MIMX8ML3DVNLZAB
| Part Description |
ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) |
|---|---|
| Quantity | 491 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 8ML |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | Core Processor | ARM® Cortex®-A53 | Device Package | 548-LFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HTML, LVDS, MIPI-CSI, MIPI-DSI | ECCN | 5A992C | Ethernet | GbE (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 548-LFBGA | RAM Controllers | DDR4, LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, CAAM, RDC | ||
| Speed | 1.8GHz | Supplier Device Package | 548-LFBGA (15×15) | USB | USB 2.0 + PHY (2), USB 3.0 + PHY (2) |
Overview of MIMX8ML3DVNLZAB – ARM Cortex-A53 2‑Core 1.8GHz MPU, 548‑LFBGA
The MIMX8ML3DVNLZAB is an ARM® Cortex®‑A53 based microprocessor IC configured as a 64‑bit, 2‑core MPU running at up to 1.8 GHz in a 548‑LFBGA (15×15) package. It pairs application‑class CPU performance with integrated multimedia and DSP co‑processing, memory controllers and a broad set of system interfaces.
Designed for embedded and consumer markets, this device targets applications that require SOC‑level integration, rich display/camera support and robust wired connectivity while offering hardware security primitives for system protection.
Key Features
- Core and CPU Performance ARM® Cortex®‑A53 architecture, 2 cores, 64‑bit operation at up to 1.8 GHz for application processing and general compute tasks.
- Co‑Processors and DSP On‑chip co‑processor support including ARM® Cortex®‑M7, NEON™ MPE and Hi‑Fi4 DSP for real‑time control, multimedia acceleration and audio processing.
- Memory Interfaces Integrated controllers for DDR4 and LPDDR4 memory to support high bandwidth system memory configurations.
- Display and Camera Interfaces Display and imaging interfaces include HTML, LVDS, MIPI‑CSI and MIPI‑DSI for flexible connection to displays and camera sensors.
- Connectivity Dual GbE ports, dual USB 2.0 with PHY, dual USB 3.0 with PHY and CAN support provide a wide connectivity footprint for networking and peripheral I/O.
- Security Hardware security features include ARM TrustZone (TZ), CAAM and Resource Domain Controller (RDC) to help isolate and protect sensitive workloads.
- Multimedia and Graphics Graphics acceleration and multimedia offload support enable advanced user interfaces and video processing workflows.
- Package and Thermal 548‑LFBGA surface‑mount package (15×15 mm) with an operating temperature range of 0 °C to 95 °C for consumer applications.
- Qualification and Compliance Consumer qualification and RoHS compliance for deployment in consumer and embedded products.
Typical Applications
- Smart Home Local servers, alarm hubs, security systems and smart appliances that benefit from integrated multimedia, camera and connectivity features.
- Smart City and Surveillance Edge devices for safety, security and surveillance where camera interfaces and network connectivity are required.
- Industrial IoT Machine vision, HMI and gateway applications that need DSP/media acceleration, multiple network interfaces and secure domains.
- Smart Retail and POS Point‑of‑sale and digital signage solutions leveraging display interfaces, multimedia capabilities and wired networking.
Unique Advantages
- High‑performance dual‑core processing: 1.8 GHz ARM Cortex‑A53 dual cores provide responsive application performance for embedded and consumer workloads.
- Integrated multimedia and DSP support: NEON MPE and Hi‑Fi4 DSP plus M‑class co‑processor options accelerate audio, vision and real‑time processing while reducing external BOM.
- Comprehensive connectivity suite: Dual GbE, USB 2.0/3.0 with PHYs and CAN deliver flexible wired interfaces for networking and peripheral integration.
- Hardware security building blocks: ARM TrustZone, CAAM and RDC enable partitioning and cryptographic services to strengthen system security.
- Compact production package: 548‑LFBGA (15×15) surface‑mount package supports compact board layouts for space‑constrained designs.
- Ready for consumer deployments: Consumer qualification and RoHS compliance align the part for consumer and embedded product roadmaps.
Why Choose MIMX8ML3DVNLZAB?
MIMX8ML3DVNLZAB positions a balanced combination of dual‑core ARM Cortex‑A53 compute, multimedia/DSP co‑processing and a broad set of memory and I/O interfaces in a compact LFBGA package—making it well suited for embedded designs that require application processing, imaging/display connectivity and robust wired networking.
This device is appropriate for teams developing consumer and embedded products that need integrated security primitives, high‑speed memory support and multiple peripheral interfaces, offering a scalable platform with supplier datasheet support and RoHS compliance for production deployment.
Request a quote or submit an inquiry for availability, pricing and lead time for MIMX8ML3DVNLZAB to evaluate it for your next embedded design.

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