MIMX8ML8CVNKZAB

IC MPU I.MX8ML 1.6GHZ 548LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 4 Core, 64-Bit 1.6GHz 548-LFBGA (15x15)

Quantity 1,148 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8ML
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53Device Package548-LFBGA (15x15)
Display & Interface ControllersMIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case548-LFBGARAM ControllersDDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, RDC
Speed1.6GHzSupplier Device Package548-LFBGA (15×15)USBUSB 2.0 + PHY (2), USB 3.0 + PHY (2)

Overview of MIMX8ML8CVNKZAB – IC MPU I.MX8ML 1.6GHZ 548LFBGA

The MIMX8ML8CVNKZAB is an ARM® Cortex®-A53 based microprocessor from the i.MX 8ML family, featuring a 4-core, 64-bit CPU running at up to 1.6 GHz in a 548-LFBGA (15 × 15 mm) package. It integrates high-speed memory controllers, multimedia-capable display interfaces, multi-gigabit connectivity and on-chip co-processors to address embedded system requirements.

Qualified for industrial use and specified for operation from −40 °C to 105 °C, this device is intended for industrial and embedded applications that require performance, connectivity and platform-level security in a compact surface-mount package.

Key Features

  • Core Processor 4-core ARM® Cortex®-A53, 64-bit architecture running at up to 1.6 GHz for application-level processing.
  • Co-processors and Accelerators Integrated ARM® Cortex®-M7 and multimedia engines including NEON™ MPE and Hi-Fi4 DSP for real-time control and media processing tasks.
  • Memory Support On-chip controllers for DDR4 and LPDDR4 memory technologies to support high-bandwidth system memory configurations.
  • Graphics & Display Graphics acceleration and display interface controllers including MIPI-CSI and MIPI-DSI for rich user interfaces and camera input.
  • High-speed Connectivity Dual Gigabit Ethernet interfaces and multiple USB ports (USB 2.0 + PHY ×2, USB 3.0 + PHY ×2) for networking and peripheral connectivity.
  • Automotive/Field Networks CAN interface support for integration with control networks and fieldbus environments.
  • Security & System Isolation Hardware security features including ARM TrustZone (TZ), CAAM and RDC for platform-level security and resource domain control.
  • Industrial Qualification & Temperature Range Industrial-grade qualification and specified operation from −40 °C to 105 °C for deployment in demanding environments.
  • Package & Mounting 548-LFBGA (15 × 15 mm) surface-mount package optimized for compact embedded designs.

Typical Applications

  • Industrial Automation Use in controllers and embedded appliances where industrial qualification, CAN support and wide temperature operation are required.
  • Human-Machine Interfaces (HMI) Drives rich graphical displays and touchscreen interfaces using MIPI-DSI and on-chip graphics acceleration.
  • Networking & Edge Gateways Dual GbE and multiple USB PHYs enable deployment in gateway, router and edge compute applications requiring robust connectivity.
  • Camera and Vision Systems MIPI-CSI support and multimedia co-processors make the device suitable for camera interfacing and vision-enabled embedded systems.

Unique Advantages

  • High-performance multi-core processing: Quad-core ARM Cortex-A53 at 1.6 GHz provides application-level compute for multimedia and control workloads.
  • Integrated multimedia and real-time engines: On-chip Cortex-M7 plus NEON and Hi-Fi4 DSP reduce external accelerator requirements and simplify system design.
  • Comprehensive connectivity: Dual GbE, USB 3.0/2.0 PHYs and CAN deliver a range of high-speed and field-bus interfaces without separate controllers.
  • Platform security built in: ARM TrustZone, CAAM and RDC provide hardware-level primitives to partition and protect system resources.
  • Industrial-ready: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh environments.
  • Compact package: 548-LFBGA (15 × 15 mm) package enables dense, space-constrained board designs while supporting high pin counts.

Why Choose MIMX8ML8CVNKZAB?

MIMX8ML8CVNKZAB combines multi-core application processing, integrated real-time co-processing and broad peripheral integration to address embedded industrial designs that demand performance, connectivity and security. Its support for DDR4/LPDDR4 memory, dual GbE, multiple USB PHYs, MIPI display and camera interfaces and built-in security make it suitable for HMI, gateway, vision and automation platforms.

With industrial qualification and a wide operating temperature range, this device is positioned for long-term deployment in harsh environments where reduced BOM, fewer external components and platform-level security contribute to a more robust and maintainable solution.

Request a quote or submit an inquiry to obtain pricing and availability for MIMX8ML8CVNKZAB and discuss how it fits your embedded design requirements.

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