MCIMX27LMOP4A

IC MPU I.MX27 400MHZ 473LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX27 1 Core, 32-Bit 400MHz 473-LFBGA (19x19)

Quantity 990 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 27
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SAHARAH2Core ProcessorARM926EJ-SDevice Package473-LFBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case473-LFBGARAM ControllersDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Speed400MHzSupplier Device Package473-LFBGA (19×19)USBUSB 2.0 + PHY (3)
Voltage – I/O2.0V, 2.5V, 2.7V, 3.0V

Overview of MCIMX27LMOP4A – IC MPU I.MX27 400MHZ 473LFBGA

The MCIMX27LMOP4A is an i.MX27-series multimedia application processor built around a single ARM926EJ-S 32-bit core running at up to 400 MHz. It targets embedded multimedia and portable devices that require a balance of processing performance and low power consumption.

Designed for integration into industrial-grade applications, the device combines on-chip memory/cache, display and interface controllers, hardware security modules and low-power design techniques to support compact, battery-powered and connected designs.

Key Features

  • Core — ARM926EJ-S 32-bit processor core operating at up to 400 MHz, provided as a single core for deterministic embedded performance.
  • Memory and Bus — DDR memory controller for system memory interfacing; on-chip cache architecture referenced in the i.MX27 datasheet.
  • Security Co-processor — SAHARAH2 security coprocessor plus hardware security features including cryptography engines, a random number generator, RTIC, secure fusebox and secure memory.
  • Display and Graphics — Integrated display interface controllers supporting keypad and LCD, with graphics acceleration capability.
  • Connectivity — 10/100 Mbps Ethernet interface (1); USB 2.0 with integrated PHY (listed as "USB 2.0 + PHY (3)"); additional 1-Wire interface for simple device connectivity.
  • Low-Power Design — On-chip low-power techniques noted in the datasheet (DPTC, power gating and clock gating) and manufactured in 90 nm technology with dual Vt for reduced leakage.
  • Package and Mounting — 473-LFBGA surface-mount package in a 19×19 mm footprint.
  • Qualification and Temperature — Industrial qualification with operating temperature range of −40 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Feature-rich cellular phones — Integrate multimedia, display and security functionality for handheld communication devices.
  • Portable media players and mobile gaming machines — Provide processing and graphics acceleration for media playback and interactive applications while conserving battery life.
  • Personal digital assistants (PDAs) and wireless PDAs — Support user interfaces, display control and secure data handling in compact embedded systems.
  • Portable consumer electronics — Suitable for devices such as portable DVD players and digital cameras that require integrated interfaces and low-power operation.

Unique Advantages

  • Integrated multimedia and display support — On-chip display controllers and graphics acceleration reduce external component count and simplify user-interface designs.
  • Embedded security framework — Built-in cryptography, RNG, RTIC, secure fusebox and secure memory provide hardware-backed security for protected applications.
  • Broad connectivity — Ethernet and USB 2.0 with PHY plus a 1-Wire interface enable wired networking and peripheral integration without extensive external logic.
  • Industrial temperature range — −40 °C to 85 °C qualification supports deployment in harsher environments and extended-temperature applications.
  • Low-power architecture — Power-saving techniques described in the datasheet (DPTC, power gating, clock gating) and 90 nm process help optimize battery-powered product designs.
  • Compact BGA packaging — 473-LFBGA (19×19 mm) surface-mount package supports high-density board designs.

Why Choose MCIMX27LMOP4A?

The MCIMX27LMOP4A combines a proven ARM926EJ-S core at 400 MHz with a rich set of integrated peripherals and hardware security features in an industrially qualified package. Its mix of display interfaces, connectivity options and low-power design makes it well suited for embedded multimedia, portable and industrial applications that require secure, reliable operation across a wide temperature range.

For designs that prioritize integration, deterministic embedded performance and robust security capabilities, this i.MX27-family device offers a compelling platform to reduce bill-of-materials and accelerate time-to-market while meeting industrial operating requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the MCIMX27LMOP4A and to discuss integration details for your project.

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