MIMX8DX6FVLFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 678 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | ||
| Speed | 1.2GHz, 264MHz | Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX6FVLFZAC – I.MX 8DUALXPLUS 21X21
The MIMX8DX6FVLFZAC is a high-integration embedded microprocessor from NXP’s i.MX 8DX series. It combines ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real-time core in a 3-core, 64-bit architecture delivering a 1.2 GHz A‑core performance and a 264 MHz M4F real-time engine.
Designed for embedded and industrial applications, this device offers multimedia acceleration, broad memory interface support and multiple high-speed I/O options to address HMI, edge compute and industrial control use cases where performance, integration and security are required.
Key Features
- CPU Architecture ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F real-time core; 3 cores total, 64-bit architecture with A‑core clock at 1.2 GHz and M4F at 264 MHz.
- Multimedia and DSP Integrated multimedia accelerators with NEON and Hi-Fi4 DSP support for audio and media processing workflows.
- Memory Interfaces Supports DDR3L and LPDDR4 memory controllers. Datasheet content also references FlexSPI (Quad/Octal), eMMC 5.1, RAW NAND and SD 3.0 interfaces for flexible boot and storage options.
- Display and Camera Display and image interfaces include LCD, LVDS, MIPI-CSI and MIPI-DSI to support rich HMI and camera integration.
- High-speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and both USB 3.0 OTG + PHY and USB 2.0 OTG + PHY provide wired networking and peripheral connectivity.
- Automotive-grade Interfaces (CAN) Integrated CANbus support for robust fieldbus and vehicle/industrial communications.
- Security Features Hardware security primitives including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), CAAM and Secure Non-Volatile Storage (SNVS) for trusted boot and cryptographic operations.
- Package and Mounting 609‑FBGA package (21 × 21 mm) in a surface-mount form factor suitable for compact embedded boards.
- Compliance RoHS compliant.
Typical Applications
- Industrial Automation Real-time control and deterministic communication leveraging the Cortex‑M4F core together with dual Gigabit Ethernet and CANbus interfaces.
- Human Machine Interfaces (HMI) Rich display and camera connectivity (LCD, LVDS, MIPI-DSI/CSI) combined with multimedia acceleration for responsive touch and video-driven interfaces.
- Edge Compute & Multimedia Gateways Multi-core processing plus NEON and Hi‑Fi4 DSP capability for local media processing, sensor fusion and protocol bridging.
- Secure Embedded Systems Built-in cryptographic engines and TrustZone support for secure boot, data protection and device authentication.
Unique Advantages
- Balanced Heterogeneous Processing: AArch64 application cores combined with a Cortex‑M4F real-time core let designers partition heavy compute tasks from deterministic control code.
- Broad Memory and Storage Options: Native support for DDR3L and LPDDR4 plus FlexSPI, eMMC and SD interfaces simplifies memory configuration across product lines.
- Integrated Multimedia and Graphics: NEON and Hi‑Fi4 DSP support with display and camera interfaces enables compact multimedia-rich designs without extensive external IP.
- Comprehensive Connectivity: Dual Gigabit Ethernet, USB 3.0/2.0 OTG and CANbus interface options reduce the need for auxiliary controllers.
- Hardware Security Building Blocks: On-chip cryptographic accelerators and secure storage primitives help streamline secure system design and reduce BOM complexity.
- Compact, Surface-Mount Packaging: 609‑FBGA (21×21 mm) package supports dense PCBs while retaining enterprise-level I/O and features.
Why Choose MIMX8DX6FVLFZAC?
The MIMX8DX6FVLFZAC positions itself as a versatile embedded processor that combines application-class ARM® Cortex®-A53 performance with a Cortex®-M4F real-time domain, comprehensive I/O and robust security features. It is suited for embedded and industrial designs that require a mix of multimedia processing, real-time control and multiple high-speed interfaces.
With flexible memory and storage support, dual Gigabit Ethernet, USB 3.0 and on‑chip security engines, this device offers a strong foundation for scalable, secure products while helping simplify BOM and board-level integration.
Request a quote or submit a product inquiry to check availability, lead times and pricing for the MIMX8DX6FVLFZAC. Our team will respond with the information you need to move your design forward.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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