MIMX8DX5GVLFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 947 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | ||
| Speed | 1.2GHz, 264MHz | Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX5GVLFZAC – I.MX 8X FIPS
The MIMX8DX5GVLFZAC is an industrial-grade multicore microprocessor from NXP Semiconductors combining ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real-time core. It provides a 3-core, 64-bit architecture with a 1.2 GHz application-class performance and a 264 MHz real-time core for control tasks.
Designed for embedded and industrial systems, the device integrates high-performance networking, multimedia interfaces and hardware security features while supporting robust operation across an extended temperature range for demanding environments.
Key Features
- Core Architecture — ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F real-time core; 3 cores total, 64‑bit, with application core performance up to 1.2 GHz and Cortex‑M4F at 264 MHz.
- Memory Interfaces — Supports DDR3L SDRAM and LPDDR4 DRAM memory controllers for flexible memory subsystem design.
- Multimedia and Graphics — Graphics acceleration and multimedia co-processors including NEON and Hi‑Fi4 DSP support high-throughput media processing.
- Display and Imaging — Integrated display interface controllers for LCD and LVDS plus MIPI‑CSI and MIPI‑DSI for camera and panel connectivity.
- High‑Speed I/O — One USB 3.0 OTG with PHY and one USB 2.0 OTG with PHY for versatile peripheral and host connectivity.
- Networking — Dual 10/100/1000 Mbps Ethernet ports for gigabit networking and industrial communications.
- Vehicle and Field Interfaces — CANbus interface support for robust fieldbus and vehicle network integration.
- Security and Trust — Hardware security features including 3DES, DES, MD5, SHA, A‑HAB, ARM TrustZone, CAAM and SNVS for secure boot and cryptographic acceleration.
- Package and Mounting — 609‑FBGA package (21×21 mm) supplied in a surface‑mount format for high‑density board designs.
- Industrial Qualification and Temperature — Industrial qualification with an operating temperature range of −40 °C to 125 °C for extended‑temperature deployments.
- RoHS Compliance — Device is RoHS compliant for environmental and regulatory conformance.
Typical Applications
- Industrial Control and Automation — Use dual Gigabit Ethernet, CANbus and extended temperature range for factory automation, PLCs and motion control systems.
- Networking and Communications — Leverage dual 1 GbE ports and USB 3.0 OTG for routers, gateways and secure communication appliances.
- HMI and Embedded Displays — Drive LCD and LVDS panels with MIPI‑DSI and offload graphics tasks using integrated graphics acceleration for user interfaces.
- Vision and Multimedia — Connect cameras via MIPI‑CSI and process multimedia workloads using NEON and Hi‑Fi4 DSP resources for inspection or video analytics.
- Secure Embedded Systems — Apply on‑chip cryptographic engines and secure boot-capable features for secure controllers and payment or access control terminals.
Unique Advantages
- Balanced Application and Real‑Time Processing: Combination of Cortex‑A53 and Cortex‑M4F cores provides high‑performance application processing with a dedicated real‑time controller for deterministic tasks.
- Integrated Connectivity: Dual Gigabit Ethernet, USB 3.0/2.0 OTG and CANbus reduce external components and simplify board design for connectivity‑heavy systems.
- Built‑In Security: Extensive on‑chip security features (A‑HAB, TrustZone, CAAM, SHA/DES/3DES, MD5, SNVS) help implement secure boot and cryptographic services without large external subsystems.
- Industrial Reliability: Industrial qualification and −40 °C to 125 °C operating range support deployment in harsh and temperature‑extreme environments.
- Flexible Memory Options: Support for DDR3L and LPDDR4 memory controllers enables scalable memory configurations for different performance and cost targets.
- Compact, Surface‑Mount Package: 609‑FBGA (21×21) package supports high‑density PCBs and surface‑mount assembly workflows.
Why Choose MIMX8DX5GVLFZAC?
The MIMX8DX5GVLFZAC delivers a combination of 64‑bit multicore performance and real‑time control, broad I/O integration and hardware security tailored for industrial and embedded designs. Its dual Gigabit Ethernet, high‑speed USB, multimedia interfaces and CANbus support make it suitable for connectivity‑centric applications that also demand secure operation and extended temperature resilience.
Built by NXP Semiconductors and offered in a compact 609‑FBGA surface‑mount package, this device is positioned for engineers and product teams designing industrial automation, networking appliances, HMI and secure embedded systems where integration, performance and reliability are key selection criteria.
Request a quote today to discuss pricing, availability and volume options for the MIMX8DX5GVLFZAC.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016