MIMX8DX2AVOFZAC

I.MX 8DUALXPLUS 17X17
Part Description

I.MX 8DUALXPLUS 17X17

Quantity 81 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDisplay & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationYes
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width3 Core, 64-BitOperating Temperature–RAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantUSBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)

Overview of MIMX8DX2AVOFZAC – I.MX 8DUALXPLUS 17X17

The MIMX8DX2AVOFZAC is an embedded microprocessor IC in NXP's i.MX 8DX series featuring a 3‑core, 64‑bit architecture that integrates ARM® Cortex® cores for application and real‑time processing. It pairs general‑purpose ARM® Cortex®‑A53 processing with an ARM® Cortex®‑M4F core and dedicated multimedia/DSP engines to address connected embedded designs.

Designed for embedded applications that require multimedia, connectivity and security, this device delivers an integrated feature set—memory controller support, multiple display and camera interfaces, high‑speed I/O and hardware security—to simplify system design and accelerate time to market.

Key Features

  • Core Architecture  3‑core, 64‑bit architecture combining ARM® Cortex®‑A53 and ARM® Cortex®‑M4F cores for a mix of application and real‑time processing.
  • Multimedia and DSP  Integrated multimedia acceleration and DSP support including NEON and Hi‑Fi4 DSP elements to offload signal and audio processing tasks.
  • Memory Support  On‑chip controllers support DDR3L SDRAM and LPDDR4 DRAM to match a range of system memory performance and footprint requirements.
  • Display and Camera Interfaces  Multiple display and imaging interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI for flexible HMI and vision system implementations.
  • Ethernet Connectivity  Two 10/100/1000 Mbps Ethernet ports provide wired network connectivity options for high‑bandwidth or redundant network architectures.
  • USB I/O  Integrated USB interfaces include one USB 2.0 OTG with PHY and one USB 3.0 OTG with PHY for versatile peripheral and host connectivity.
  • Security Engine  Hardware security features include 3DES, DES, MD5, SHA, Secure Non‑Volatile Storage (SNVS), ARM TrustZone and CAAM, plus A‑HAB support for secure boot and cryptographic operations.
  • Graphics Acceleration  Graphics acceleration is supported to assist UI rendering and multimedia tasks.
  • Mounting and Compliance  Surface mount package type and RoHS compliance for standard electronics manufacturing and environmental requirements.

Typical Applications

  • Industrial Control  Use the processor for embedded controllers and automation nodes that need real‑time control combined with application processing and secure connectivity.
  • Edge Compute & Gateways  Suitable for edge devices and gateways requiring dual gigabit Ethernet, varied memory support and hardware security for data handling and network aggregation.
  • Human‑Machine Interfaces (HMI)  Leverage the display interfaces and graphics acceleration for touchscreen UIs, instrument panels and operator displays.
  • Vision and Imaging Systems  MIPI‑CSI and DSP/NEON acceleration make the device a fit for camera‑based inspection, machine vision preprocessing and multimedia capture applications.

Unique Advantages

  • Balanced Multicore Design: A combination of application and real‑time ARM® cores enables consolidation of control and user‑space tasks on a single device.
  • Integrated Multimedia/DSP Support: NEON and Hi‑Fi4 DSP capabilities reduce external accelerator needs for audio, signal and media processing.
  • Flexible Memory Options: Support for DDR3L and LPDDR4 lets designers choose the memory footprint and power/performance tradeoffs that match their application.
  • Comprehensive Connectivity: Multiple high‑speed interfaces—including dual gigabit Ethernet and USB 3.0 OTG—streamline system integration for networked and peripheral‑rich designs.
  • Hardware Security Primitives: Built‑in cryptographic engines and secure boot support help protect device integrity and sensitive data without adding external security ICs.
  • Surface Mount, RoHS Compliant: Ready for standard SMT assembly processes and meets RoHS environmental requirements.

Why Choose MIMX8DX2AVOFZAC?

The MIMX8DX2AVOFZAC positions itself as a versatile embedded microprocessor that combines multicore processing, multimedia/DSP acceleration, broad memory interface support and comprehensive connectivity and security features. It is suited to designs that need both application‑level performance and deterministic real‑time control within a single silicon solution.

This device is appropriate for engineering teams developing industrial, edge computing, HMI and vision systems where integrated I/O, display and security capabilities help reduce system complexity and component count while enabling scalable product designs and vendor support.

Request a quote or submit a sales inquiry to get pricing, availability and assistance specifying MIMX8DX2AVOFZAC for your next embedded design.

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