MCIMX257DJM4A

IC MPU I.MX25 400MHZ 400LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX25 1 Core, 32-Bit 400MHz 400-LFBGA (17x17)

Quantity 867 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 257
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package400-LFBGA (17x17)Display & Interface ControllersKeypad, LCD, Touchscreen
ECCN5A992CEthernet10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-20°C ~ 70°C (TA)
Package / Case400-LFBGARAM ControllersLPDDR, DDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed400MHzSupplier Device Package400-LFBGA (17×17)
USBUSB 2.0 + PHY (2)Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Overview of MCIMX257DJM4A – IC MPU I.MX25 400MHZ 400LFBGA

The MCIMX257DJM4A is an NXP i.MX25 applications processor built around a single ARM926EJ-S 32‑bit core running at up to 400 MHz. It combines a power‑efficient CPU implementation with integrated peripherals to serve embedded and industrial-class human‑machine and connectivity applications.

Targeted use cases include graphical remote controls, HMI panels, residential and commercial control systems, gateways and handheld devices that require a balanced mix of performance, low power and on‑chip integration.

Key Features

  • Core  Single ARM926EJ‑S 32‑bit core operating up to 400 MHz, offering deterministic processing for embedded control and user‑interface tasks.
  • Memory Controllers  On‑chip controllers for LPDDR, DDR and DDR2 memory; datasheet references support for DDR2 up to 133 MHz to enable responsive system memory performance.
  • Connectivity  Integrated 10/100 Mbps Ethernet MAC and support for CAN, providing common wired network and fieldbus options for embedded systems.
  • USB Subsystem  Two USB 2.0 controllers with on‑chip PHYs for host/device connectivity and peripheral interfaces without external PHY components.
  • Display and Input  On‑chip display interface controllers for LCD, keypad and touchscreen integration suitable for HMI and control panels.
  • Power Management  Advanced power management features and a power‑efficient ARM core design to minimize system power consumption across active and low‑power modes (described in the datasheet).
  • Package and Mounting  400‑lead LFBGA package (17 × 17 mm, 0.8 mm pitch) in a surface‑mount form factor for compact system designs.
  • Environmental and Qualification  RoHS compliant; operating temperature range specified as −20 °C to 70 °C and listed qualification level as Consumer in the product data.

Typical Applications

  • Human‑Machine Interfaces (HMI)  Drives LCD screens, touch input and keypad interfaces for control panels and operator displays.
  • Residential and Commercial Control Panels  Provides processing, connectivity and memory support for automation, metering gateways and building control devices.
  • Handheld Scanners and Printers  Offers a compact processing platform with USB and memory interfaces suited to portable scanning and printing peripherals.
  • Point‑of‑Sale Terminals  Integrates Ethernet and USB connectivity for transaction devices requiring reliable I/O and user interfaces.

Unique Advantages

  • Highly integrated connectivity: Integrated 10/100 Ethernet MAC plus two USB 2.0 PHYs reduce external component count and simplify board design.
  • Flexible memory support: On‑chip controllers for LPDDR, DDR and DDR2 (up to 133 MHz DDR2 supported per datasheet) enable a range of memory configurations to match application cost and performance targets.
  • Power‑aware architecture: Advanced power management features and a power‑efficient ARM926EJ‑S core help lower system power in both active and low‑power modes.
  • Embedded interface mix: Built‑in display, keypad and touchscreen controllers plus CAN support make the device suitable for HMI and control applications without extensive external glue logic.
  • Compact, surface‑mount package: 400‑LFBGA (17 × 17 mm) provides a dense, manufacturable footprint for space‑constrained designs.
  • Compliance and temperature range: RoHS compliance and a −20 °C to 70 °C operating range align the device with typical consumer and embedded environmental requirements.

Why Choose MCIMX257DJM4A?

The MCIMX257DJM4A positions itself as a balanced, integrated applications processor for embedded designs that require a moderate performance MCU with robust peripheral integration. Its ARM926EJ‑S core at up to 400 MHz, combined with on‑chip Ethernet, dual USB PHYs and flexible memory controllers, delivers a compact platform for HMI, gateway, handheld and control applications.

Designed to support general embedded and industrial markets while carrying a consumer qualification, this device is suited to developers seeking a power‑efficient processing element that reduces external BOM and accelerates time to market through integrated interfaces and on‑chip system features.

Request a quote or submit a product inquiry to evaluate the MCIMX257DJM4A for your next embedded design.

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