MC68302AG25C

The MC68302AG25C from NXP Semiconductors is an M68000-based microprocessor optimized for embedded applications. It combines a single M68000 core running at 25 MHz with integrated support for communications co-processing and DRAM control in a compact surface-mount 144-LQFP (20×20) package.

Designed for embedded systems requiring a 5 V I/O environment and operation across a 0 °C to 70 °C range, this device targets applications where a classic M68000 architecture and onboard communications functionality are required.

Key Features

• Core  Single M68000 core operating at 25 MHz, supporting 8-bit and 16-bit bus widths for legacy and mixed-width system designs.
• Communications Co-Processor  Includes communications-focused co-processor capability (RISC CPM) for offloading protocol handling and data movement tasks.
• Memory Support  Integrated DRAM controller to interface with external memory for system storage and program execution.
• Power and I/O  5 V I/O signaling for compatibility with established embedded voltage domains.
• Package and Mounting  144-LQFP package (20×20 mm) in a surface-mount form factor suitable for compact PCB layouts.
• Interfaces  Includes additional GCI interface for system connectivity and peripheral integration.
• Operating Range  Rated for operation from 0 °C to 70 °C for standard commercial-temperature embedded deployments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Control Systems  Use the M68000 core and DRAM controller for application control, sequencing, and system management in embedded products.
• Communications Modules  Leverage the RISC CPM communications co-processor to handle protocol processing and data interfacing tasks.
• Legacy System Integration  Ideal for designs that require a classic M68000 architecture with 8-bit and 16-bit bus support in a surface-mount package.

Unique Advantages

• Integrated M68000 Core and Co-Processor  Combines a single M68000 core with a communications-focused RISC CPM co-processor to consolidate processing tasks on a single device.
• Compact Surface-Mount Package  144-LQFP (20×20) package provides a compact footprint for space-constrained PCB designs.
• Standard Voltage I/O  5 V I/O compatibility simplifies interfacing with established embedded peripherals and legacy components.
• Onboard DRAM Control  Integrated DRAM controller reduces external logic and eases system memory integration.
• Commercial Temperature Rating  0 °C to 70 °C operating range suits a wide range of commercial embedded environments.
• RoHS Compliant  Meets RoHS requirements for environmental compliance in manufacturing and deployment.

Why Choose MC68302AG25C?

The MC68302AG25C positions itself as a practical choice for embedded designs that require a 25 MHz M68000 core combined with built-in communications co-processing and DRAM interfacing. Its surface-mount 144-LQFP package and 5 V I/O make it suitable for systems integrating legacy bus widths and compact PCB layouts.

Backed by NXP Semiconductors and offered with RoHS compliance, this device is targeted at development teams and procurement focused on reliable, specification-driven component selection for commercial-temperature embedded applications.

Request a quote or contact sales to discuss availability, pricing, and lead time for the MC68302AG25C.