MC68302AG16VC

The MC68302AG16VC is a single‑core microprocessor from the MC68302 series by NXP Semiconductors, built around the M68000 core. It implements an 8/16‑bit bus architecture running at 16 MHz and is targeted at embedded system designs requiring an integrated processor with communications support and external DRAM interfacing.

Key value comes from on‑chip M68000 processing, an included RISC CPM communications co‑processor, 3.3 V I/O signaling and a compact 144‑LQFP (20×20) surface‑mount package, with RoHS compliance and a commercial operating range of 0 °C to 70 °C.

Key Features

• Core Single M68000 core with 8/16‑bit bus width operating at 16 MHz for legacy 68K architecture processing.
• Co‑processor Integrated communications RISC CPM co‑processor for offloading communications tasks.
• Memory Interfaces DRAM controller to support external dynamic memory interfacing.
• I/O Voltage 3.3 V I/O for compatibility with modern logic level domains.
• Package & Mounting 144‑LQFP supplier device package (20×20), surface‑mount mounting type for compact PCB layouts.
• Additional Interfaces Includes GCI interface for system connectivity.
• Operating Range & Compliance Commercial temperature range 0 °C to 70 °C and RoHS compliant.

Typical Applications

• Embedded Systems — Control and processing in compact embedded designs that require an M68000 core and external DRAM support.
• Communications Controllers — Use of the RISC CPM co‑processor to handle communications protocol processing alongside main CPU tasks.
• Legacy 68K-Based Designs — Integrating M68000 architecture processing into systems that maintain or migrate 68K software or interfaces.

Unique Advantages

• Integrated M68000 Core with CPM: Combines general‑purpose M68000 processing with a dedicated communications co‑processor to divide processing loads.
• 8/16‑Bit Bus Flexibility: Supports both 8‑ and 16‑bit bus orientations to match system memory and peripheral interfaces.
• DRAM Controller Onboard: Simplifies external memory interfacing and reduces the need for additional controller components.
• 3.3 V I/O Standard: Enables straightforward integration with contemporary 3.3 V logic domains.
• Compact Surface‑Mount Package: 144‑LQFP (20×20) footprint supports dense PCB integration and standard manufacturing processes.
• Commercial Temperature and RoHS Compliance: Suitable for commercial applications while meeting RoHS environmental requirements.

Why Choose MC68302AG16VC?

The MC68302AG16VC positions itself as a practical choice for embedded designers who need an M68000 core combined with communications processing and DRAM interfacing in a compact, surface‑mount package. Its 16 MHz operating point, 3.3 V I/O, and dedicated communications co‑processor enable balanced handling of control and communications tasks within commercial temperature environments.

This device is suited to customers building or maintaining embedded systems based on 68K architecture who require clear hardware interfaces (DRAM controller, GCI) and a RoHS‑compliant component for production designs.

Request a quote or submit an inquiry for pricing and availability of MC68302AG16VC to evaluate it for your next embedded design.