MIMX8DX2FVLFZAC

I.MX 8DUALXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,028 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8DX2FVLFZAC – I.MX 8DUALXPLUS 21X21

The MIMX8DX2FVLFZAC is an embedded microprocessor from NXP Semiconductors' i.MX 8DX series featuring ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real-time core. It provides heterogeneous compute with a 3-core, 64-bit architecture running at 1.2 GHz for application processing and a 264 MHz Cortex‑M4F for real-time tasks.

Designed for embedded systems requiring multi-domain performance, security and rich I/O, this device integrates multimedia acceleration, multiple display and camera interfaces, dual gigabit Ethernet, USB 2.0/3.0 OTG and CANbus to address industrial HMI, vision, networking and edge compute applications.

Key Features

  • Core Architecture  ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F real-time core in a 3-core, 64-bit configuration; application cores run up to 1.2 GHz with the M4F at 264 MHz.
  • Multimedia & DSP  Multimedia acceleration supported with NEON and Hi-Fi4 DSP capabilities for signal processing and media workloads.
  • Memory Interfaces  Supports DDR3L and LPDDR4 memory controllers for flexible system memory choices and performance scaling.
  • Display & Camera  Integrated display and imaging interfaces including LCD, LVDS, MIPI-DSI and MIPI-CSI to enable advanced HMI and vision designs.
  • Networking & CAN  Dual 10/100/1000 Mbps Ethernet ports plus CANbus support provide robust wired connectivity for industrial and gateway applications.
  • USB Connectivity  USB 2.0 OTG with PHY and USB 3.0 OTG with PHY offer flexible peripheral and high-speed host/device connectivity.
  • Security Features  Hardware security primitives and modules including 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS to support secure boot and trusted execution.
  • Package & Mounting  Available in a 609-FBGA package (21×21 mm), surface-mount format for compact system integration.
  • Graphics Acceleration  On-chip graphics acceleration to support responsive user interfaces and multimedia playback.

Typical Applications

  • Industrial HMI  Drives rich user interfaces and multi-panel displays using integrated display controllers and graphics acceleration.
  • Edge Vision & Camera Systems  Combines MIPI‑CSI support with NEON/Hi‑Fi4 DSP acceleration for image capture and pre-processing at the edge.
  • Networking & Gateway Appliances  Dual gigabit Ethernet and USB OTG enable secure, high-throughput industrial gateways and communication nodes.
  • Motor & Field Control Systems  Real-time control tasks handled by the Cortex‑M4F core with CANbus connectivity for fieldbus integration.

Unique Advantages

  • Heterogeneous Compute: Combines high-performance Cortex‑A53 cores with a real-time Cortex‑M4F to separate application and deterministic control workloads.
  • Comprehensive I/O Integration: Wide range of display, camera, USB, Ethernet and CAN interfaces reduces external controller count and simplifies board design.
  • Security-Ready: Built-in security modules and cryptographic accelerators help implement secure boot and trusted execution environments.
  • Flexible Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory technology that matches performance and power targets.
  • Compact Packaging: 609‑FBGA (21×21 mm) surface-mount package allows dense system integration for space-constrained applications.
  • Multimedia & DSP Capabilities: NEON and Hi‑Fi4 DSP support offloads media and signal-processing workloads from general-purpose cores.

Why Choose MIMX8DX2FVLFZAC?

The MIMX8DX2FVLFZAC positions itself as a versatile embedded processor combining 64-bit application performance, a deterministic real-time core and extensive connectivity and security features. It is suited for engineers building embedded systems that require a balance of application processing, real-time control and multimedia/vision capabilities.

Backed by NXP Semiconductors and the i.MX 8DX series architecture, this device offers a scalable platform for long-term designs where integration, connectivity and security are primary considerations.

Request a quote or submit a sales inquiry to obtain pricing, availability and additional ordering information for the MIMX8DX2FVLFZAC.

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