MCIMX257CJM4AR2

IC MPU I.MX25 400MHZ 400LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX25 1 Core, 32-Bit 400MHz 400-LFBGA (17x17)

Quantity 386 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 257
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package400-LFBGA (17x17)Display & Interface ControllersKeypad, LCD, Touchscreen
ECCN5A992CEthernet10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case400-LFBGARAM ControllersLPDDR, DDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed400MHzSupplier Device Package400-LFBGA (17×17)
USBUSB 2.0 + PHY (2)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX257CJM4AR2 – IC MPU I.MX25 400MHZ 400LFBGA

The MCIMX257CJM4AR2 is an NXP Semiconductors i.MX25 series multimedia applications processor based on a single ARM926EJ-S core running at up to 400 MHz. It combines processor performance with integrated system peripherals and advanced power management to address embedded and industrial designs.

Designed for embedded human-machine interfaces and connected control applications, the device delivers integrated connectivity and flexible memory support while operating across an industrial temperature range of −40°C to 85°C.

Key Features

  • Core & Performance ARM926EJ-S single 32-bit core running at up to 400 MHz, delivering deterministic embedded processing for control and HMI tasks.
  • Memory Interfaces On-chip controllers supporting LPDDR, DDR and DDR2 memory technologies, with datasheet guidance for DDR2 operation up to 133 MHz.
  • Connectivity & Peripherals Integrated 10/100 Mbps Ethernet MAC and two USB 2.0 controllers with on-chip PHYs provide wired networking and host/device USB connectivity. Additional peripheral support includes a CAN interface.
  • Display & Human Interface Controllers for keypad, LCD and touchscreen interfaces for embedded UIs and control panels.
  • Power Management Built-in power management features reduce system power in active and low-power modes, as described in the i.MX25 technical documentation.
  • Package & Mounting 400-LFBGA surface-mount package (17 × 17 mm, 0.8 mm pitch) suitable for compact embedded boards.
  • Industrial Qualification & Temperature Range Qualified for industrial applications with an operating temperature range of −40°C to 85°C and RoHS compliance.

Typical Applications

  • Graphical Remote Controls — Drive LCDs and touch interfaces while handling remote-control logic and communication.
  • Human Machine Interface (HMI) — Power industrial and commercial control panels with keypad, touchscreen and display support.
  • Residential and Commercial Control Panels — Integrate local UI, Ethernet connectivity and peripheral control in compact panels.
  • Point-of-Sale and Handheld Devices — Provide processing, USB connectivity and peripheral interfaces for scanners, printers and POS terminals.
  • Embedded Gateways and Metering — Use built-in Ethernet and CAN with flexible memory options for connected metering and gateway devices.

Unique Advantages

  • Highly Integrated Connectivity: Integrated 10/100 Mbps Ethernet MAC plus two USB 2.0 controllers with on-chip PHYs reduce external component count and simplify system designs.
  • Flexible Memory Support: On-chip controllers for LPDDR, DDR and DDR2 (DDR2 supported to 133 MHz per datasheet) enable a range of performance and cost trade-offs.
  • Industrial Temperature Support: −40°C to 85°C rating and industrial qualification make the device suitable for harsh embedded environments.
  • Compact LFBGA Package: 400-LFBGA (17×17 mm, 0.8 mm pitch) offers a high-density footprint for space-constrained boards.
  • Power Management Features: Integrated power management capabilities documented in the i.MX25 datasheet help lower system power in active and low-power modes.
  • Manufacturer Documentation: Supported by NXP Semiconductors’ i.MX25 technical documentation for integration and board-level design guidance.

Why Choose MCIMX257CJM4AR2?

The MCIMX257CJM4AR2 positions processor performance, peripheral integration and industrial-grade robustness together in a compact LFBGA package. Its ARM926EJ-S core at up to 400 MHz, combined with integrated Ethernet, dual USB PHYs, CAN and flexible memory interfaces, addresses a wide range of embedded HMI, control and connected applications.

This part is well suited to developers and OEMs building industrial and general embedded products that require documented technical detail, compact mounting, and support for common memory and peripheral interfaces backed by NXP Semiconductors’ i.MX25 documentation.

Request a quote or submit your RFQ to receive pricing and availability information for the MCIMX257CJM4AR2.

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