MIMX8DX1FVLFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21) |
|---|---|
| Quantity | 1,078 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 609-FBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 609-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | ||
| Speed | 1.2GHz, 264MHz | Supplier Device Package | 609-FBGA (21×21) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | ||
| Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX1FVLFZAC – I.MX 8DUALXPLUS 21X21
The MIMX8DX1FVLFZAC is an embedded microprocessor IC featuring a heterogeneous ARM architecture with ARM® Cortex®-A53 application cores and an ARM® Cortex®-M4F auxiliary core. It provides a 3-core, 64‑bit processing configuration with a 1.2 GHz application core speed and a 264 MHz Cortex‑M4F core aimed at mixed compute and control tasks.
Designed for embedded and industrial applications, this device integrates multimedia acceleration, high‑speed connectivity and hardware security features to support systems requiring performance, interface density and integration in a 609‑FBGA (21 × 21 mm) surface‑mount package.
Key Features
- CPU Architecture ARM® Cortex®-A53 application cores plus an ARM® Cortex®-M4F core; 3 cores total, 64‑bit architecture with a Cortex‑A53 speed of 1.2 GHz and Cortex‑M4F at 264 MHz.
- Multimedia & DSP Includes multimedia acceleration and co-processors such as NEON and Hi‑Fi4 DSP for media and signal processing tasks.
- Memory Interfaces Supports DDR3L SDRAM and LPDDR4 DRAM; datasheet series information also documents support for eMMC 5.1, SD 3.0, Quad/Octal FlexSPI and SPI NOR options for flexible boot and storage choices.
- Display & Imaging Integrated display interface controllers including LCD, LVDS, MIPI‑DSI and MIPI‑CSI to support panel and camera connectivity.
- High‑Speed Connectivity Dual 10/100/1000 Mbps Ethernet interfaces and USB connectivity including USB 3.0 OTG + PHY and USB 2.0 OTG + PHY.
- Automotive‑grade Security Primitives Hardware security features include 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS for secure boot and cryptographic functions.
- Additional Field Interfaces On‑chip support for CANbus and multiple peripheral interfaces to handle sensor networks and vehicle‑style communications where applicable.
- Package & Mounting Supplied in a 609‑FBGA (21 × 21 mm) surface‑mount package for compact board integration.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control & Automation Multi‑core processing and extensive I/O support make it suitable for control systems that combine compute, communications and deterministic microcontroller tasks.
- Networked Gateways & Routers Dual gigabit Ethernet plus USB 3.0 and USB 2.0 connectivity enable high‑throughput edge devices and protocol bridging.
- Human‑Machine Interfaces (HMI) Integrated display controllers (LCD, LVDS, MIPI‑DSI) and multimedia acceleration support modern operator panels and graphical displays.
- Vision & Imaging Systems MIPI‑CSI camera interfaces combined with multimedia DSPs support image capture and on‑device processing workflows.
Unique Advantages
- Heterogeneous Processing Combination of Cortex‑A53 and Cortex‑M4F cores lets designers partition application-level compute and real‑time control tasks on a single device.
- Integrated Connectivity Built‑in dual 1Gb Ethernet and USB 3.0/2.0 OTG provide broad options for wired networking and high‑speed peripheral attachment without external controllers.
- Flexible Memory Support Support for DDR3L and LPDDR4 plus serial flash and eMMC/SD options enables scalable memory and boot configurations to match performance and cost targets.
- Security Building Blocks On‑chip cryptographic engines and secure boot features reduce external security component requirements and simplify secure system design.
- Compact, Production‑Ready Package 609‑FBGA (21 × 21 mm) surface‑mount package provides a compact footprint for space‑constrained embedded boards.
- RoHS Compliance Designed to meet RoHS environmental requirements.
Why Choose MIMX8DX1FVLFZAC?
The MIMX8DX1FVLFZAC positions itself as a versatile embedded processor that balances application performance and control responsiveness by combining ARM® Cortex®-A53 application cores with an ARM® Cortex®-M4F core. Its integrated multimedia acceleration, rich connectivity (dual 1 Gb Ethernet, USB 3.0/2.0), flexible memory interfaces and hardware security features make it suitable for embedded and industrial designs requiring a compact, highly integrated processing solution.
This part is ideal for engineering teams building networked edge devices, HMIs, imaging systems and industrial controllers that need consolidated processing, secure boot and multiple high‑speed interfaces in a production‑friendly FBGA package.
Request a quote or submit an inquiry to discuss availability, lead times and volume pricing for MIMX8DX1FVLFZAC. Our team can provide technical and procurement assistance to help integrate this device into your design.

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