MCIMX253DVM4
| Part Description |
ARM926EJ-S Microprocessor IC i.MX25 1 Core, 32-Bit 400MHz 400-LFBGA (17x17) |
|---|---|
| Quantity | 340 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 253 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 400-LFBGA (17x17) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -20°C – 70°C | Package / Case | Tray | ||
| Speed | 400MHz | Voltage | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V |
Overview of MCIMX253DVM4 – IC MPU I.MX25 400MHZ 400LFBGA
The MCIMX253DVM4 is an NXP Semiconductors i.MX 253 series applications processor based on a single ARM926EJ-S 32‑bit core running at up to 400 MHz. It combines a proven ARM core implementation with integrated system peripherals and on‑chip memory controllers to address embedded consumer and industrial designs.
Targeted use cases include human‑machine interfaces, residential and commercial control panels, gateways and handheld devices where a balance of performance, integration and power management is required. The device offers integrated Ethernet and USB PHYs plus support for common external memory types to simplify system design.
Key Features
- Core The processor implements an ARM926EJ-S 32‑bit core running at up to 400 MHz for deterministic embedded control and application processing.
- Memory controllers On‑chip controllers support LPDDR, DDR and DDR2 memory interfaces, including support for DDR2 up to 133 MHz as documented in the device datasheet.
- Connectivity Integrated 10/100 Mbps Ethernet MAC (1) and two on‑chip USB 2.0 PHYs provide common wired networking and USB device/host connectivity without separate PHY components.
- Display / UI Includes display interface controllers for keypad-driven user interfaces suitable for control panels and remote controls.
- Power management The device features a power‑efficient ARM core implementation and advanced on‑chip power management mechanisms to reduce system power in active and low‑power modes.
- Package & mounting Supplied in a 400‑LFBGA package (17 × 17 mm, 0.8 mm pitch) for compact surface‑mount PCB designs.
- Operating range Qualified for consumer applications with an operating temperature range of −20 °C to 70 °C.
- Graphics acceleration No dedicated graphics acceleration—suitable for embedded HMI and control applications that do not require GPU offload.
Typical Applications
- Graphical remote controls Drives keypad‑based user interfaces and embedded logic for remote control devices.
- Human‑Machine Interfaces (HMI) Implements control and display logic for industrial or commercial panels where integrated connectivity and memory support matter.
- Residential gateway and smart metering Provides processing, Ethernet and USB connectivity needed for residential gateway or smart metering platforms.
- Handheld scanners and printers Supports embedded control and host I/O tasks in portable scanning and printing equipment.
- Point‑of‑sale and patient‑monitoring devices Suitable for POS terminals and medical monitoring equipment in consumer/industrial temperature ranges where integrated peripherals reduce BOM complexity.
Unique Advantages
- Highly integrated connectivity: Integrated 10/100 Ethernet MAC and two USB 2.0 PHYs reduce external component count and simplify board design.
- Flexible memory support: On‑chip controllers for LPDDR, DDR and DDR2 (including documented DDR2 support to 133 MHz) allow designers to select memory types that match performance and cost targets.
- Proven ARM core: The ARM926EJ‑S core delivers a deterministic 32‑bit processing environment at up to 400 MHz for embedded control and application tasks.
- Power management capabilities: Built‑in power management features help minimize system power in active and various low‑power modes, aiding battery‑aware and low‑power system designs.
- Compact BGA packaging: The 400‑LFBGA (17 × 17 mm) package provides high I/O density in a compact footprint for space‑constrained embedded boards.
- Designed for consumer and industrial products: Device features and documented applications target a wide range of embedded products from control panels to handheld devices.
Why Choose MCIMX253DVM4?
The MCIMX253DVM4 positions itself as a balanced embedded applications processor that pairs a proven ARM926EJ‑S core with integrated Ethernet and USB PHYs, flexible external memory support, and on‑chip power management. Its package and peripheral set are optimized for compact consumer and industrial systems that need reliable connectivity and deterministic performance.
This part is well suited to designers building HMIs, gateways, portable terminals and control panels who need a single‑chip solution that reduces BOM complexity while supporting common memory and I/O interfaces. The documented device features and package details support robust board‑level integration and long‑term design planning.
Request a quote or submit a product inquiry to get pricing, lead‑time and support information for the MCIMX253DVM4. Our team will respond with the details you need to evaluate this processor for your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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