MIMX8DX6FVLFZAC

I.MX 8DUALXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 678 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8DX6FVLFZAC – I.MX 8DUALXPLUS 21X21

The MIMX8DX6FVLFZAC is a high-integration embedded microprocessor from NXP’s i.MX 8DX series. It combines ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real-time core in a 3-core, 64-bit architecture delivering a 1.2 GHz A‑core performance and a 264 MHz M4F real-time engine.

Designed for embedded and industrial applications, this device offers multimedia acceleration, broad memory interface support and multiple high-speed I/O options to address HMI, edge compute and industrial control use cases where performance, integration and security are required.

Key Features

  • CPU Architecture  ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F real-time core; 3 cores total, 64-bit architecture with A‑core clock at 1.2 GHz and M4F at 264 MHz.
  • Multimedia and DSP  Integrated multimedia accelerators with NEON and Hi-Fi4 DSP support for audio and media processing workflows.
  • Memory Interfaces  Supports DDR3L and LPDDR4 memory controllers. Datasheet content also references FlexSPI (Quad/Octal), eMMC 5.1, RAW NAND and SD 3.0 interfaces for flexible boot and storage options.
  • Display and Camera  Display and image interfaces include LCD, LVDS, MIPI-CSI and MIPI-DSI to support rich HMI and camera integration.
  • High-speed Connectivity  Dual 10/100/1000 Mbps Ethernet ports and both USB 3.0 OTG + PHY and USB 2.0 OTG + PHY provide wired networking and peripheral connectivity.
  • Automotive-grade Interfaces (CAN)  Integrated CANbus support for robust fieldbus and vehicle/industrial communications.
  • Security Features  Hardware security primitives including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM and Secure Non-Volatile Storage (SNVS) for trusted boot and cryptographic operations.
  • Package and Mounting  609‑FBGA package (21 × 21 mm) in a surface-mount form factor suitable for compact embedded boards.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Automation  Real-time control and deterministic communication leveraging the Cortex‑M4F core together with dual Gigabit Ethernet and CANbus interfaces.
  • Human Machine Interfaces (HMI)  Rich display and camera connectivity (LCD, LVDS, MIPI-DSI/CSI) combined with multimedia acceleration for responsive touch and video-driven interfaces.
  • Edge Compute & Multimedia Gateways  Multi-core processing plus NEON and Hi‑Fi4 DSP capability for local media processing, sensor fusion and protocol bridging.
  • Secure Embedded Systems  Built-in cryptographic engines and TrustZone support for secure boot, data protection and device authentication.

Unique Advantages

  • Balanced Heterogeneous Processing:  AArch64 application cores combined with a Cortex‑M4F real-time core let designers partition heavy compute tasks from deterministic control code.
  • Broad Memory and Storage Options:  Native support for DDR3L and LPDDR4 plus FlexSPI, eMMC and SD interfaces simplifies memory configuration across product lines.
  • Integrated Multimedia and Graphics:  NEON and Hi‑Fi4 DSP support with display and camera interfaces enables compact multimedia-rich designs without extensive external IP.
  • Comprehensive Connectivity:  Dual Gigabit Ethernet, USB 3.0/2.0 OTG and CANbus interface options reduce the need for auxiliary controllers.
  • Hardware Security Building Blocks:  On-chip cryptographic accelerators and secure storage primitives help streamline secure system design and reduce BOM complexity.
  • Compact, Surface-Mount Packaging:  609‑FBGA (21×21 mm) package supports dense PCBs while retaining enterprise-level I/O and features.

Why Choose MIMX8DX6FVLFZAC?

The MIMX8DX6FVLFZAC positions itself as a versatile embedded processor that combines application-class ARM® Cortex®-A53 performance with a Cortex®-M4F real-time domain, comprehensive I/O and robust security features. It is suited for embedded and industrial designs that require a mix of multimedia processing, real-time control and multiple high-speed interfaces.

With flexible memory and storage support, dual Gigabit Ethernet, USB 3.0 and on‑chip security engines, this device offers a strong foundation for scalable, secure products while helping simplify BOM and board-level integration.

Request a quote or submit a product inquiry to check availability, lead times and pricing for the MIMX8DX6FVLFZAC. Our team will respond with the information you need to move your design forward.

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