MIMX8DX1FVOFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17) |
|---|---|
| Quantity | 811 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 417-FBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 417-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 264MHz | ||
| Supplier Device Package | 417-FBGA (17×17) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX1FVOFZAC – I.MX 8DUALXPLUS 17X17
The MIMX8DX1FVOFZAC is an NXP Semiconductors microprocessor from the i.MX 8DX series, designed for embedded applications requiring a mix of application-level and real-time processing. It integrates ARM® Cortex®-A53 application cores alongside an ARM® Cortex®-M4F real-time core to deliver a heterogeneous compute platform in a compact 417‑FBGA (17×17) package.
With 64‑bit, multicore processing at 1.2 GHz for application tasks and a 264 MHz Cortex‑M4F for deterministic control, the device targets use cases that combine multimedia, display, secure connectivity and low‑latency control.
Key Features
- Core Architecture ARM® Cortex®-A53 application cores paired with an ARM® Cortex®-M4F real‑time core provide a 3‑core, 64‑bit heterogeneous processing environment running at up to 1.2 GHz (A53) and 264 MHz (M4F).
- Multimedia and DSP Integrated multimedia acceleration with NEON and Hi‑Fi4 DSP support to accelerate signal processing and media workloads.
- Memory Support Memory controllers for DDR3L SDRAM and LPDDR4 DRAM provide flexible memory interface options for performance and power tradeoffs.
- Display and Graphics Display interface controllers include LCD, LVDS, MIPI‑CSI and MIPI‑DSI, and the device provides on‑chip graphics acceleration for user interfaces and graphics‑rich applications.
- High‑Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and USB connectivity including one USB 2.0 OTG + PHY and one USB 3.0 OTG + PHY support high‑bandwidth networking and peripheral I/O.
- Security Features Hardware security components include 3DES, A‑HAB, ARM TrustZone (ARM TZ), CAAM, DES, MD5 and SHA, plus SNVS for system-level secure functionality.
- Package and Mounting Supplied in a 417‑FBGA (17×17) surface‑mount package suitable for compact embedded designs.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Embedded control and automation Use the Cortex‑M4F core for deterministic control tasks while offloading higher‑level processing to the Cortex‑A53 cores.
- Multimedia and vision systems Graphics acceleration, NEON and Hi‑Fi4 DSP support media playback, image processing and camera interfaces via MIPI‑CSI.
- Secure networked appliances Dual gigabit Ethernet and integrated security engines enable secure, high‑throughput connectivity for networked embedded equipment.
- Human‑machine interfaces MIPI‑DSI, LCD and LVDS display controllers combined with on‑chip graphics acceleration support rich user interface designs.
Unique Advantages
- Heterogeneous compute in one device: Combines 64‑bit Cortex‑A53 cores with a Cortex‑M4F real‑time core to consolidate application processing and deterministic control.
- Flexible memory options: Support for DDR3L and LPDDR4 DRAM lets designers choose memory architectures to balance speed, power and cost.
- Broad display and multimedia I/O: Multiple display interfaces and graphics acceleration streamline HMI and multimedia system designs.
- Integrated security: On‑chip cryptographic engines and secure boot features reduce external security hardware and simplify secure system design.
- High‑bandwidth connectivity: Dual gigabit Ethernet plus USB 2.0 and USB 3.0 OTG provide robust options for networking and peripheral expansion.
- Compact surface‑mount package: The 417‑FBGA (17×17) package enables dense board layouts for space‑constrained embedded products.
Why Choose MIMX8DX1FVOFZAC?
The MIMX8DX1FVOFZAC positions itself as a capable, integrated solution for embedded systems that need a balance of 64‑bit application performance, real‑time control and multimedia/graphics capability. Its combination of Cortex‑A53 and Cortex‑M4F cores, flexible memory interfaces and rich I/O makes it suitable for designs that consolidate multiple functions into a single processor.
Backed by NXP Semiconductors and supplied in a compact, RoHS‑compliant 417‑FBGA package, this part is appropriate for designers seeking a scalable, secure and feature‑rich microprocessor platform for embedded applications.
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