MIMX8DX2FVLFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 1,028 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | ||
| Speed | 1.2GHz, 264MHz | Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX2FVLFZAC – I.MX 8DUALXPLUS 21X21
The MIMX8DX2FVLFZAC is an embedded microprocessor from NXP Semiconductors' i.MX 8DX series featuring ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real-time core. It provides heterogeneous compute with a 3-core, 64-bit architecture running at 1.2 GHz for application processing and a 264 MHz Cortex‑M4F for real-time tasks.
Designed for embedded systems requiring multi-domain performance, security and rich I/O, this device integrates multimedia acceleration, multiple display and camera interfaces, dual gigabit Ethernet, USB 2.0/3.0 OTG and CANbus to address industrial HMI, vision, networking and edge compute applications.
Key Features
- Core Architecture ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F real-time core in a 3-core, 64-bit configuration; application cores run up to 1.2 GHz with the M4F at 264 MHz.
- Multimedia & DSP Multimedia acceleration supported with NEON and Hi-Fi4 DSP capabilities for signal processing and media workloads.
- Memory Interfaces Supports DDR3L and LPDDR4 memory controllers for flexible system memory choices and performance scaling.
- Display & Camera Integrated display and imaging interfaces including LCD, LVDS, MIPI-DSI and MIPI-CSI to enable advanced HMI and vision designs.
- Networking & CAN Dual 10/100/1000 Mbps Ethernet ports plus CANbus support provide robust wired connectivity for industrial and gateway applications.
- USB Connectivity USB 2.0 OTG with PHY and USB 3.0 OTG with PHY offer flexible peripheral and high-speed host/device connectivity.
- Security Features Hardware security primitives and modules including 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS to support secure boot and trusted execution.
- Package & Mounting Available in a 609-FBGA package (21×21 mm), surface-mount format for compact system integration.
- Graphics Acceleration On-chip graphics acceleration to support responsive user interfaces and multimedia playback.
Typical Applications
- Industrial HMI Drives rich user interfaces and multi-panel displays using integrated display controllers and graphics acceleration.
- Edge Vision & Camera Systems Combines MIPI‑CSI support with NEON/Hi‑Fi4 DSP acceleration for image capture and pre-processing at the edge.
- Networking & Gateway Appliances Dual gigabit Ethernet and USB OTG enable secure, high-throughput industrial gateways and communication nodes.
- Motor & Field Control Systems Real-time control tasks handled by the Cortex‑M4F core with CANbus connectivity for fieldbus integration.
Unique Advantages
- Heterogeneous Compute: Combines high-performance Cortex‑A53 cores with a real-time Cortex‑M4F to separate application and deterministic control workloads.
- Comprehensive I/O Integration: Wide range of display, camera, USB, Ethernet and CAN interfaces reduces external controller count and simplifies board design.
- Security-Ready: Built-in security modules and cryptographic accelerators help implement secure boot and trusted execution environments.
- Flexible Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory technology that matches performance and power targets.
- Compact Packaging: 609‑FBGA (21×21 mm) surface-mount package allows dense system integration for space-constrained applications.
- Multimedia & DSP Capabilities: NEON and Hi‑Fi4 DSP support offloads media and signal-processing workloads from general-purpose cores.
Why Choose MIMX8DX2FVLFZAC?
The MIMX8DX2FVLFZAC positions itself as a versatile embedded processor combining 64-bit application performance, a deterministic real-time core and extensive connectivity and security features. It is suited for engineers building embedded systems that require a balance of application processing, real-time control and multimedia/vision capabilities.
Backed by NXP Semiconductors and the i.MX 8DX series architecture, this device offers a scalable platform for long-term designs where integration, connectivity and security are primary considerations.
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