MIMX8DX5CVLFZAC

MIMX8DX5CVLFZAC
Part Description

Microprocessor IC

Quantity 522 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCN5A992CEthernet10/100/1000Mbps (2)Graphics AccelerationYes
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitRAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantUSBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)

Overview of MIMX8DX5CVLFZAC – Microprocessor IC

The MIMX8DX5CVLFZAC is an NXP Semiconductors i.MX 8DX series microprocessor designed for embedded applications that require multi-core processing, advanced multimedia acceleration, and robust connectivity. It combines ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F real-time core to deliver a balanced mix of high-level operating system performance and low-latency real-time control.

Engineered for systems that need integrated graphics, rich I/O and hardware security, this device targets embedded designs such as human-machine interfaces, edge multimedia processing, and connected gateways where performance, integration, and security are key priorities.

Key Features

  • Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-M4F cores provide a 3-core, 64-bit processing configuration suitable for mixed application and real-time workloads.
  • Multimedia and DSP Multimedia coprocessors including NEON and Hi-Fi4 DSP support accelerate media processing and signal workloads.
  • Memory Interfaces On-chip controllers for DDR3L SDRAM and LPDDR4 DRAM offer flexible memory options for high-bandwidth and low-power designs.
  • Display and Camera Interfaces Support for LCD, LVDS, MIPI-CSI and MIPI-DSI enables rich display and camera subsystem integration for HMI and vision applications.
  • High-Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and both USB 3.0 OTG + PHY and USB 2.0 OTG + PHY interfaces provide a wide range of wired networking and USB connectivity options.
  • Security Features Integrated security primitives including 3DES, A-HAB, ARM TrustZone (ARM TZ), CAAM, DES, MD5, SHA and SNVS help establish device and data trust anchors.
  • Graphics Acceleration Hardware graphics acceleration is included to offload GUI and rendering tasks from CPUs.
  • Package and Compliance Surface-mount packaging and RoHS compliance support modern manufacturing and environmental requirements.

Typical Applications

  • HMI and Display Systems — Drives advanced displays and user interfaces using LCD, LVDS and MIPI-DSI support with dedicated graphics acceleration.
  • Edge Multimedia Processing — NEON and Hi-Fi4 DSP blocks accelerate audio, video and vision workloads at the edge.
  • Industrial and Embedded Gateways — Dual gigabit Ethernet and USB 3.0/2.0 OTG enable high-throughput networking and peripheral connectivity for gateway appliances.
  • Secure IoT and Edge Devices — On-chip security features such as ARM TrustZone and CAAM allow secure boot and trusted execution for connected devices.

Unique Advantages

  • Balanced Multi‑Core Design: Combines 64-bit application cores with a real-time Cortex-M4F core to run OS-level tasks and deterministic control on one device.
  • Integrated Multimedia Acceleration: NEON and Hi-Fi4 DSP support lowers CPU load for media processing, reducing system-level BOM and improving responsiveness.
  • Broad Memory Flexibility: DDR3L and LPDDR4 controller support lets designers choose between cost, performance and power profiles.
  • Comprehensive Connectivity: Dual Gigabit Ethernet plus USB 3.0 and USB 2.0 OTG PHYs simplify system integration for high-bandwidth networked applications.
  • Hardware Security Building Blocks: Multiple cryptographic engines and TrustZone support enable layered security implementations for data protection and authenticated boot flows.
  • Manufacturing-Ready Packaging: Surface-mount package and RoHS compliance facilitate streamlined assembly and regulatory conformity.

Why Choose MIMX8DX5CVLFZAC?

The MIMX8DX5CVLFZAC positions itself as a versatile embedded processor that combines 64‑bit application performance with real-time control, multimedia acceleration, extensive I/O and built-in security primitives. It is suited to designers building connected, multimedia-rich embedded systems where integration and predictable performance matter.

With flexible memory support, dual gigabit Ethernet and both USB 3.0 and USB 2.0 OTG options, this part supports a wide range of system architectures while RoHS compliance and surface-mount packaging align with modern production requirements.

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