MCIMX283CVM4C

IC MPU I.MX28 454MHZ 289MAPBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX28 1 Core, 32-Bit 454MHz 289-MAPBGA (14x14)

Quantity 1,770 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 283
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPData; DCPCore ProcessorARM926EJ-SDevice Package289-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCD, TouchscreenECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case289-LFBGARAM ControllersLVDDR, LVDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Hardware ID
Speed454MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX283CVM4C – IC MPU I.MX28 454MHZ 289MAPBGA

The MCIMX283CVM4C is an industrial-grade applications processor from NXP Semiconductors based on a single ARM926EJ-S core running at up to 454 MHz. It is a low-power, high-performance embedded microprocessor designed for industrial and consumer embedded markets where integration, power management and peripheral support are key.

Built with integrated power management, on-chip SRAM and flexible external memory interfaces, the device targets human‑machine interfaces, industrial controls and battery‑powered products requiring robust temperature support (−40 °C to 85 °C) and a compact 289‑MAPBGA (14 × 14 mm) package.

Key Features

  • CPU Core & Performance  ARM926EJ-S single 32‑bit core running at up to 454 MHz for deterministic embedded processing.
  • On‑chip Memory  Includes 128‑Kbyte on‑chip SRAM to reduce external RAM requirements for small‑footprint RTOS designs.
  • External Memory Support  Memory controller support for LVDDR, LVDDR2 and DDR2 to interface with a range of external memory configurations.
  • Integrated Power Management  On‑chip PMU with a triple‑output DC‑DC switching converter and multiple linear regulators providing device and I/O power sequencing and battery charging capability for Li‑Ion batteries.
  • Connectivity  10/100 Mbps Ethernet (1), USB 2.0 with integrated PHY (2 ports), and I2C for a variety of peripheral connections.
  • Security  Boot security, cryptography and a hardware ID for device authentication and secure boot workflows.
  • Co‑processor  Data Co-processor (DCP) for offloading cryptographic and data tasks from the main CPU.
  • Display & HMI Interfaces  Controllers for keypad, LCD and touchscreen integration suitable for user interface applications.
  • Industrial Qualification & Temperature Range  Qualified for industrial environments with an operating temperature range of −40 °C to 85 °C.
  • Package & Mounting  289‑MAPBGA package (14 × 14 mm, 0.8 mm pitch), surface‑mount.
  • RoHS Compliance  RoHS‑compliant device construction.

Typical Applications

  • Human‑Machine Interfaces (HMI)  Drives industrial and home HMI panels with LCD and touchscreen support and integrated peripheral control.
  • Industrial Control & Automation  Suitable for PLCs, I/O control modules and factory robotics display/controllers where robust temperature and power sequencing are required.
  • Portable Medical & Handheld Devices  Targets patient monitoring and portable diagnostic equipment using on‑chip SRAM and battery charging capability for compact, battery‑powered designs.
  • Smart Energy & Metering  Ideal for smart meters and energy gateways that require Ethernet connectivity and secure boot/cryptography features.
  • Media Gateways & Phones  Supports media phones and gateways with integrated USB and Ethernet interfaces for networked audio and control functions.

Unique Advantages

  • Highly Integrated Power Subsystem: Integrated PMU with DC‑DC and linear regulators simplifies board power design and provides power sequencing and Li‑Ion charging capability.
  • Reduced External Memory Needs: 128‑Kbyte on‑chip SRAM helps minimize BOM and board area for small RTOS footprints.
  • Flexible Memory Connectivity: Support for LVDDR, LVDDR2 and DDR2 enables designers to choose memory options that balance cost and performance.
  • Industrial Ready: Industrial qualification and −40 °C to 85 °C operating range support deployments in demanding environments.
  • Broad Peripheral Set: Integrated Ethernet, dual USB 2.0 PHY, I2C and display interfaces reduce the need for external controllers and simplify system integration.
  • Security and Offload: Built‑in boot security, cryptography and a dedicated Data Co‑processor (DCP) enhance device security while offloading processing from the main core.

Why Choose MCIMX283CVM4C?

The MCIMX283CVM4C positions itself as a compact, industrial‑grade applications processor combining an ARM926EJ‑S core at up to 454 MHz with integrated power management, on‑chip SRAM and broad peripheral support. Its combination of security features, flexible memory interfaces and integrated PMU makes it well suited for embedded designs that require reliable power sequencing, battery charging and robust environmental performance.

This device is appropriate for engineers developing HMIs, industrial controllers, handheld medical devices, smart energy products and networked media gateways who value reduced external BOM, integrated power functionality and industrial temperature qualification backed by NXP Semiconductors' i.MX28 family documentation.

Request a quote or submit an inquiry to obtain pricing, availability and technical support for the MCIMX283CVM4C. Our team can provide delivery and procurement details to help move your design forward.

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