MIMX8DX1FVOFZAC

I.MX 8DUALXPLUS 17X17
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17)

Quantity 811 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package417-FBGA (17x17)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case417-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.2GHz, 264MHz
Supplier Device Package417-FBGA (17×17)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8DX1FVOFZAC – I.MX 8DUALXPLUS 17X17

The MIMX8DX1FVOFZAC is an NXP Semiconductors microprocessor from the i.MX 8DX series, designed for embedded applications requiring a mix of application-level and real-time processing. It integrates ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F real-time core to deliver a heterogeneous compute platform in a compact 417‑FBGA (17×17) package.

With 64‑bit, multicore processing at 1.2 GHz for application tasks and a 264 MHz Cortex‑M4F for deterministic control, the device targets use cases that combine multimedia, display, secure connectivity and low‑latency control.

Key Features

  • Core Architecture  ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real‑time core provide a 3‑core, 64‑bit heterogeneous processing environment running at up to 1.2 GHz (A53) and 264 MHz (M4F).
  • Multimedia and DSP  Integrated multimedia acceleration with NEON and Hi‑Fi4 DSP support to accelerate signal processing and media workloads.
  • Memory Support  Memory controllers for DDR3L SDRAM and LPDDR4 DRAM provide flexible memory interface options for performance and power tradeoffs.
  • Display and Graphics  Display interface controllers include LCD, LVDS, MIPI‑CSI and MIPI‑DSI, and the device provides on‑chip graphics acceleration for user interfaces and graphics‑rich applications.
  • High‑Speed Connectivity  Dual 10/100/1000 Mbps Ethernet ports and USB connectivity including one USB 2.0 OTG + PHY and one USB 3.0 OTG + PHY support high‑bandwidth networking and peripheral I/O.
  • Security Features  Hardware security components include 3DES, A‑HAB, ARM TrustZone (ARM TZ), CAAM, DES, MD5 and SHA, plus SNVS for system-level secure functionality.
  • Package and Mounting  Supplied in a 417‑FBGA (17×17) surface‑mount package suitable for compact embedded designs.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Embedded control and automation  Use the Cortex‑M4F core for deterministic control tasks while offloading higher‑level processing to the Cortex‑A53 cores.
  • Multimedia and vision systems  Graphics acceleration, NEON and Hi‑Fi4 DSP support media playback, image processing and camera interfaces via MIPI‑CSI.
  • Secure networked appliances  Dual gigabit Ethernet and integrated security engines enable secure, high‑throughput connectivity for networked embedded equipment.
  • Human‑machine interfaces  MIPI‑DSI, LCD and LVDS display controllers combined with on‑chip graphics acceleration support rich user interface designs.

Unique Advantages

  • Heterogeneous compute in one device: Combines 64‑bit Cortex‑A53 cores with a Cortex‑M4F real‑time core to consolidate application processing and deterministic control.
  • Flexible memory options: Support for DDR3L and LPDDR4 DRAM lets designers choose memory architectures to balance speed, power and cost.
  • Broad display and multimedia I/O: Multiple display interfaces and graphics acceleration streamline HMI and multimedia system designs.
  • Integrated security: On‑chip cryptographic engines and secure boot features reduce external security hardware and simplify secure system design.
  • High‑bandwidth connectivity: Dual gigabit Ethernet plus USB 2.0 and USB 3.0 OTG provide robust options for networking and peripheral expansion.
  • Compact surface‑mount package: The 417‑FBGA (17×17) package enables dense board layouts for space‑constrained embedded products.

Why Choose MIMX8DX1FVOFZAC?

The MIMX8DX1FVOFZAC positions itself as a capable, integrated solution for embedded systems that need a balance of 64‑bit application performance, real‑time control and multimedia/graphics capability. Its combination of Cortex‑A53 and Cortex‑M4F cores, flexible memory interfaces and rich I/O makes it suitable for designs that consolidate multiple functions into a single processor.

Backed by NXP Semiconductors and supplied in a compact, RoHS‑compliant 417‑FBGA package, this part is appropriate for designers seeking a scalable, secure and feature‑rich microprocessor platform for embedded applications.

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