MIMX8ML8DVNLZAB

IC MPU I.MX8ML 1.8GHZ 548LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 4 Core, 64-Bit 1.8GHz 548-LFBGA (15x15)

Quantity 516 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8ML
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53Device Package548-LFBGA (15x15)
Display & Interface ControllersMIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case548-LFBGARAM ControllersDDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, RDC
Speed1.8GHzSupplier Device Package548-LFBGA (15×15)USBUSB 2.0 + PHY (2), USB 3.0 + PHY (2)

Overview of MIMX8ML8DVNLZAB – IC MPU I.MX8ML 1.8GHZ 548LFBGA

The MIMX8ML8DVNLZAB is an NXP i.MX 8ML-series application processor built on a quad ARM® Cortex®-A53 64-bit architecture running up to 1.8 GHz. It integrates heterogeneous processing elements and high-speed I/O to target vision, multimedia and embedded automation applications.

Designed for solutions that require compute performance, multimedia and system-level integration, this device combines multi-core application processing with dedicated co-processors, memory controller flexibility and a compact 548-LFBGA (15 × 15 mm) package for surface-mount assembly.

Key Features

  • CPU Cores  Quad ARM® Cortex®-A53 64-bit cores at up to 1.8 GHz for application-level processing.
  • Co-processors & DSP  Integrated ARM® Cortex®-M7 for real-time control and multimedia acceleration including NEON™ MPE and Hi-Fi4 DSP elements.
  • NPU and Vision Engine  Family-level capability includes an integrated NPU and a vision engine with multi-camera inputs and an ISP (as described in the series datasheet) to accelerate machine learning inference and image processing workflows.
  • Memory  DDR4 and LPDDR4 memory controller support for high-bandwidth system memory configurations.
  • Graphics & Multimedia  Graphics acceleration and advanced multimedia features are provided at the series level, including video encode/decode and 2D/3D acceleration (per the datasheet).
  • High-speed Interfaces  Dual Gigabit Ethernet, USB 3.0 + PHY (2) and USB 2.0 + PHY (2) enable high-throughput connectivity options.
  • Display & Camera  MIPI-CSI and MIPI-DSI display/camera interfaces for camera and panel integration.
  • Automotive/Field Networks  CAN interface available for robust control and gateway applications.
  • Security  Hardware security features including ARM TrustZone (ARM TZ), CAAM and Resource Domain Controller (RDC) for system partitioning and secure services.
  • Package & Mounting  548-LFBGA (15 × 15 mm) surface-mount package for compact, board-level integration.
  • Operating Temperature  Rated for operation from 0 °C to 95 °C.
  • Qualification  Consumer qualification as specified in the product data.
  • Compliance  RoHS compliant.

Typical Applications

  • Vision Systems and Machine Learning: Leverage the integrated NPU and vision engine for ML inference, multi-camera input processing and real-time image pipelines.
  • Advanced Multimedia Devices: Use the processor’s graphics acceleration and multimedia capabilities for video encode/decode, UI rendering and immersive audio interfaces.
  • Industrial Automation and Control: Combine the Cortex‑M7 real-time core and CAN connectivity for deterministic control, gateway functions and sensor interfacing.
  • Edge Gateways and Connectivity Appliances: Dual Gigabit Ethernet and multiple high-speed USB ports enable data aggregation, low-latency networking and peripheral connectivity.

Unique Advantages

  • Heterogeneous compute in one device: Quad Cortex‑A53 application cores plus an integrated Cortex‑M7 and DSP/NPU elements reduce system BOM and simplify partitioning of real-time, ML and application tasks.
  • Integrated security primitives: ARM TrustZone, CAAM and RDC help implement secure boot, cryptographic services and domain separation without external security ICs.
  • Flexible memory and display support: DDR4/LPDDR4 controller options and MIPI display/camera interfaces support a range of memory and multimedia configurations for performance-tuned designs.
  • Comprehensive connectivity: Dual GbE, USB 3.0/2.0, and CAN provide multiple high-speed and field-bus options for networking and peripheral integration.
  • Compact, production-ready package: 548-LFBGA (15 × 15 mm) surface-mount package balances integration density with manufacturability for volume designs.
  • Documented platform: The series-level datasheet and technical documentation provide detailed electrical and package information to accelerate development and integration.

Why Choose MIMX8ML8DVNLZAB?

The MIMX8ML8DVNLZAB positions itself as a high-performance, highly integrated application processor for embedded designs that require multi-core compute, vision and multimedia acceleration, and robust I/O. Its combination of ARM® Cortex®-A53 processing, dedicated co-processors, NPU/vision capabilities (as described in the series datasheet), and comprehensive connectivity enables compact, function-rich designs while reducing external component count.

This device is suited to developers building vision-enabled products, multimedia appliances, industrial controllers and edge gateways that benefit from on-chip security, flexible memory interfaces and a compact LFBGA package. Detailed technical documentation included with the i.MX family supports design validation and implementation across production cycles.

Request a quote or submit a procurement inquiry for MIMX8ML8DVNLZAB today to discuss availability, lead times and volume pricing.

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