MIMX8ML6CVNKZAB

IC MPU I.MX8ML 1.8GHZ 548LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 4 Core, 64-Bit 1.8GHz 548-LFBGA (15x15)

Quantity 676 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8ML
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53Device Package548-LFBGA (15x15)
Display & Interface ControllersHTML, LVDS, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case548-LFBGARAM ControllersDDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, RDC
Speed1.8GHzSupplier Device Package548-LFBGA (15×15)USBUSB 2.0 + PHY (2), USB 3.0 + PHY (2)

Overview of MIMX8ML6CVNKZAB – IC MPU I.MX8ML 1.8GHZ 548LFBGA

The MIMX8ML6CVNKZAB is a quad-core, 64-bit ARM® Cortex®-A53 microprocessor running at up to 1.8 GHz in a 548-LFBGA (15×15) surface-mount package. It is industrially qualified and targeted at embedded applications requiring high-performance compute, multimedia and secure connectivity.

Architected for embedded and edge applications, the device pairs Cortex-A53 application cores with integrated co-processors (ARM® Cortex®-M7, NEON™ MPE, Hi-Fi4 DSP) and broad I/O to support vision, multimedia and industrial use cases while meeting industrial temperature requirements.

Key Features

  • Core and Performance  Quad-core ARM® Cortex®-A53, 64-bit architecture running up to 1.8 GHz for multi-threaded application processing.
  • Co-processors and Acceleration  Integrated ARM® Cortex®-M7 and multimedia accelerators including NEON™ MPE and Hi-Fi4 DSP for real-time control and signal-processing offload.
  • Memory Controllers  Supports DDR4 and LPDDR4 memory interfaces to enable high-bandwidth system memory configurations.
  • Display and Camera Interfaces  Display interface support includes LVDS, MIPI-DSI and MIPI-CSI, plus HTML (as provided in product data) for flexible multimedia and imaging system design.
  • Connectivity  Dual Gigabit Ethernet (GbE), multiple USB ports with PHYs (USB 3.0 + PHY ×2, USB 2.0 + PHY ×2) and CAN for wired networking and peripheral connectivity.
  • Graphics and Multimedia  Graphics acceleration and video processing capabilities (as referenced in the series information) for user interfaces and multimedia playback/encoding.
  • Security  Hardware security features include ARM TrustZone (TZ), Cryptographic Acceleration and Assurance Module (CAAM) and Resource Domain Controller (RDC) for system isolation and secure processing.
  • Package and Mounting  548-LFBGA (15×15 mm) surface-mount package suitable for compact embedded board designs.
  • Industrial Qualification and Temperature Range  Industrial-qualified device rated for operation from −40 °C to 105 °C.
  • Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Smart Home and Consumer Devices  Local servers, security systems and multimedia devices leveraging application processing and multimedia interfaces for on-device computing and media handling.
  • Smart City and Surveillance  Safety, crowd or traffic monitoring systems using high-performance compute and imaging interfaces for video processing and streaming.
  • Industrial IoT and Automation  Machine vision, HMI and gateway applications that require real-time control, deterministic interfaces and industrial temperature operation.
  • Smart Retail and POS  Point-of-sale terminals and targeted-advertising kiosks benefitting from integrated multimedia, networking and secure processing capabilities.

Unique Advantages

  • Highly integrated processing stack: Combines quad-core Cortex-A53 application cores with Cortex-M7 co-processor and DSP/NEON accelerators to reduce external components and simplify system partitioning.
  • Broad I/O and high-speed connectivity: Dual GbE, multiple USB 3.0/2.0 PHYs and CAN support diverse networking and peripheral requirements without additional bridge chips.
  • Versatile memory support: DDR4 and LPDDR4 controller support enables scalable memory configurations for performance or power-optimized designs.
  • Industrial-ready reliability: Industrial qualification and −40 °C to 105 °C operating range make the device suitable for demanding embedded environments.
  • On-chip security primitives: ARM TrustZone, CAAM and RDC help enable secure boot, isolated execution and cryptographic acceleration to protect system assets.
  • Compact package footprint: 548-LFBGA (15×15 mm) package supports dense, compact PCB layouts for space-constrained products.

Why Choose MIMX8ML6CVNKZAB?

The MIMX8ML6CVNKZAB delivers a balanced combination of multi-core application performance, real-time co-processing and rich multimedia and connectivity options in an industrial-qualified package. Its integration of application cores, co-processors and hardware security features reduces BOM complexity while addressing the compute and interface demands of modern embedded systems.

This device is well suited for engineers designing industrial IoT, smart city, smart home and embedded multimedia platforms that require reliable operation across temperature extremes, robust networking and secure processing. The platform-level integration supports scalable product roadmaps and streamlined hardware/software development.

Request a quote or submit a sales inquiry to evaluate MIMX8ML6CVNKZAB for your embedded design needs.

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