MIMX8MD6CVAHZAB

IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8MD 2 Core, 64-Bit 1.3GHz 621-FCPBGA (17x17)

Quantity 1,140 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MD
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllerseDP, HDMI, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Speed1.3GHzSupplier Device Package621-FCPBGA (17×17)USBUSB 3.0 (2)

Overview of MIMX8MD6CVAHZAB – ARM Cortex-A53 2-Core 1.3 GHz, 621-FCPBGA

The MIMX8MD6CVAHZAB is an industrial-grade microprocessor IC in the i.MX 8MD series featuring dual ARM® Cortex®-A53 64-bit cores running at up to 1.3 GHz, complemented by an ARM® Cortex®-M4 co‑processor. It is supplied in a 621-FCPBGA (17 × 17 mm) package and is qualified for industrial temperature operation from -40 °C to 105 °C.

Designed for connected streaming audio/video devices, scanning and imaging systems, and other high-performance, low-power embedded applications, this device integrates compute, multimedia interfaces, memory controller flexibility, and on-chip security to simplify system design and accelerate time to market.

Key Features

  • Core and Processing Dual ARM® Cortex®-A53 64-bit application cores at up to 1.3 GHz with an ARM® Cortex®-M4 co-processor for low-power real-time tasks.
  • Memory Subsystem Integrated DRAM controller supporting DDR3L, DDR4 and LPDDR4 memory types for flexible memory system design.
  • Multimedia and Graphics Graphics acceleration and multiple display/camera interfaces including eDP, HDMI, MIPI-DSI and MIPI-CSI to support advanced UIs and image capture pipelines.
  • High-Speed I/O Dual USB 3.0 ports and Gigabit Ethernet (GbE) provide high-throughput connectivity for peripherals and networks.
  • Security and System Trust Hardware security features including ARM TrustZone (ARM TZ), CAAM, HAB, RDC, RTC, SJC and SNVS to support secure boot, cryptography and runtime isolation.
  • System Interfaces External bus interfaces (EBI/EMI) and a variety of peripheral connectivity options to integrate with sensors, storage and wireless modules.
  • Package and Reliability 621-FCPBGA (17 × 17 mm) surface-mount package targeted for industrial applications with a specified operating range of -40 °C to 105 °C.

Typical Applications

  • Connected Streaming Devices Multimedia-capable streaming players and set-top devices benefiting from graphics acceleration and multiple display outputs.
  • Scanning & Imaging Systems Camera and scanning solutions using MIPI-CSI inputs and on-chip processing for image capture and pre-processing.
  • Human-Machine Interfaces (HMIs) Industrial and commercial display controllers leveraging HDMI, eDP and MIPI-DSI outputs for responsive user interfaces.
  • Embedded Networking Appliances Networked devices that require GbE and high-speed USB connectivity alongside secure boot and cryptographic services.

Unique Advantages

  • Balanced Multi-core Performance: Dual 64-bit Cortex-A53 cores at 1.3 GHz plus a Cortex-M4 co-processor separate application and real-time workloads for efficient system partitioning.
  • Flexible Memory Options: Support for DDR3L, DDR4 and LPDDR4 DRAM lets designers choose memory types that match performance, power and cost targets.
  • Rich Multimedia I/O: Multiple display and camera interfaces and graphics acceleration streamline multimedia system designs and reduce external component needs.
  • Comprehensive Security: On-chip security blocks (ARM TZ, CAAM, HAB, RDC, SNVS, etc.) enable secure boot, cryptography and runtime isolation for trusted systems.
  • Industrial Qualification: Specified operating range of -40 °C to 105 °C and industrial qualification support deployment in temperature-demanding environments.

Why Choose MIMX8MD6CVAHZAB?

The MIMX8MD6CVAHZAB positions itself as a versatile, industrial-grade application processor that combines dual 64-bit Cortex-A53 cores, a Cortex-M4 co-processor, flexible memory support and comprehensive multimedia and security features. Its integration of high-speed I/O (USB 3.0, GbE), multiple display/camera interfaces and hardware security accelerators helps reduce BOM and simplify system architecture.

This device is suited to embedded system designers building connected multimedia, imaging, HMI and networked products who require a robust processor platform with industrial temperature capability and a broad set of on-chip peripherals and security primitives. The i.MX 8MD series datasheet details additional electrical, timing and package information to support system design and validation.

Request a quote or submit a purchase inquiry to begin evaluation of MIMX8MD6CVAHZAB for your design needs.

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