and component count.

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