MIMX8DX2FVOFZAC
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 417-FBGA (17x17) |
|---|---|
| Quantity | 957 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8DX |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F | Device Package | 417-FBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI, MIPI-DSI | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit | ||
| Operating Temperature | – | Package / Case | 417-BFBGA | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 1.2GHz, 264MHz | ||
| Supplier Device Package | 417-FBGA (17×17) | USB | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MIMX8DX2FVOFZAC – I.MX 8DUALXPLUS 17X17
The MIMX8DX2FVOFZAC is a multicore embedded microprocessor from NXP Semiconductors featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M4F cores. It provides a 64‑bit, 3‑core architecture with Cortex‑A performance at up to 1.2 GHz and a Cortex‑M4F at 264 MHz, aimed at embedded and industrial application use.
This device combines general‑purpose 64‑bit processing with a dedicated M4F core, integrated multimedia and graphics acceleration, extensive memory interface support, and hardware security features to address compact, high‑function embedded system designs.
Key Features
- Core Architecture ARM® Cortex®‑A53 application cores (up to 1.2 GHz) plus an ARM® Cortex®‑M4F core (264 MHz) in a 3‑core, 64‑bit configuration.
- Multimedia and DSP Includes multimedia co‑processors such as NEON and Hi‑Fi4 DSP and integrated graphics acceleration for advanced media processing.
- Memory Interfaces Supports DDR3L SDRAM and LPDDR4 DRAM controllers, enabling flexible memory choices for performance and footprint tradeoffs.
- Display and Camera Display interface controllers for LCD and LVDS, plus MIPI‑CSI and MIPI‑DSI for camera and display connectivity.
- High‑Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and USB interfaces including USB 2.0 OTG + PHY (1) and USB 3.0 OTG + PHY (1).
- Security Integrated security features including 3DES, A‑HAB, ARM TrustZone, CAAM, DES, MD5, SHA and SNVS for hardware‑based protection.
- Package and Mounting 417‑FBGA (17 × 17 mm) package in a surface‑mount format suitable for compact system designs.
- Standards and Compliance RoHS compliant.
Typical Applications
- Industrial Embedded Systems Multicore processing, robust memory options and dual Gigabit Ethernet support make this device suitable for industrial control and communication platforms.
- Human‑Machine Interfaces (HMI) Integrated graphics acceleration and display interfaces (MIPI‑DSI, LVDS, LCD) support advanced user interfaces and display driving.
- Multimedia Gateways NEON and Hi‑Fi4 DSP acceleration plus USB 3.0 enable media processing and high‑speed peripheral connectivity.
Unique Advantages
- Heterogeneous processing Combination of 64‑bit Cortex‑A53 cores and a Cortex‑M4F core provides a balance of application performance and microcontroller‑class control in one device.
- Rich I/O and display support Multiple display controllers, MIPI camera interface, dual Gigabit Ethernet and USB 3.0 reduce external bridging and simplify system design.
- Flexible memory options Support for DDR3L and LPDDR4 enables designers to tailor memory performance and power to the target application.
- Built‑in security primitives Hardware crypto engines (CAAM, DES, 3DES, SHA, MD5) and TrustZone/A‑HAB features help secure boot and data integrity functions.
- Compact system footprint 417‑FBGA (17×17) surface‑mount package supports high integration in space‑constrained boards.
- Manufacturer backing Part of NXP Semiconductors’ i.MX family, providing a known supplier source for embedded processor solutions.
Why Choose MIMX8DX2FVOFZAC?
The MIMX8DX2FVOFZAC positions itself as a compact, multicore embedded processor combining 64‑bit application performance with a dedicated Cortex‑M4F core for auxiliary processing. Its extensive interface set, multimedia acceleration and hardware security features make it suitable for embedded and industrial designs that require integration of networking, display and media capabilities.
Designers seeking a scalable platform from a recognized manufacturer will find this device useful for systems that require a combination of general‑purpose compute, peripheral integration and security primitives while maintaining a small PCB footprint thanks to the 17×17 417‑FBGA package.
Request a quote or submit a pricing inquiry to evaluate MIMX8DX2FVOFZAC for your next embedded design project.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016