MIMX8ML3DVNLZAB

IC MPU I.MX8ML 1.8GHZ 548LFBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15)

Quantity 491 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8ML
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSPCore ProcessorARM® Cortex®-A53Device Package548-LFBGA (15x15)
Display & Interface ControllersHTML, LVDS, MIPI-CSI, MIPI-DSIECCN5A992CEthernetGbE (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case548-LFBGARAM ControllersDDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, RDC
Speed1.8GHzSupplier Device Package548-LFBGA (15×15)USBUSB 2.0 + PHY (2), USB 3.0 + PHY (2)

Overview of MIMX8ML3DVNLZAB – ARM Cortex-A53 2‑Core 1.8GHz MPU, 548‑LFBGA

The MIMX8ML3DVNLZAB is an ARM® Cortex®‑A53 based microprocessor IC configured as a 64‑bit, 2‑core MPU running at up to 1.8 GHz in a 548‑LFBGA (15×15) package. It pairs application‑class CPU performance with integrated multimedia and DSP co‑processing, memory controllers and a broad set of system interfaces.

Designed for embedded and consumer markets, this device targets applications that require SOC‑level integration, rich display/camera support and robust wired connectivity while offering hardware security primitives for system protection.

Key Features

  • Core and CPU Performance ARM® Cortex®‑A53 architecture, 2 cores, 64‑bit operation at up to 1.8 GHz for application processing and general compute tasks.
  • Co‑Processors and DSP On‑chip co‑processor support including ARM® Cortex®‑M7, NEON™ MPE and Hi‑Fi4 DSP for real‑time control, multimedia acceleration and audio processing.
  • Memory Interfaces Integrated controllers for DDR4 and LPDDR4 memory to support high bandwidth system memory configurations.
  • Display and Camera Interfaces Display and imaging interfaces include HTML, LVDS, MIPI‑CSI and MIPI‑DSI for flexible connection to displays and camera sensors.
  • Connectivity Dual GbE ports, dual USB 2.0 with PHY, dual USB 3.0 with PHY and CAN support provide a wide connectivity footprint for networking and peripheral I/O.
  • Security Hardware security features include ARM TrustZone (TZ), CAAM and Resource Domain Controller (RDC) to help isolate and protect sensitive workloads.
  • Multimedia and Graphics Graphics acceleration and multimedia offload support enable advanced user interfaces and video processing workflows.
  • Package and Thermal 548‑LFBGA surface‑mount package (15×15 mm) with an operating temperature range of 0 °C to 95 °C for consumer applications.
  • Qualification and Compliance Consumer qualification and RoHS compliance for deployment in consumer and embedded products.

Typical Applications

  • Smart Home Local servers, alarm hubs, security systems and smart appliances that benefit from integrated multimedia, camera and connectivity features.
  • Smart City and Surveillance Edge devices for safety, security and surveillance where camera interfaces and network connectivity are required.
  • Industrial IoT Machine vision, HMI and gateway applications that need DSP/media acceleration, multiple network interfaces and secure domains.
  • Smart Retail and POS Point‑of‑sale and digital signage solutions leveraging display interfaces, multimedia capabilities and wired networking.

Unique Advantages

  • High‑performance dual‑core processing: 1.8 GHz ARM Cortex‑A53 dual cores provide responsive application performance for embedded and consumer workloads.
  • Integrated multimedia and DSP support: NEON MPE and Hi‑Fi4 DSP plus M‑class co‑processor options accelerate audio, vision and real‑time processing while reducing external BOM.
  • Comprehensive connectivity suite: Dual GbE, USB 2.0/3.0 with PHYs and CAN deliver flexible wired interfaces for networking and peripheral integration.
  • Hardware security building blocks: ARM TrustZone, CAAM and RDC enable partitioning and cryptographic services to strengthen system security.
  • Compact production package: 548‑LFBGA (15×15) surface‑mount package supports compact board layouts for space‑constrained designs.
  • Ready for consumer deployments: Consumer qualification and RoHS compliance align the part for consumer and embedded product roadmaps.

Why Choose MIMX8ML3DVNLZAB?

MIMX8ML3DVNLZAB positions a balanced combination of dual‑core ARM Cortex‑A53 compute, multimedia/DSP co‑processing and a broad set of memory and I/O interfaces in a compact LFBGA package—making it well suited for embedded designs that require application processing, imaging/display connectivity and robust wired networking.

This device is appropriate for teams developing consumer and embedded products that need integrated security primitives, high‑speed memory support and multiple peripheral interfaces, offering a scalable platform with supplier datasheet support and RoHS compliance for production deployment.

Request a quote or submit an inquiry for availability, pricing and lead time for MIMX8ML3DVNLZAB to evaluate it for your next embedded design.

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