MCIMX253CJM4A

IC MPU I.MX25 400MHZ 400LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX25 1 Core, 32-Bit 400MHz 400-LFBGA (17x17)

Quantity 167 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 253
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package400-LFBGA (17x17)Display & Interface ControllersKeypad
ECCN5A992CEthernet10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case400-LFBGARAM ControllersLPDDR, DDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed400MHzSupplier Device Package400-LFBGA (17×17)
USBUSB 2.0 + PHY (2)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX253CJM4A – IC MPU I.MX25 400MHZ 400-LFBGA

The MCIMX253CJM4A is an NXP Semiconductors i.MX 253 series applications processor built around a single ARM926EJ‑S 32‑bit core running at up to 400 MHz. It delivers integrated connectivity and memory interface flexibility intended for embedded and industrial systems that require efficient processing, on‑chip peripherals and industrial temperature operation.

Designed for embedded and industrial markets, the device combines a compact 400‑LFBGA (17 × 17 mm) package, support for LPDDR/DDR/DDR2 memory, integrated 10/100 Mbps Ethernet MAC and two USB 2.0 PHYs to simplify system design and reduce external components.

Key Features

  • Core  ARM926EJ‑S single‑core, 32‑bit processor operating up to 400 MHz for general embedded application processing.
  • Memory Interfaces  On‑chip controllers for LPDDR, DDR and DDR2 memory (supporting DDR2 up to 133 MHz as indicated in the product datasheet).
  • Connectivity  Integrated 10/100 Mbps Ethernet MAC (1) plus two on‑chip USB 2.0 ports with PHYs to support common wired networking and peripheral connectivity.
  • Display/IO  Built‑in display interface controller functionality including keypad support for HMI and control panel designs.
  • Power Management  On‑chip power management features described in the datasheet help manage active and low‑power modes to optimize system power consumption.
  • Package and Mounting  400‑LFBGA package (17 × 17 mm, 0.8 mm pitch) supplied in a surface‑mount form factor for high‑density PCB integration.
  • Qualification and Environmental  Industrial qualification with an operating temperature range of −40°C to 85°C and RoHS compliance.
  • Additional Interfaces  Common peripheral interfaces including I2C for sensor and control integration.

Typical Applications

  • Human Machine Interface (HMI)  Use the i.MX25 core and keypad/display controllers to drive operator panels and graphical remote controls in industrial equipment.
  • Residential and Commercial Control Panels  Integrated Ethernet and USB connectivity plus industrial temperature range make the part suitable for control and monitoring panels.
  • Residential Gateway / Smart Metering  On‑chip 10/100 Ethernet and USB interfaces support networked gateway and metering communication functions.
  • Handheld Scanners and Printers  Compact package and memory flexibility allow integration into portable scanning and printing devices that require reliable embedded processing.
  • Point‑of‑Sale and Medical Devices  Designed for electronic point‑of‑sale terminals and patient‑monitoring devices where industrial qualification and documented package information are important.

Unique Advantages

  • Highly integrated connectivity: Integrated 10/100 Mbps Ethernet MAC and two USB 2.0 PHYs reduce external component count and simplify board design.
  • Memory flexibility: Support for LPDDR, DDR and DDR2 memory controllers enables designers to choose memory types that match cost and performance targets.
  • Industrial temperature operation: Specified operation from −40°C to 85°C supports deployment in demanding environments.
  • Compact LFBGA packaging: 400‑LFBGA (17 × 17 mm) provides a high‑density surface‑mount solution for space‑constrained applications.
  • Documented platform: Part of the i.MX25 series with comprehensive datasheet and package information for layout, thermal and electrical design guidance.
  • Integrated power management: On‑chip power management features described in the datasheet enable efficient active and low‑power modes for longer system life and lower energy use.

Why Choose MCIMX253CJM4A?

The MCIMX253CJM4A positions itself as a practical choice for embedded designers needing a 400 MHz ARM926EJ‑S core combined with integrated networking and USB connectivity, flexible memory interface options and industrial temperature qualification. Its compact 400‑LFBGA package and on‑chip power management make it suitable for a range of space‑ and power‑sensitive applications.

As a member of the i.MX 25 series, the device is supported by detailed datasheet content and package documentation, helping engineers accelerate hardware bring‑up and system integration for industrial and embedded applications.

Request a quote or submit an inquiry to obtain pricing and availability for MCIMX253CJM4A and to discuss integration details for your design requirements.

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