MIMX8DX1FVLFZAC

I.MX 8DUALXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,078 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8DX1FVLFZAC – I.MX 8DUALXPLUS 21X21

The MIMX8DX1FVLFZAC is an embedded microprocessor IC featuring a heterogeneous ARM architecture with ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F auxiliary core. It provides a 3-core, 64‑bit processing configuration with a 1.2 GHz application core speed and a 264 MHz Cortex‑M4F core aimed at mixed compute and control tasks.

Designed for embedded and industrial applications, this device integrates multimedia acceleration, high‑speed connectivity and hardware security features to support systems requiring performance, interface density and integration in a 609‑FBGA (21 × 21 mm) surface‑mount package.

Key Features

  • CPU Architecture  ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F core; 3 cores total, 64‑bit architecture with a Cortex‑A53 speed of 1.2 GHz and Cortex‑M4F at 264 MHz.
  • Multimedia & DSP  Includes multimedia acceleration and co-processors such as NEON and Hi‑Fi4 DSP for media and signal processing tasks.
  • Memory Interfaces  Supports DDR3L SDRAM and LPDDR4 DRAM; datasheet series information also documents support for eMMC 5.1, SD 3.0, Quad/Octal FlexSPI and SPI NOR options for flexible boot and storage choices.
  • Display & Imaging  Integrated display interface controllers including LCD, LVDS, MIPI‑DSI and MIPI‑CSI to support panel and camera connectivity.
  • High‑Speed Connectivity  Dual 10/100/1000 Mbps Ethernet interfaces and USB connectivity including USB 3.0 OTG + PHY and USB 2.0 OTG + PHY.
  • Automotive‑grade Security Primitives  Hardware security features include 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS for secure boot and cryptographic functions.
  • Additional Field Interfaces  On‑chip support for CANbus and multiple peripheral interfaces to handle sensor networks and vehicle‑style communications where applicable.
  • Package & Mounting  Supplied in a 609‑FBGA (21 × 21 mm) surface‑mount package for compact board integration.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Multi‑core processing and extensive I/O support make it suitable for control systems that combine compute, communications and deterministic microcontroller tasks.
  • Networked Gateways & Routers  Dual gigabit Ethernet plus USB 3.0 and USB 2.0 connectivity enable high‑throughput edge devices and protocol bridging.
  • Human‑Machine Interfaces (HMI)  Integrated display controllers (LCD, LVDS, MIPI‑DSI) and multimedia acceleration support modern operator panels and graphical displays.
  • Vision & Imaging Systems  MIPI‑CSI camera interfaces combined with multimedia DSPs support image capture and on‑device processing workflows.

Unique Advantages

  • Heterogeneous Processing  Combination of Cortex‑A53 and Cortex‑M4F cores lets designers partition application-level compute and real‑time control tasks on a single device.
  • Integrated Connectivity  Built‑in dual 1Gb Ethernet and USB 3.0/2.0 OTG provide broad options for wired networking and high‑speed peripheral attachment without external controllers.
  • Flexible Memory Support  Support for DDR3L and LPDDR4 plus serial flash and eMMC/SD options enables scalable memory and boot configurations to match performance and cost targets.
  • Security Building Blocks  On‑chip cryptographic engines and secure boot features reduce external security component requirements and simplify secure system design.
  • Compact, Production‑Ready Package  609‑FBGA (21 × 21 mm) surface‑mount package provides a compact footprint for space‑constrained embedded boards.
  • RoHS Compliance  Designed to meet RoHS environmental requirements.

Why Choose MIMX8DX1FVLFZAC?

The MIMX8DX1FVLFZAC positions itself as a versatile embedded processor that balances application performance and control responsiveness by combining ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F core. Its integrated multimedia acceleration, rich connectivity (dual 1 Gb Ethernet, USB 3.0/2.0), flexible memory interfaces and hardware security features make it suitable for embedded and industrial designs requiring a compact, highly integrated processing solution.

This part is ideal for engineering teams building networked edge devices, HMIs, imaging systems and industrial controllers that need consolidated processing, secure boot and multiple high‑speed interfaces in a production‑friendly FBGA package.

Request a quote or submit an inquiry to discuss availability, lead times and volume pricing for MIMX8DX1FVLFZAC. Our team can provide technical and procurement assistance to help integrate this device into your design.

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