MIMX8ML3CVNKZAB
| Part Description |
ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.6GHz 548-LFBGA (15x15) |
|---|---|
| Quantity | 611 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8ML |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53 | Device Package | 548-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HTML, LVDS, MIPI-CSI, MIPI-DSI | ECCN | 5A992C | Ethernet | GbE (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 548-LFBGA | RAM Controllers | DDR4, LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, CAAM, RDC | ||
| Speed | 1.6GHz | Supplier Device Package | 548-LFBGA (15×15) | USB | USB 2.0 + PHY (2), USB 3.0 + PHY (2) |
Overview of MIMX8ML3CVNKZAB – ARM Cortex-A53 1.6GHz MPU, 548-LFBGA
The MIMX8ML3CVNKZAB is an industrial-grade microprocessor from NXP's i.MX 8ML family featuring a dual-core ARM® Cortex®-A53 application processor running at up to 1.6 GHz. It combines application cores with a real-time ARM® Cortex®-M7 coprocessor and dedicated multimedia/DSP capabilities to address embedded designs requiring responsive control, multimedia and secure connectivity.
Designed for embedded and industrial markets, this device delivers a balanced mix of compute, graphics and I/O integration — including multi‑display interfaces, dual Gigabit Ethernet, USB 3.0/2.0 and CAN — in a compact 548-LFBGA (15 x 15 mm) package and an extended operating range.
Key Features
- Core and Coprocessors Dual ARM® Cortex®-A53 64-bit cores at up to 1.6 GHz with an integrated ARM® Cortex®-M7 real-time coprocessor and multimedia/DSP engines (NEON™ MPE, Hi-Fi4 DSP) for mixed application and real-time workloads.
- Memory Support Integrated controllers for DDR4 and LPDDR4 memory to support high-bandwidth system memory configurations.
- Multimedia and Graphics Graphics acceleration is provided to support rich user interfaces and display applications; multiple display interfaces include MIPI-DSI, LVDS and HTML-capable controllers along with MIPI-CSI for camera input.
- High-speed Connectivity Dual Gigabit Ethernet ports and multiple USB interfaces (USB 3.0 + PHY ×2, USB 2.0 + PHY ×2) enable high-throughput networking and peripheral connectivity.
- Automotive-style Fieldbus and I/O CAN interface support broadens applicability in industrial networks and control applications.
- Security and System Protection Hardware security features include ARM TrustZone (ARM TZ), CAAM and Resource Domain Controller (RDC) to help implement secure boot, cryptographic acceleration and resource isolation.
- Industrial Qualification and Temperature Range Industrial-qualified device with an operating temperature range of -40 °C to 105 °C for deployment in harsh environments.
- Package 548-LFBGA package in a 15 × 15 mm footprint with 0.5 mm pitch, suitable for surface-mount assembly in compact embedded designs.
Typical Applications
- Industrial Automation: Use as an embedded controller and gateway processor combining real-time control (Cortex‑M7), networking (dual GbE, CAN) and security for factory automation and machine control.
- Vision and Imaging Systems: Leverage MIPI-CSI camera inputs and multimedia/DSP engines for image capture, preprocessing and edge analytics in inspection and vision-guided devices.
- Human-Machine Interfaces (HMI): Drive rich displays and graphics-accelerated user interfaces using MIPI-DSI, LVDS and integrated graphics acceleration.
- Edge Compute and Connectivity Gateways: Combine high-speed Ethernet, USB 3.0 and hardware security to implement secure edge processing and connected gateway functions.
Unique Advantages
- Balanced heterogeneous architecture: Dual Cortex‑A53 application cores together with a Cortex‑M7 coprocessor and DSP blocks provide a flexible platform for mixed application and real‑time tasks.
- Comprehensive I/O integration: Multiple high-speed interfaces including dual GbE, USB 3.0/2.0, CAN and MIPI display/camera ports reduce external bridge components and BOM complexity.
- Industrial-ready thermal and qualification profile: Industrial qualification and an extended -40 °C to 105 °C operating range support deployment in demanding environments.
- Hardware security primitives: ARM TrustZone, CAAM and RDC enable designers to implement secure boot, cryptographic acceleration and domain partitioning without relying solely on software.
- Compact, manufacturable package: 548-LFBGA (15 × 15 mm, 0.5 mm pitch) provides a small footprint for space-constrained boards while remaining compatible with standard surface-mount assembly processes.
Why Choose MIMX8ML3CVNKZAB?
The MIMX8ML3CVNKZAB positions itself as a versatile embedded processor for industrial and edge applications that require a blend of application performance, real-time control and secure connectivity. Its heterogeneous core topology, multimedia/DSP capabilities and broad set of connectivity options enable consolidation of control, vision and HMI functions onto a single device.
For teams developing compact, rugged embedded systems, this industrial-qualified MPU offers scalable performance, integrated security features and a compact BGA footprint that help reduce system complexity and improve long-term maintainability.
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