MIMX8DX5FVLFZAC

I.MX 8DUALXPLUS 21X21
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4F Microprocessor IC i.MX8Q 3 Core, 64-Bit 1.2GHz, 264MHz 609-FBGA (21x21)

Quantity 1,278 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8DX
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4FDevice Package609-FBGA (21x21)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit
Operating Temperature–Package / Case609-BFBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity Features3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Speed1.2GHz, 264MHzSupplier Device Package609-FBGA (21×21)USBUSB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MIMX8DX5FVLFZAC – 3‑Core ARM® Cortex®‑A53 + Cortex®‑M4F 1.2 GHz (609‑FBGA 21×21)

The MIMX8DX5FVLFZAC is an embedded microprocessor IC from NXP Semiconductors’ i.MX 8DX series. It integrates ARM® Cortex®‑A53 application cores alongside an ARM® Cortex®‑M4F real‑time core, delivering a combination of 64‑bit application performance and deterministic control.

Designed for embedded systems that require multimedia, connectivity and security, this device targets industrial and connected equipment markets where processing throughput, real‑time control and integration reduce BOM and development effort.

Key Features

  • Core Architecture — ARM® Cortex®‑A53 application cores plus an ARM® Cortex®‑M4F real‑time core; 3 cores, 64‑bit, with the application core clock at 1.2 GHz and the M4F at 264 MHz.
  • Memory Support — Integrated memory controllers for DDR3L SDRAM and LPDDR4 DRAM to support responsive system memory and multimedia workloads.
  • Multimedia and DSP — NEON acceleration and Hi‑Fi4 DSP support for multimedia processing and signal‑processing tasks.
  • Display and Camera Interfaces — Display interface controllers include LCD and LVDS plus MIPI‑CSI and MIPI‑DSI to enable rich HMI and camera connectivity.
  • High‑Speed Connectivity — Dual 10/100/1000 Mbps Ethernet ports and USB support including USB 2.0 OTG + PHY and USB 3.0 OTG + PHY for high‑bandwidth peripherals and networking.
  • Automotive‑grade Communication — CANbus interface for robust in‑vehicle or industrial fieldbus connectivity.
  • Security — Hardware security features including 3DES, DES, MD5, SHA, ARM TrustZone (ARM TZ), A‑HAB and CAAM to support secure boot and runtime protection.
  • Packaging and Mounting — 609‑FBGA package (21×21 mm) with surface‑mount construction for compact board integration.
  • Graphics Acceleration — On‑chip graphics acceleration for UI rendering and multimedia playback.
  • RoHS Compliant — Meets RoHS environmental requirements for restricted substances.

Typical Applications

  • Industrial Automation: Real‑time control using the Cortex‑M4F core and fieldbus connectivity via CANbus for motor control, PLCs and machine controllers.
  • Human‑Machine Interfaces (HMI): MIPI‑DSI/MIPI‑CSI and graphics acceleration enable rich displays and camera integration for operator panels and touchscreens.
  • Edge Gateway and Networking: Dual Gigabit Ethernet and USB 3.0 support high‑throughput data aggregation and connectivity for edge routers and industrial gateways.
  • Multimedia & Vision Appliances: NEON and Hi‑Fi4 DSP accelerators provide processing headroom for audio, video and basic vision processing tasks.

Unique Advantages

  • Balanced Heterogeneous Compute: Combines 64‑bit application cores with a dedicated real‑time core to separate high‑level processing from deterministic control workloads.
  • Integrated Connectivity: Dual Gigabit Ethernet, USB 2.0/3.0 OTG and CANbus reduce external controller requirements and simplify board design.
  • Multimedia Acceleration: NEON and Hi‑Fi4 DSP support offloads for audio/video and signal processing, lowering CPU load and power for media tasks.
  • Comprehensive Security Building Blocks: Multiple cryptographic engines and TrustZone support make it straightforward to implement secure boot and runtime protections.
  • Compact, Surface‑Mount Package: 609‑FBGA (21×21) footprint enables high‑density PCB layouts for space‑constrained embedded systems.

Why Choose MIMX8DX5FVLFZAC?

The MIMX8DX5FVLFZAC positions itself as a high‑integration embedded processor combining application performance, real‑time control and broad I/O connectivity in a single package. Its mix of ARM® Cortex®‑A53 and Cortex®‑M4F cores, supported memory interfaces and on‑chip multimedia and security features make it suitable for designs that demand both compute and deterministic control.

Engineers building industrial equipment, HMIs, edge gateways or multimedia devices will find this device useful for reducing system complexity, minimizing external components and accelerating time‑to‑market while leveraging NXP’s ecosystem and technical support.

Request a quote or submit an inquiry to evaluate MIMX8DX5FVLFZAC for your next embedded design project.

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